DLA SMD-5962-82008 REV L-2010 MICROCIRCUIT MEMORY DIGITAL SCHOTTKY BIPOLAR 32K PROGRAMMABLE READ ONLY MEMORY (PROM) MONOLITHIC SILICON.pdf
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1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED F Change to vendor similar part number for vendor CAGE 18324. Changes to table I parameters tEAand COUT. Add vendor CAGE 18324 to device types 03 and 04 as a source of supply. Add new device design for device 04 for vendor CAGE 07933. Removed table
2、 III, figure 5, and programming procedures. Editorial changes throughout. 91-10-30 M. A. Frye G Changes in accordance with NOR 5962-R010-93 93-02-12 M. A. Frye H Changes in accordance with NOR 5962-R205-93 93-08-10 M. A. Frye J Updated boilerplate. Sheet 4, change VOHconditions from IOH= -2.0 mA to
3、-1.6 mA; change CINmax. limit from 10 pF to 15 pF; change COUTmax. limit for devices 01, 02, and 04 from 13 pF to 20 pF; add footnote 3 to tDAtest column. Removed logic diagrams. Remove vendors CAGE 50364 and 34335 as suppliers, and removed their associated switching time test circuits. 97-05-29 Ray
4、mond Monnin K Boilerplate update, part of 5 year review. ksr 05-06-30 Raymond Monnin L Boilerplate update, part of 5 year review. ksr 10-11-10 Charles F. Saffle CURRENT CAGE CODE 67268 THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED REV SHET REV SHET REV STATUS REV L L L L L L L L L L L L
5、 L OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 PMIC N/A PREPARED BY Darrell Hill DLA LAND AND MARITIME STANDARD MICROCIRCUIT DRAWING CHECKED BY C. R. Jackson COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY N. A. Hauck MICROCIRCUIT,
6、MEMORY, DIGITAL, SCHOTTKY BIPOLAR 32K PROGRAMMABLE READ ONLY MEMORY (PROM), MONOLITHIC SILICON AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 82-09-01 AMSC N/A REVISION LEVEL L SIZE A CAGE CODE 14933 82008 SHEET 1 OF 13 DSCC FORM 2233 APR 97 5962-E069-11 Provided by IHSNot for Resal
7、eNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 82008 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL L SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, no
8、n-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 82008 01 J A Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The dev
9、ice type(s) identify the circuit function as follows: Device type Generic number 1/ Circuit function Access time 01 4096 words x 8 bits per word PROM, T.S. 95 ns 02 4096 words x 8 bits per word PROM, T.S. 55 ns 03 4096 words x 8 bits per word PROM, T.S. 45 ns 04 4096 words x 8 bits per word PROM, T.
10、S. 70 ns 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style J GDIP1-T24 or CDIP2-T24 24 dual-in-line package K GDFP2-F24 or CDFP3-F24 24 flat package L GDIP3-T24 or CDIP4-T24 24 dual-in-line packa
11、ge X CQCC1-N32 32 rectangular leadless chip carrier 3 CQCC1-N28 28 square leadless chip carrier Y CDFP4-F24 24 flat package 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage (VCC) -0.3 to +7.0 V dc Input voltage range +5.5 V
12、 dc Storage temperature range . -65C to +150C Lead temperature (soldering, 10 seconds) +300C Thermal resistance, junction-to-case (JC) See MIL-STD-1835 2/ Output voltage applied . -0.3 V dc to VCCOutput sink current . 100 mA Maximum power dissipation (PD) 3/ 1.04 W dc Maximum junction temperature (T
13、J) . +175C 1.4 Recommended operating conditions. Supply voltage range (VCC) 4.5 V dc to 5.5 V dc Minimum high level input voltage (VIH) 2.0 V dc Maximum low level input voltage (VIL) . 0.8 V dc Normalized fanout (each output) . 12 mA Case operating temperature range (TC) -55C to +125C 1/ Generic num
14、bers are listed on the Standardized Military Drawing Source Approval Bulletin at the end of this document and will also be listed in MIL-HDBK-103. 2/ Heat sinking is recommended to reduce the junction temperature. 3/ Must withstand the added PDdue to short circuit test (e.g., IOS). Provided by IHSNo
15、t for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 82008 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL L SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. T
16、he following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufac
17、turing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Mi
18、crocircuit Drawings. (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this
19、 drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accord
20、ance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38
21、535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications sha
22、ll not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The de
23、sign, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table(s)
24、. The truth table(s) shall be as specified on figure 2. 3.2.3.1 Unprogrammed devices. The truth table for unprogrammed devices for contracts involving no altered item drawing shall be as specified on figure 2. When required in groups A or C (see 4.3), the devices shall be programmed by the manufactu
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