DLA SMD-5962-81028 REV M-2011 MICROCIRCUIT HYBRID LINEAR DUAL AND QUAD CHANNEL OPTICAL COUPLER.pdf

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1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add Vendor; FSCM 31757. Complete revision. 83-08-05 W. E. ShoupB Change to Standard Military Drawing format. Change CAGE code to 67268. Delete vendor CAGE 31757. Editorial changes throughout.88-11-23 M. A. Frye C Page 5, table I: Change test cond

2、itions and limits for CMHand CML. Add symbol for “Current transfer ratio“. Editorial changes throughout.89-03-29 D. R. Cool D Add vendor CAGE 31757. Add device types 02 and 03, and case outlines “P“ and “2“. Page 2, 1.3: Change power dissipation and footnote. Pages 4 and 5, table I: Change test cond

3、ition for ICCHand ICCL, and for CMHand CML, and add footnote 7. Editorial changes throughout. 90-10-31 W. Heckman E Add case outline X. Make corrections to paragraph 1.3. Make changes to table I. Editorial changes throughout.92-03-17 Alan Barone F Changes in accordance with NOR 5962-R208-92. 92-05-1

4、9 Alan BaroneG Add case outlines T, U, Y, and Z. Rewrite entire document. 93-05-05 K. A. CottongimH Changes in accordance with NOR 5962-R031-94. 93-11-12 K. A. CottongimJ Added device type 04 with vendor CAGE 50434. Added case outline F to paragraph 1.2.2. Redrew entire document.96-02-29 K. A. Cotto

5、ngim K Added device type 05 with vendor CAGE 50434. Redrew entire document. -sld 98-11-09 K. A. Cottongim L Update figure 1, case outlines T, U, Y, and Z dimensioning to standard format. Update drawing boilerplate. Editorial changes throughout. 04-02-26 Raymond Monnin M Updated drawing paragraphs. -

6、sld 11-01-12 Charles F. Saffle THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED. CURRENT CAGE CODE 67268 REV SHEET REV SHEET REV STATUS REV M M M M M M M M M M M M M M OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Robert P. Evans DLA LAND AND MARITIME STANDARD MICRO

7、CIRCUIT DRAWING CHECKED BY C. R. Jackson COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY N. A. Hauck MICROCIRCUIT, HYBRID, LINEAR, DUAL AND QUAD CHANNEL, OPTICAL COUPLER AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE

8、82-07-09 AMSC N/A REVISION LEVEL M SIZE A CAGE CODE 14933 81028 SHEET 1 OF 14 DSCC FORM 2233 APR 97 5962-E114-11 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 SIZE A 8102

9、8 REVISION LEVEL M SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for class H hybrid microcircuits to be processed in accordance with MIL-PRF-38534 and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying

10、 Number (PIN). 1.2 PIN. The PIN shall be as shown in the following example: 81028 01 E X Drawing number Device type Case outline Lead finish (see 1.2.1) (see 1.2.2) (see 1.2.3) 1.2.1 Device type(s). The device type(s) shall identify the circuit function as follows: 1/ Device type Generic number Circ

11、uit function 01 6N134, 66013, 66072 Dual channel, optocoupler with common supply voltage and ground connections 02 HCPL-5631, 66056 Dual channel, optocoupler with common supply voltage and ground connections 03 HCPL-6631, 66123 Dual channel, optocoupler with separate supply voltage and ground connec

12、tions 04 HCPL-6651 Quad channel, optocoupler with common supply voltage and ground connections 05 HCPL-5651 Dual channel, optocoupler with common supply voltage and ground connections 1.2.2 Case outline(s). The case outline(s) shall be as designated in MIL-STD-1835 and as follows: Outline letter Des

13、criptive designator Terminals Package style E CDIP2-T16 16 Dual-in-lineF CDFP4-F16 16 Flat packageP CDIP2-T8 8 Dual-in-line T See figure 1 16 Dual-in-line U See figure 1 16 Dual-in-line X CQCC1-N24 24 Square leadless chip carrier Y See figure 1 8 Dual-in-line Z See figure 1 8 Dual-in-line 2 CQCC1-N2

14、0 20 Square leadless chip carrier 1.2.3 Lead finish. The lead finish shall be as specified in MIL-PRF-38534. 1.3 Absolute maximum ratings. 1/ Supply voltage (VCC) (1 minute maximum) . 7 V dc Input current (each channel) . 40 mA dc ( 1 ms duration) Average input current (each channel) . 20 mA dc Stor

15、age temperature range . -65C to +150C Package power dissipation (each channel) . 200 mW Lead temperature (soldering, 10 seconds) . +260C Junction temperature (TJ) . +175C Input power dissipation (each channel). 35 mW Reverse input voltage (each channel). 5 V dc Output current (IO) (each channel) 25

16、mA Output power dissipation (each channel) 40 mW Output voltage (VO) (each channel) 7 V dc Enable input voltage (VE) 5.5 V dc (device type 03 only) 1/ The devices 01 through 04 are available as class K microcircuits (highest reliability) on 5962-98001. Provided by IHSNot for ResaleNo reproduction or

17、 networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 SIZE A 81028 REVISION LEVEL M SHEET 3 DSCC FORM 2234 APR 97 1.4 Recommended operating conditions. Supply voltage range (VCC) 4.5 V dc to 5.5 V dc High level input current

18、1/ 12.5 mA minimum to 16.0 mA maximum (each channel) Low level input current . 250 A dc maximum (each channel) Normalized fan-out (TTL load) . 6 maximum (each channel) Case operating temperature range (TC) . -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks

19、. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38534 - Hybrid Microcircuits, Gen

20、eral Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard for Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcirc

21、uit Drawings. (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawin

22、g and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item performance requirements for device cl

23、asses D, E, G, H, and K shall be in accordance with MIL-PRF-38534. Compliance with MIL-PRF-38534 may include the performance of all tests herein or as designated in the device manufacturers Quality Management (QM) plan or as designated for the applicable device class. The manufacturer may eliminate,

24、 modify or optimize the tests and inspections herein, however the performance requirements as defined in MIL-PRF-38534 shall be met for the applicable device class. In addition, the modification in the QM plan shall not affect the form, fit, or function of the device for the applicable device class.

25、 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38534 and herein. 3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.2 herein and figure 1. 3.2.2 Terminal connections. The terminal connecti

26、ons shall be as specified on figure 2. 1/ The 12.5 mA condition permits at least 20 percent hFE(CTR) degradation. The initial switching threshold is 10 mA dc or less. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING DLA L

27、AND AND MARITIME COLUMBUS, OHIO 43218-3990 SIZE A 81028 REVISION LEVEL M SHEET 4 DSCC FORM 2234 APR 97 3.2.3 Switching test circuit(s) and waveform(s). The switching test circuit(s) and waveform(s) shall be as specified on figure 3. 3.3 Electrical performance characteristics. Unless otherwise specif

28、ied herein, the electrical performance characteristics are as specified in table I and shall apply over the full specified operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgr

29、oup are defined in table I. 3.5 Marking of device(s). Marking of device(s) shall be in accordance with MIL-PRF-38534. The device shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers vendor similar PIN may also be marked. 3.6 Data. In addition to the general performance r

30、equirements of MIL-PRF-38534, the manufacturer of the device described herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot sample, for each device type listed herein. Also, the data should include a summary of all parameters m

31、anually tested, and for those which, if any, are guaranteed. This data shall be maintained under document revision level control by the manufacturer and be made available to the preparing activity (DLA Land and Maritime -VA) upon request. 3.7 Certificate of compliance. A certificate of compliance sh

32、all be required from a manufacturer in order to supply to this drawing. The certificate of compliance (original copy) submitted to DLA Land and Maritime -VA shall affirm that the manufacturers product meets the performance requirements of MIL-PRF-38534 and herein. 3.8 Certificate of conformance. A c

33、ertificate of conformance as required in MIL-PRF-38534 shall be provided with each lot of microcircuits delivered to this drawing. 4. QUALITY ASSURANCE PROVISIONS 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38534 or as modified in the device ma

34、nufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. 4.2 Screening. Screening shall be in accordance with MIL-PRF-38534. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (

35、1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to either DLA Land and Maritime -VA or the acquiring activity upon request. Also, the test circuit shall specify the inputs, outputs, biases, an

36、d power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TAas specified in accordance with table I of method 1015 of MIL-STD-883. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical

37、parameter tests prior to burn-in are optional at the discretion of the manufacturer. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 SIZE A 81028 REVISION LEVEL M SHEET 5 D

38、SCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TC+125C unless otherwise specified Group A subgroups Device type Limits Unit Min MaxLow level output voltage VOLVCC= 5.5 V, IF= 10 mA, IOL= 10 mA 1/ 2/ 1,2,3 All 0.6 V Current transfer ratio hFE(CTR) VO

39、= 0.6 V, IF= 10 mA, VCC= 5.5 V 1/ 1,2,3 All 100 % High level output current IOHVCC= 5.5 V, Vo= 5.5 V, IF= 250 A 1/ 1,2,3 All 250 A High level supply current ICCHVCC= 5.5 V, IF1= IF2= 0 mA, IF3= IF4= 0 mA 3/ 1,2,3 01,02,05 28 mA 03140442Low level supply current ICCLVCC= 5.5 V, IF1= IF2= 20 mA, IF3= I

40、F4= 20 mA 3/ 1,2,3 01,02,05 36 mA 03180450Input forward voltage VFIF= 20 mA 1/ 1,2 01 1.75 V 3011.851,2,3 02,03, 04,051.90 Input reverse breakdown voltage VBRIR= 10 A 1/ 1,2,3 All5.0 V Input to output isolation leakage current IIO Relative humidity = 45 %,t = 5 seconds, TC= +25C 4/ VIO= 1,500 V dc1

41、01,02, 03,04 1.0 A VIO= 2,500 V dc1 05 1.0 Capacitance between input-output CIO f = 1 MHz, TC= +25C 5/ 6/ 4 All 4.0 pF Propagation delay time, low to high output level tPLH7/ RL= 510, CL= 50 pF, IF= 13 mA 1/ 9Al 100 ns 10,11140Propagation delay time, high to low output level tPHL8/ RL= 510, CL= 50 p

42、F, IF= 13 mA 1/ 9Al 100 ns 10,11120See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 SIZE A 81028 REVISION LEVEL M SHEET 6 DSCC FORM 2234 APR 9

43、7 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions -55C TC+125C unless otherwise specified Group A subgroups Device type Limits Unit Min Max Output rise time tLHRL= 510, CL= 50 pF, IF= 13 mA 1/ 9,10,11 All 90 ns Output fall time tHLRL= 510, CL= 50 pF, IF= 13 mA 1/

44、9,10,11 All 40 ns Common mode transient immunity at high output level CMHVCM= 50 V(peak), VO= 2.0 V(minimum), RL= 510, IF= 0 mA 1/ 6/ 9,10,11 All -1000 V/s Common mode transient immunity at low output level CMLVCM= 50 V(peak), VO= 0.8 V(maximum), RL= 510, IF= 10 mA 1/ 6/ 9,10,11 All -1000 V/s 1/ Eac

45、h channel of device types 01, 02, 04, and 05. Device type 03 functions as two independent single channel units. 2/ It is essential that a bypass capacitor (.01 to 0.1 F, ceramic) be connected from VCCto ground. Total lead length between both ends of this capacitor and the isolator should not exceed

46、20 mm. 3/ IF3and IF4apply to device type 04 only. 4/ All devices are considered as two terminal. IIOis measured between all input leads or terminals shorted together and all output leads or terminals shorted together. 5/ Measured between each input pair shorted together and all outputs shorted toget

47、her. 6/ Parameters shall be tested as part of device initial characterization and after design or process changes. Parameters shall be guaranteed to the limits specified in table I for all lots not specifically tested. 7/ The tPLHpropagation delay is measured from the 6.5 mA point on the trailing ed

48、ge of the input pulse to the 1.5 V point on the trailing edge of the output pulse. 8/ The tPHLpropagation delay is measured from the 6.5 mA point on the leading edge of the input pulse to the 1.5 V point on the leading edge of the output pulse. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 SIZE A 81028 REVISION LEVEL M SHEET 7 DSCC FORM 2234 APR 97 Case outline T. Symbol Millimeters Inches Min Max Min MaxA 4.57 .180A1 1.40