DLA SMD-5962-82036 REV F-2012 MICROCIRCUIT LINEAR LOW OFFSET OPERATIONAL AMPLIFIERS MONOLITHIC SILICON.pdf

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1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Delete case outline “Z”. Page 4: Table I change VCM. Guaranteed typical values for IOS(+)and IOS(-). Editorial changes throughout. Add one vendor, FSCM 34371. 86-02-06 N. A. HAUCK B Change to military drawing format. Add case outline 2. Inactivat

2、e G and P case outlines for device types 01 and 02 for new design. Delete vendor CAGE 34371. Editorial changes throughout. 87-07-24 M. A. FRYE C Add three vendors, CAGE 07933, CAGE 64155, and CAGE 54186. Make changes to paragraphs 1.2.2, 4.2, and 4.3. Make changes to table I, table II, and figure 1.

3、 Editorial changes throughout. 89-01-24 M. A. FRYE D TABLE I. Input bias current test, +IIB, group A subgroups 2 and 3, device type 01, delete -3 nA min and 3 nA max and substitute -4 nA min and 4 nA max. TABLE I. Output short circuit current test. IOS(+), group A subgroups 1 and 2, device types 01

4、and 02, delete -60 mA min and substitute -65 mA min. Group A subgroup 3, device types 01 and 02, delete -60 mA min and substitute -70 mA min. IOS(-), group A subgroups 1 and 2, device types 01 and 02, delete 50 mA max and substitute 65 mA max. Group A subgroup 3, device types 01 and 02, delete 50 mA

5、 max and substitute 70 mA max. 6.4. Approved source of supply. Under military drawing part number 8203602GX, add vendor CAGE number 27014 for vendor similar part number OP07H/883. Under military drawing part number 82036012X, delete vendor CAGE number 54186 for vendor similar part number MPOP07AL/88

6、3. Changes in accordance with NOR 5962-R062-93. 93-07-13 M. A. FRYE E Make correction to marking paragraph 3.5. Drawing updated to reflect current requirements. Redrawn. -rrp 06-03-01 R. MONNIN F Make correction to Table I by adding footnote 1/ to +IIBand IIBtests for subgroup 1 only. Update boilerp

7、late paragraphs to current MIL-PRF-38535 requirements. - ro 12-01-25 C. SAFFLE CURRENT CAGE CODE 67268 THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED. REV SHEET REV SHEET REV STATUS REV F F F F F F F F F F OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 PMIC N/A PREPARED BY WILLIAM E. SHOUP DLA LAN

8、D AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.landandmaritime.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY C. ROBERT JACKSON APPROVED BY N. A. HAUCK MICROCIRCUIT, LINEAR, LOW OFFSET OPERATIONAL AM

9、PLIFIERS, MONOLITHIC SILICON DRAWING APPROVAL DATE 83-04-15 AMSC N/A REVISION LEVEL F SIZE A CAGE CODE 14933 82036 SHEET 1 OF 10 DSCC FORM 2233 APR 97 5962-E144-12 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 8

10、2036 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Numb

11、er (PIN). The complete PIN is as shown in the following example: 82036 01 G A Drawing number Device type (see 1.2.1) Case outline (see 1.2.2) Lead finish (see 1.2.3) 1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 OP-0

12、7A Operational amplifier, ultra low offset 02 OP-07 Operational amplifier, low offset 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style G MACY1-X8 8 Can P GDIP1-T8 or CDIP2-T8 8 Dual-in-line 2 CQ

13、CC1-N20 20 Square leadless chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage (VCC) . 22 V dc Input voltage range (VIN) . VCCDifferential input voltage range 30 V dc Output short circuit duration 1/ Lead temperat

14、ure (soldering, 60 seconds) +300C Storage temperature range . -65C to +150C Thermal resistance, junction-to-case (JC) See MIL-STD-1835 Thermal resistance, junction-to-ambient (JA): Cases P and 2 120C/W Case G . 150C/W Maximum power dissipation (PD): 2/ Case G . 330 mW at TA= +125C Cases P and 2 400

15、mW at TA= +125C _ 1/ Output may be shorted to ground indefinitely at VS= 15 V, TA= +25C. Temperature and supply voltages must be limited to ensure dissipation rating is not exceeded. 2/ Must withstand the added PDdue to short circuit test, e.g., IOS. Provided by IHSNot for ResaleNo reproduction or n

16、etworking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 82036 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 3 DSCC FORM 2234 APR 97 1.4 Recommended operating conditions. Supply voltage range (VCC) . 5.0 V dc to 20.0 V dc Ambient operating temper

17、ature range (TA) -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited i

18、n the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. D

19、EPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Buildin

20、g 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exempti

21、on has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) cert

22、ified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documente

23、d in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is

24、required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein.

25、3.2.2 Terminal connections and logic diagrams. The terminal connections and logic diagrams shall be as specified on figure 1. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the

26、 full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. Provided by IHSNot for ResaleNo reproduction or networking permitted without li

27、cense from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 82036 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 4 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TA +125C VCC= 15 V, unnulled, VCM= 0 Group A subgroups Device type

28、 Limits Unit unless otherwise specified Min Max Input offset voltage VIO1/ 2/ 1 01 -25 25 V 2/ 2, 3 -60 60 1/ 2/ 1 02 -75 75 2/ 2, 3 -200 200 Input offset voltage temperature sensitivity dVIO/ 3/ 2, 3 01 -0.6 0.6 V/C dT 02 -1.3 1.3 Input bias current +IIB1/ 1 01 -2 2 nA 2, 3 -4 4 1/ 1 02 -3 3 2, 3 -

29、6 6 -IIB1/ 1 01 -2 2 2, 3 -4 4 1/ 1 02 -3 3 2, 3 -6 6 Input offset current +IIO1 01 -2 2 nA 2, 3 -4 4 1 02 -2.8 2.8 2, 3 -5.6 5.6 Power supply rejection ratio +PSRR VCC+ = 20 V to 5 V, 1 01, 02 10 V/V VCC- = -15 V 2, 3 20 -PSRR VCC+ = 15 V, 1 10 VCC- = -20 V to -5 V 2, 3 20 Common mode rejection rat

30、io CMRR VCM= 10 V 1 01, 02 110 dB VCM= 13 V 2, 3 106 Output short circuit current IOS(+)t 25 ms 4/ 1, 2 01, 02 -65 mA 3 -70 IOS(-)1, 2 65 3 70 Supply current ICC1 01, 02 4 mA 2, 3 5 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license fr

31、om IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 82036 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions -55C TA +125C VCC= 15 V, unnulled, VCM= 0 Group A subgroups Device

32、type Limits Unit unless otherwise specified Min Max Output voltage swing VOPRL= 1 k 4, 5, 6 01, 02 -10 10 V (minimum) RL= 2000 -12 12 Open loop voltage gain AVSTA= +25C 5/ 4 01 300 V/mV (single ended) 5/ 5, 6 200 TA= +25C 5/ 4 02 200 5/ 5, 6 150 1/ Users are cautioned to use the group C end-point li

33、mits for design purposes due to drift experienced with this parameter during steady-life test (see table III). 2/ Testing will occur at least 250 ms after application of power. 3/ Shall be guaranteed if not tested, to the specified parameters. 4/ Continuous short circuit limits are considerably less

34、 than the indicated test limits since maximum power dissipation cannot be exceeded. 5/ VOUT= 0 V to +10 V for AVS(+) and VOUT= 0 to -10 for AVS(-). RL= 2000 . 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In ad

35、dition, the manufacturers PIN may also be marked. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordan

36、ce with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DLA

37、Land and Maritime -VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A sh

38、all be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DLA Land and Maritime -VA shall be required for any change that affects this drawing. 3.9 Verification and review. DLA Land and Maritime, DLA Land and Maritimes agent, and

39、the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,

40、-STANDARD MICROCIRCUIT DRAWING SIZE A 82036 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 6 DSCC FORM 2234 APR 97 NC = No connection. FIGURE 1. Terminal connections and logic diagrams. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from

41、IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 82036 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 7 DSCC FORM 2234 APR 97 NC = No connection. FIGURE 1. Terminal connections and logic diagrams - Continued. Provided by IHSNot for ResaleNo reproduction or networking permitted wi

42、thout license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 82036 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 8 DSCC FORM 2234 APR 97 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A.

43、4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circu

44、it shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified

45、in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. 4.3 Quality conformance inspection. Quality

46、conformance inspection shall be in accordance with method 5005 of MIL-STD-883 including groups A, B, C, and D inspections. The following additional criteria shall apply. 4.3.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 7, 8, 9, 10, and 11 in table I, method 5

47、005 of MIL-STD-883 shall be omitted. 4.3.2 Groups C and D inspections. a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life test conditions, method 1005 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufact

48、urer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. (2) TA= +125C, minimum. (3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRC