DLA SMD-5962-78016 REV H-2011 MICROCIRCUITS MEMORY DIGITAL 512 X 8 (4K) SCHOTTKY PROM MONOLITHIC SILICON.pdf
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1、 REVISIONS LTR DESCRIPTION YY-MM-DD APPROVED A Page 4: Correct table I to correspond with military specification requirements. 79-08-05 N. A. Hauck B Change from suggested source drawing to approved source drawing. Editorial changes throughout. 86-05-04 N. A. Hauck C Change to military drawing forma
2、t. Add alternate group A programmability sample test. Update vendors part number. Make changes to screening and group A inspection. 87-06-02 N. A. Hauck D Add device 02. Editorial changes throughout. 88-01-22 M. A. Frye E Changes in accordance with NOR 5962-R080-96. 96-03-22 M. A. Frye F Updated boi
3、lerplate. Removed programming specifics from drawing, including table III and table IV. Separated source bulletin from body of drawing. - glg 00-08-07 Raymond Monnin G Corrected marking paragraph 3.5, updated boilerplate paragraphs. ksr 05-03-01 Raymond Monnin H Updated boilerplate for 5 Year Review
4、. Correction of title. lhl 11-04-13 Charles F. Saffle THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED. CURRENT CAGE CODE 67268 REV SHEET REV SHEET REV STATUS REV H H H H H H H H H OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 PMIC N/A PREPARED BY Joan M. Fisher DLA LAND AND MARITIME COLUMBUS, OHIO 432
5、18-3990 STANDARD MICROCIRCUIT DRAWING CHECKED BY C. R. Jackson http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY All DEPARTMENTS APPROVED BY N. A. Hauck MICROCIRCUITS, MEMORY, DIGITAL, 512 X 8 (4K), SCHOTTKY PROM, AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 79-02-20 MON
6、OLITHIC SILICON AMSC N/A REVISION LEVEL H SIZE A CAGE CODE 14933 78016 SHEET 1 OF 9 DSCC FORM 2233 APR 97 5962-E304-11 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 78016 DLA LAND AND MARITIME COLUMBUS, OHIO 432
7、18-3990 REVISION LEVEL H SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN shall be as shown
8、in the following example: 78016 01 J X | | | | | | | | | | | |_ Drawing number Device type Case outline Lead finish (see 1.2.1) (see 1.2.2) (see 1.2.3) 1.2.1 Device type(s). The device type(s) shall identify the circuit function as follows: Device type Generic number Circuit Access time 01 1/ 512 x
9、8-bit Schottky PROM 90 ns 02 1/ 512 x 8-bit Schottky PROM 45 ns 1.2.2 Case outline(s). The case outline(s) shall be as designated in MIL-STD-1835, and as follows: Outline letter Descriptive designator Terminals Package style J GDIP1-T24 or CDIP2-T24 24 dual-in-line package K GDFP2-F24 or CDFP3-F24 2
10、4 flat package U CQCC1-N32 32 rectangular chip carrier package 3 CQCC1-N28 28 square leadless chip carrier package 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage range . -0.5 V dc to +7.0 V dc Input voltage range . -1.5 V
11、 dc to +5.5 V dc Storage temperature range -65C to +150C Maximum power dissipation (PD): 2/ . 1.02 W Lead temperature (soldering, 10 seconds) +300C Thermal resistance, junction-to-case (JC) 3/ See MIL-STD-1835 Maximum junction temperature (TJ) . +175C Output sink current 100 mA 1.4 Recommended opera
12、ting conditions. Case operating temperature range (TC) -55C to +125C Input low voltage +10% supply (VIL) 0.8 V dc Input high voltage +10% supply (VIH) 2.0 V dc Supply voltage range (VCC) . 4.5 V dc to 5.5 V dc 1/ Generic numbers are listed on the Standard Microcircuit Drawing Source Approval Bulleti
13、n at the end of this document and will also be listed in MIL-HDBK-103. 2/ Must withstand the added PDdue to short-circuit test; e.g., IOS. 3/ Heat sinking is recommended to reduce the junction temperature. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-
14、,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 78016 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this draw
15、ing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-88
16、3 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https
17、:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing shall take
18、 precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and
19、 as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers
20、approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification m
21、ark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Terminal connections. The terminal
22、connections shall be as specified on figure 1. 3.2.2 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over t
23、he full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The
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