DLA SMD-5962-81018 REV J-2011 MICROCIRCUIT DIGITAL CMOS TRIPLE 2-CHANNEL ANALOG MULTIPLEXER DEMULTIPLEXER MONOLITHIC SILICON.pdf
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1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED D Add device type 02. Add CAGE 04713 as supplier. Editorial changes throughout. 93-08-20 Monica L. Poelking E Changes in accordance with NOR 5962-R013-94. 93-10-21 Monica L. Poelking F Add device type 03. Add CAGE 27014 as supplier. Editorial chang
2、es throughout. 94-01-05 Monica L. Poelking G Update boilerplate to MIL-PRF-38535 requirements. Editorial changes throughout. LTG 03-07-09 Thomas M. Hess H Made change to paragraph 3.5. Update boilerplate to MIL-PRF-38535 requirements. LTG 05-01-26 Thomas M. Hess J Update boilerplate paragraphs to th
3、e current MIL-PRF-38535 requirements. - LTG 11-07-26 Thomas M. Hess CURRENT CAGE CODE 67268 REV SHET REV SHET REV STATUS REV J J J J J J J J J J J J J OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 PMIC N/A PREPARED BY Marcia B. Kelleher DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.dscc.
4、dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A CHECKED BY Monica L. Poelking APPROVED BY Michael A. Frye MICROCIRCUIT, DIGITAL, CMOS, TRIPLE 2-CHANNEL ANALOG MULTIPLEXER/ DEMULTIPLEXER, MONOLITHIC SILICON
5、DRAWING APPROVAL DATE 82-02-04 REVISION LEVEL J SIZE A CAGE CODE 14933 81018 SHEET 1 OF 13 DSCC FORM 2233 APR 97 5962-E434-11 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 81018 DLA LAND AND MARITIME COLUMBUS, O
6、HIO 43218-3990 REVISION LEVEL J SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown
7、 in the following example: 81018 01 E A Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 4053B Triple 2-channel analog multiplexer/dem
8、ultiplexer 02 14053B Triple 2-channel analog multiplexer/demultiplexer 03 4053B Triple 2-channel analog multiplexer/demultiplexer 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or
9、CDIP2-T16 16 Dual-in-line F GDFP2-F16 or CDFP3-F16 16 Flat pack 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. 1/ 2/ 3/ Supply voltage range (VDD): Device type 01 -0.5 V dc to +20 V dc Device types 02 and 03 -0.5 V dc to +18 V dc Input
10、voltage range -0.5 V dc to VDD+ 0.5 V dc DC input current . 10 mA Storage temperature range -65C to +150C Maximum power dissipation (PD): Device types 01 and 03 500 mW 4/ Device type 02 300 mW 4/ Lead temperature (soldering, 10 seconds): Device types 01 and 02 +300C Device type 03 +260C Thermal resi
11、stance, junction-to-case (JC) . See MIL-STD-1835 Junction temperature (TJ) . +175C _ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Voltages referenced to VSSor VEE, w
12、hichever is more negative. 3/ The limits for the parameters specified herein shall apply over the full specified VCCrange and case temperature range of -55C to +125C. 4/ For TC= +100C to +125C, derate linearly at 12 mW/C to 200 mW. Provided by IHSNot for ResaleNo reproduction or networking permitted
13、 without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 81018 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL J SHEET 3 DSCC FORM 2234 APR 97 1.4 Recommended operating conditions. Supply voltage range (VDD): Device type 01 +3.0 V dc to +18 V dc Device types 02 and 03 +3.0 V
14、 dc to +15 V dc Case operating temperature range (TC) . -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issu
15、es of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standar
16、d Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document
17、Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws an
18、d regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qu
19、alified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MI
20、L-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification ma
21、rk in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outline(s). The case outline(s)
22、 shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. 3.2.5 Switching waveforms
23、 and test circuit. The switching waveforms and test circuit shall be as specified on figure 4. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 81018 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL J
24、 SHEET 4 DSCC FORM 2234 APR 97 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test r
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