DLA SMD-5962-84012 REV G-2005 MICROCIRCUIT DIGITAL BIPOLAR ADVANCED LOW-POWER SCHOTTKY TTL TRANSPARENT LATCHES MONOLITHIC SILICON《硅单片透明锁存器 TTL肖脱基高级小功率双极数字微型电路》.pdf
《DLA SMD-5962-84012 REV G-2005 MICROCIRCUIT DIGITAL BIPOLAR ADVANCED LOW-POWER SCHOTTKY TTL TRANSPARENT LATCHES MONOLITHIC SILICON《硅单片透明锁存器 TTL肖脱基高级小功率双极数字微型电路》.pdf》由会员分享,可在线阅读,更多相关《DLA SMD-5962-84012 REV G-2005 MICROCIRCUIT DIGITAL BIPOLAR ADVANCED LOW-POWER SCHOTTKY TTL TRANSPARENT LATCHES MONOLITHIC SILICON《硅单片透明锁存器 TTL肖脱基高级小功率双极数字微型电路》.pdf(13页珍藏版)》请在麦多课文档分享上搜索。
1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add vendor, FSCM 04713. Change supply current. Editorial changes throughout. 85-04-24 N. A. HAUCK B Add vendor, FSCM 27014. Editorial changes. 86-02-27 N. A. HAUCK C Change VIL, setup times, hold times input pulse width, and propagation delay tim
2、es. Delete minimum limits from IILand propagation delay times. Convert to military drawing format. Device type 01, case R inactive for new design. 87-05-29 N. A. HAUCK D Changes input voltage range. Changes to recommended operating conditions. Changes to table I. Change to vendor similar part number
3、. Change drawing code identification number to 67268. 87-09-01 N. A. HAUCK E Changes in accordance with NOR 5962-R112-96. - tvn 96-04-17 M. A. FRYE F Update to reflect latest changes in format and requirements. Editorial changes throughout. Reactivate device type 01, case R for new design. - les 02-
4、08-19 R. MONNIN G Make change to the Marking paragraph 3.5. - ro 05-07-19 R. MONNIN CURRENT CAGE CODE 67268 THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED. REV SHET REV SHET REV STATUS REV G G G G G G G G G G G G OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 PMIC N/A PREPARED BY GREG A. PITZ
5、 DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY D. A. DiCENZO COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY N. A. HAUCK AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 84-05-04 MICROCIRCUIT,
6、DIGITAL, BIPOLAR, ADVANCED LOW-POWER SCHOTTKY TTL, TRANSPARENT LATCHES, MONOLITHIC SILICON AMSC N/A REVISION LEVEL G SIZE A CAGE CODE 14933 84012 SHEET 1 OF 12 DSCC FORM 2233 APR 97 5962-E639-05 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDAR
7、D MICROCIRCUIT DRAWING SIZE A 84012 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535,
8、appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 84012 01 R X Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Ge
9、neric number Circuit function 01 54ALS573 Octal D-type transparent latch with three state outputs 02 54ALS580 Octal D-type transparent latch with inverted three state outputs 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive desig
10、nator Terminals Package style R GDIP1-T20 or CDIP2-T20 20 Dual-in-line S GDFP2-F20 or CDFP3-F20 20 Flat pack 2 CQCC1-N20 20 Square leadless chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage . -0.5 V dc to +7.0 V
11、 dc Input voltage range -1.2 V dc at -18 mA to +7.0 V dc Storage temperature range -65C to +150C Maximum power dissipation (PD) 1/: Device types 01 and 02 . 148.5 mW Lead temperature (soldering, 10 seconds) +300C Thermal resistance, junction-to-case (JC): Cases R and S See MIL-STD-1835 Case 2 . 80C/
12、W Junction temperature (TJ) 175C _ 1/ Maximum power dissipation is defined as VCCx ICC, and must withstand the added PDdue to short-circuit test; e.g., IO. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84012 DEF
13、ENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 3 DSCC FORM 2234 APR 97 1.4 Recommended operating conditions. Supply voltage range (VCC) +4.5 V dc minimum to +5.5 V dc maximum Minimum high level input voltage (VIH) 2.0 V dc Maximum low level input voltage (VIL) . 0.7 V d
14、c Case operating temperature range (TC) . -55C to +125C Input setup time t(setup): Device type 01 . 10 ns minimum Device type 02 . 20 ns minimum Input hold time t(hold): Device type 01 . 7 ns minimum Device type 02 . 12 ns minimum Input pulse width (tp): Device type 01 . 25 ns minimum Device type 02
15、 . 15 ns minimum 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicita
16、tion or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF D
17、EFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins A
18、venue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a sp
19、ecific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer List
20、ing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flo
21、w as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL
22、-PRF-38535 is required to identify when the QML flow option is used. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84012 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 4 DSCC FOR
23、M 2234 APR 97 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal
24、connections shall be as specified on figure 1. 3.2.3 Truth tables. The truth tables shall be as specified on figure 2. 3.2.4 Logic diagrams. The logic diagrams shall be as specified on figure 3. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance
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