DLA SMD-5962-84066 REV G-2006 MICROCIRCUIT DIGITAL CMOS PROGRAMMABLE PERIPHERAL INTERFACE MONOLITHIC SILICON《硅单片可编程序外围接口 氧化物半导体数字微型电路》.pdf
《DLA SMD-5962-84066 REV G-2006 MICROCIRCUIT DIGITAL CMOS PROGRAMMABLE PERIPHERAL INTERFACE MONOLITHIC SILICON《硅单片可编程序外围接口 氧化物半导体数字微型电路》.pdf》由会员分享,可在线阅读,更多相关《DLA SMD-5962-84066 REV G-2006 MICROCIRCUIT DIGITAL CMOS PROGRAMMABLE PERIPHERAL INTERFACE MONOLITHIC SILICON《硅单片可编程序外围接口 氧化物半导体数字微型电路》.pdf(19页珍藏版)》请在麦多课文档分享上搜索。
1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED B Changes to recommended operating conditions, table I, and table II. Convert to military drawing format. Editorial changes throughout. Add device type 02. Add vendor CAGE 34649. 87-02-27 N. A. Hauck C Changes in accordance with NOR 5962-R053-93. 9
2、2-12-18 Monica L. Poelking D Changes in accordance with NOR 5962-R077-95. 95-04-19 Monica L. Poelking E Update boilerplate to MIL-PRF-38535 requirements. Correct drawing title to indicate device function. - CFS 03-08-05 Thomas M. Hess F Correct marking requirements in 3.5. Update boilerplate in acco
3、rdance with MIL-PRF-38535 requirements. - PHN. 05-03-17 Thomas M. Hess G Change IBHH and IBHL maximum limits in table I from -400 uA and 400 uA, respectively, to -450 uA and 450 uA, respectively, at -55C. - CFS. 06-11-06 Thomas M. Hess REV SHET REV E E E E SHEET 15 16 17 18 REV STATUS REV G E F F G
4、E E E E E E E E E OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Greg A. Pitz STANDARD MICROCIRCUIT DRAWING CHECKED BY D. A. DiCenzo DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY
5、 N. A. Hauck AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 84-12-03 MICROCIRCUIT, DIGITAL, CMOS, PROGRAMMABLE PERIPHERAL INTERFACE, MONOLITHIC SILICON SIZE A CAGE CODE 67268 84066 AMSC N/A REVISION LEVEL G SHEET 1 OF 18 DSCC FORM 2233 APR 97 5962-E034-07 Provided by IHSNot for Resa
6、leNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84066 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 com
7、pliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 84066 01 Q A Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s
8、). The device type(s) identify the circuit function as follows: Device type Generic number Frequency Circuit function 01 82C55A-5/B 5.0 MHz Programmable peripheral interface 02 82C55A/B 8.0 MHz Programmable peripheral interface 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-
9、1835 and as follows: Outline letter Descriptive designator Terminals Package style Q GDIP1-T40 or CDIP2-T40 40 Dual-in-line X CQCC1-N44 44 Square leadless chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage range
10、(VCC) (Referenced to ground). +8.0 V dc maximum Input, output, or I/O applied voltage range . GND - 0.5 V dc to VCC+ 0.5 V dc Storage temperature range -65C to +150C Maximum power dissipation (PD) 1/. 1.0 W Lead temperature (soldering, 10 seconds). +260C Maximum junction temperature (TJ) . +150C The
11、rmal resistance, junction-to-case (JC): Case Q . See MIL-STD-1835 Case X See MIL-STD-1835 1.4 Recommended operating conditions. Supply voltage range (VCC) +4.5 V dc to +5.5 V dc Case operating temperature range (TC) . -55C to +125C Frequency of operation: Device type 01 0 to 5.0 MHz Device type 02 0
12、 to 8.0 MHz Operating supply current (ICCOP). 10 mA maximum 2/ Data float after READ (tDF) (5) 3/. 10 ns minimum to 75 ns maximum ACK = 1 to output float (tKD) (23) 3/. 20 ns minimum to 250 ns maximum _ 1/ Must withstand the added PDdue to short circuit test e.g., IOS. 2/ ICCOP= 1 mA/MHz of peripher
13、al read/write cycle time (ie: 1.0 s I/O read/write cycle time = 1 mA). 3/ See waveforms on figure 3 and test condition 2 on figure 3. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84066 DEFENSE SUPPLY CENTER COL
14、UMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified,
15、 the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interfac
16、e Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil
17、or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, h
18、owever, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to
19、this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying ac
20、tivity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described he
21、rein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1
22、 Case outline(s). The case outline(s) shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Block diagram. The block diagram shall be as specified on figure 2. 3.2.4 Switching waveforms and test circuits. The switching
23、 waveforms and test circuits shall be as specified on figure 3. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full case operating temperature range. Provided by IHSNot for
24、 ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84066 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 4 DSCC FORM 2234 APR 97 3.4 Electrical test requirements. The electrical test requirements shall be t
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