DLA SMD-5962-83017 REV G-2005 MICROCIRCUIT DIGITAL LOW POWER SCHOTTKY TTL DECODER DEMULTIPLEXER MONOLITHIC SILICON《硅单片解码器 信息分离器 TTL肖脱基小功率数字微型电路》.pdf

《DLA SMD-5962-83017 REV G-2005 MICROCIRCUIT DIGITAL LOW POWER SCHOTTKY TTL DECODER DEMULTIPLEXER MONOLITHIC SILICON《硅单片解码器 信息分离器 TTL肖脱基小功率数字微型电路》.pdf》由会员分享，可在线阅读，更多相关《DLA SMD-5962-83017 REV G-2005 MICROCIRCUIT DIGITAL LOW POWER SCHOTTKY TTL DECODER DEMULTIPLEXER MONOLITHIC SILICON《硅单片解码器 信息分离器 TTL肖脱基小功率数字微型电路》.pdf（12页珍藏版）》请在麦多课文档分享上搜索。

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED C Convert to Military Drawing format. 86-04-11 N. A. Hauck D Delete vendor CAGE 18324. 87-03-17 N. A. Hauck E Add vendor CAGE 18324 for 8301701JX. Delete vendor CAGE 27014 from 83017KX. Change drawing CAGE no. to 67268. Editorial Changes throughout

2、. 87-08-31 N. A. Hauck F Changes in accordance with NOR 5962-R127-92. 92-02-05 Monica L. Poelking G Update to reflect latest changes in format and requirements. Editorial changes throughout. les 05-07-06 Raymond Monnin THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED. REV SHET REV SHET REV

3、STATUS REV G G G G G G G G G G G OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 PMIC N/A PREPARED BY David W. Queenan DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY D. A. DiCenzo COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS A

4、PPROVED BY N. A. Hauck MICROCIRCUIT, DIGITAL, LOW POWER, SCHOTTKY, TTL, DECODER/DEMULTIPLEXER, AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 84-01-16 MONOLITHIC SILICON AMSC N/A REVISION LEVEL G SIZE A CAGE CODE 67268 83017 SHEET 1 OF 11 DSCC FORM 2233 APR 97 5962-E634-05 Provided

5、by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 83017 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements f

6、or MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 83017 01 J X Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1

7、.2.1 Device type. The device type identify the circuit function as follows: Device type Generic number Circuit function 01 54LS154 4-line to 16-line decoder/demultiplexer 1.2.2 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Te

8、rminals Package style J GDIP1-T24 or CDIP2-T24 24 dual-in-line K GDFP2-F24 or CDFP3-F24 24 flat 3 CQCC1-N28 28 square chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage range. -0.5 V dc to +7.0 V dc Input voltage

9、 range -1.5 V dc at -18 mA to +5.5 V dc Storage temperature range -65C to +150C Maximum power dissipation (PD) 1/ 77 mW Lead temperature (soldering, 10 seconds) . +300C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Junction temperature (TJ) +175C 1.4 Recommended operating conditions.

10、Supply voltage (VCC) . 4.5 V dc minimum to +5.5 V dc maximum Minimum high level input voltage (VIH) . 2.0 V dc Maximum low level input voltage (VIL) 0.7 V dc Case operating temperature range (TC) . -55C to +125C _ 1/ Maximum power dissipation is defined as VCCx ICC, and must withstand the added PDdu

11、e to short-circuit test; e.g., IOS. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 83017 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUM

12、ENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFE

13、NSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List

14、 of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA

15、 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained.

16、3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified ma

17、nufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Manag

18、ement (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify w

19、hen the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connect

20、ions. The terminal connections shall be as specified on figure 1. 3.2.3 Truth tables. The truth tables shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. Provided by IHSNot for ResaleNo reproduction or networking permitted without license fro

21、m IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 83017 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 4 DSCC FORM 2234 APR 97 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in t

22、able I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MI

23、L-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The com

24、pliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source o

25、f supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance.

26、A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review. DSC

27、C, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. Provided by IHSNot for ResaleNo reproduction or networking permitted without

28、license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 83017 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TC +125C unless otherwise specified Group A subgroupsDe

29、vice type Limits Unit Min MaxHigh level output voltage VOHVCC= 4.5 V, IOH= -0.4 mA 1, 2, 3 All 2.5 V Low level output voltage VOLVCC= 4.5 V, IOL= 4.0 mA, 1, 2, 3 All 0.4 V Input clamp voltage VICVCC= 4.5 V, TC= +25C, IIN= -18 mA 1 All -1.5 V Low level input current IILVCC= 5.5 V, VIN= 0.4 V 1, 2, 3

30、All -400 A High level input current IIH1VCC= 5.5 V, VIN= 2.7 V, 1, 2, 3 All 20 A Input current at max input voltage IIH2VCC= 5.5 V, VIN= 7.0 V, 100 High level input voltage VIH1, 2, 3 All 2.0 V Low level input voltage VIL1, 2, 3 All 0.7 V High level output current 1/ IOH1, 2, 3 All -400 A Low level

31、output current 1/ IOL1, 2, 3 All 4 mA Short circuit output current, IOSVCC= 5.5 V, VOUT= GND 2/ 1, 2, 3 All -15 -100 mA Supply current, ICCVCC= 5.5 V, VIN= GND 3/ 1, 2, 3 All 14 mA See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license fro

32、m IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 83017 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics Continued. Test Symbol Conditions -55C TC +125C unless otherwise specified Group A subgroupsDev

33、ice type Limits Unit Min MaxPropagation delay time, tPLH1 VCC= 5.0 V, 9, 10, 11 All 53 ns low to high level output from A, B, C, or D inputs through 3 levels of logic CL= 50 pF 10%, RL= 2 k 5% Propagation delay time, tPHL1 9, 10, 11 All 50 ns high to low level output from A, B, C, or D inputs throug

34、h 3 levels of logic Propagation delay time, tPLH2 9, 10, 11 All 46 ns low to high level output from either strobe input Propagation delay time, tPHL2 9, 10, 11 All 50 ns high to low level output from either strobe input 1/ Test not required if applied as a forcing function for VOHand VOL. 2/ Not mor

35、e than one output should be shorted at one time, and the duration of the short-circuit should not exceed one second. 3/ ICCis measured with all inputs grounded and all outputs open. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUI

36、T DRAWING SIZE A 83017 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 7 DSCC FORM 2234 APR 97 Device types 01 01 Case outlines J, K 3 Terminal number Terminal symbols 1 0 NC 2 1 0 3 2 1 4 3 2 5 4 3 6 5 4 7 6 5 8 7 NC 9 8 6 10 9 7 11 10 8 12 GND 9 13 11 10 14 12 GND 1

37、5 13 NC 16 14 11 17 15 12 18 G113 19 G214 20 D 15 21 C G122 B NC 23 A G224 VCCD 25 - - - C 26 - - - B 27 - - - A 28 - - - VCCFIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 83017 DE

38、FENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 8 DSCC FORM 2234 APR 97 Inputs Outputs G1G2D C B A 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 L L L L L L L H H H H H H H H H H H H H H H L L L L L H H L H H H H H H H H H H H H H H L L L L H L H H L H H H H H H H H H H H H H L

39、 L L L H H H H H L H H H H H H H H H H H H L L L H L L H H H H L H H H H H H H H H H H L L L H L H H H H H H L H H H H H H H H H H L L L H H L H H H H H H L H H H H H H H H H L L L H H H H H H H H H H L H H H H H H H H L L H L L L H H H H H H H H L H H H H H H H L L H L L H H H H H H H H H H L H H H

40、 H H H L L H L H L H H H H H H H H H H L H H H H H L L H L H H H H H H H H H H H H H L H H H H L L H H L L H H H H H H H H H H H H L H H H L L H H L H H H H H H H H H H H H H H L H H L L H H H L H H H H H H H H H H H H H H L H L L H H H H H H H H H H H H H H H H H H H L L H X X X X H H H H H H H H H

41、 H H H H H H H H L X X X X H H H H H H H H H H H H H H H H H H X X X X H H H H H H H H H H H H H H H H H = High level L = Low level X = Dont care FIGURE 2. Truth tables. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SI

42、ZE A 83017 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 9 DSCC FORM 2234 APR 97 FIGURE 3. Logic diagram. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 83017 DEFENSE SUPPLY CENT

43、ER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 10 DSCC FORM 2234 APR 97 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883

44、, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level contro

45、l and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final ele

46、ctrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. TABLE II. Electrical test requirements. MIL-STD-883 test requirements Subgroups (in accordance with MIL-STD-883, method 500

47、5, table I) Interim electrical parameters (method 5004) - - - Final electrical test parameters (method 5004) 1*, 2, 3, 9 Group A test requirements (method 5005) 1, 2, 3, 7, 9 Groups C and D end-point electrical parameters (method 5005) 1, 2, 3 Additional electrical subgroups for group C periodic ins

48、pections 10*, 11* * PDA applies to subgroup 1. * Subgroups 10 and 11, if not tested, shall be guaranteed to the specified limits in table I. 4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD-883 including groups A, B, C, and D inspections. The following additional criteria shall apply. 4.3.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 4, 5, 6, and 8 in table I, method 5005 of MIL-STD-883 shall be omitted. c. Subgroup 7 shall include verific