DLA SMD-5962-84067 REV E-2011 MICROCIRCUIT DIGITAL CMOS OCTAL LATCHING BUS DRIVER MONOLITHIC SILICON.pdf
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1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED B Convert to military drawing format. Add device type 02. Changes to 1.3 and 1.4. Changes to table I and II. Changes to figures 1, 2, 3, and 4. Editorial changes throughout. 87-05-21 N. A. Hauck C Update boilerplate to MIL-PRF-38535 requirements. -
2、 CFS 01-11-16 Thomas M. Hess D Made change to paragraph 3.5. Update boilerplate to MIL-PRF-38535 requirements. LTG 05-03-18 Thomas M. Hess E Update boilerplate to the current MIL-PRF-38535 requirements. jak 11-07-11 Thomas M. Hess Current CAGE Code is 67268 REV SHET REV SHET REV STATUS REV E E E E E
3、 E E E E E E E E OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 PMIC N/A PREPARED BY David A. Williams DLA LAND AND MARITIME STANDARD MICROCIRCUIT DRAWING CHECKED BY D. A. DiCenzo COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY N. A. H
4、auck MICROCIRCUIT, DIGITAL, CMOS, OCTAL AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 84-12-20 LATCHING BUS DRIVER, MONOLITHIC SILICONAMSC N/A REVISION LEVEL E SIZE A CAGE CODE 14933 84067 SHEET 1 OF 13 DSCC FORM 2233 APR 97 5962-E379-11 .Provided by IHSNot for ResaleNo reproductio
5、n or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84067 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class lev
6、el B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 84067 01 R X Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) ide
7、ntify the circuit function as follows: Device type Generic number Circuit function 01 82C82 Octal latching bus driver 02 82C83H Octal latching inverting bus driver 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Termi
8、nals Package style R GDIP1-T20 or CDIP2-T20 20 Dual-in-line2 CQCC1-N20 20 Square leadless chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. 1/ 2/ 3/ Supply voltage range (VCC) . -0.5 V dc to +8.0 V dc DC input voltage range (V
9、IN) . -0.5 V dc to VCC+ 0.5 V dc DC output voltage range (VOUT) -0.5 V dc to VCC+ 0.5 V dc Storage temperature range (TSTG) -65C to +150C Maximum power dissipation (PD) 1 W Lead temperature (soldering, 10 seconds) . +275C Thermal resistance, junction-to-case (JC) See MIL-STD-1835 Junction temperatur
10、e (TJ) . +150C 1.4 Recommended operating conditions. 2/ 3/ Supply voltage range (VCC) . +4.5 V dc to +5.5 V dc Case operating temperature range (TC) -55C to +125C Output disable time (tEHOZ) Device type 01 35 ns maximum 4/ (see figure 4, reference 3) Device type 02 22 ns maximum 4/ (see figure 4, re
11、ference 3) Input rise or fall time (trand tf) . 20 ns maximum 4/ (see figure 4, reference 8) _ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Unless otherwise specifie
12、d, all voltages are referenced to ground. 3/ The limits for the parameters specified herein shall apply over the full specified VCCrange and case temperature range of -55C to +125C. 4/ Not tested, but characterized at initial device design and after major process or design changes affecting this par
13、ameter. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84067 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, st
14、andards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Int
15、egrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. M
16、IL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict
17、 between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requir
18、ements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional ce
19、rtification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein
20、. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and ph
21、ysical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figur
22、e 1. 3.2.3 Truth tables. The truth tables shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. 3.2.5 Switching waveforms and test circuit. The switching waveforms and test circuit shall be as specified on figure 4. Provided by IHSNot for Resale
23、No reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84067 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 4 DSCC FORM 2234 APR 97 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical
24、 performance characteristics are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3
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