DLA SMD-5962-78015 REV J-2010 MICROCIRCUIT DIGITAL BIPOLAR MEMORY 64-BIT RAM MONOLITHIC SILICON.pdf

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1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED D Add LCC package type. Add 2 new devices types. Change VCC for device type 02. Convert to military drawing format. 1986 JULY 23 M. A. Frye E Change vendor similar part numbers in 6.4. Changes to table I. Editorial changes throughout. 1987 FEB 06 M

2、. A. Frye F Make changes to table II, 1.2.2, 1.3, 4.2a, and 4.3.2b. Make change to figure 4. Make changes to table I. 1988 JUNE 28 M. A. Frye G Add device types 05 and 06. for vendor CAGE 34335. Made technical changes in table I. Added test condition A and B in 4.2a step 1 and 4.3.2b step 1. Made ch

3、anges to figure 3. Editorial changes throughout drawing. 1989 JULY 12 M. A. Frye H Updated boilerplate paragraphs. ksr 2005 MAY 17 Raymond Monnin J Updated body of drawing to reflect current requirements. - glg 2010 DEC 08 Charles Saffle THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED. CU

4、RRENT CAGE CODE 67268 REV SHEET REV SHEET REV STATUS REV J J J J J J J J J J J J J OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 PMIC N/A PREPARED BY Joan M. Fisher DLA LAND AND MARITIME STANDARD MICROCIRCUIT DRAWING CHECKED BY C. R. Jackson COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAW

5、ING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY N. A. Hauck MICROCIRCUIT, DIGITAL, BIPOLAR, MEMORY, 64-BIT RAM, MONOLITHIC SILICON AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 1979 MARCH 01 AMSC N/A REVISION LEVEL J SIZE A CAGE CODE 14933 78015 SHEET 1 OF 13 DSCC FORM 2233

6、 APR 97 5962-E040-11 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 78015 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL J SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes

7、device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 78015 01 E A Drawing number Device type (see 1.2.1) Case outline (see 1.2.2) L

8、ead finish (see 1.2.3) 1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Circuit Access time 01 64-bit noninverting RAM, three-state 30 ns 02 64-bit inverting RAM, three-state 50 ns 03 64-bit noninverting RAM, three-state 50 ns 04 64-bit Low power noninve

9、rting RAM, three-state 65 ns 05 64-bit noninverting RAM, three-state 20 ns 06 64-bit Low power noninverting RAM, three-state 30 ns 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style E CDIP2-T16 or

10、 GDIP1-T16 16 dual-in-line package F CDFP3-F16 or GDFP2-F16 16 flat package 2 CQCC1-N20 20 square chip carrier package 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage, VCCto GND - -0.5 V dc to +7.0 V dc Input voltage range

11、 - -0.5 V dc to +5.5 V dc Voltage applied to outputs for high output state - -0.5 V dc to +5.5 V dc Junction temperature (TJ) - +175C Lead temperature (soldering, 10 seconds) - +300C Thermal resistance, junction-to-case (JC): Cases E, F, and 2 - See MIL-STD-1835 Output current, into outputs - 20 mA

12、Input current - -30 mA to +5.0 mA Storage temperature range - -65C to +150C 1.4 Recommended operating conditions. Supply voltage (VCC): Device types 01, 03, 04, 05, 06 - 4.5 V dc minimum to 5.5 V dc maximum Device type 02 - 4.75 V dc minimum to 5.25 V dc maximum Minimum high level input voltage (VIH

13、): Device types 01-06 - 2.0 V dc Maximum low level input voltage (VIL) - -0.8 V dc Case operating temperature range (TC) - -55C to +125C Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 78015 DLA LAND AND MARITIME

14、COLUMBUS, OHIO 43218-3990 REVISION LEVEL J SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the i

15、ssues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Stan

16、dard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Docume

17、nt Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws

18、 and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a

19、 Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with

20、 MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification

21、 mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outline(s). The case outline

22、(s) shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table(s). The truth table(s) shall be as specified on figure 2. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electri

23、cal performance characteristics are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I

24、. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices buil

25、t in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from

26、 IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 78015 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL J SHEET 4 DSCC FORM 2234 APR 97 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in

27、 MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DLA Land and Maritime -VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of confor

28、mance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DLA Land and Maritime -VA shall be required for any change that affects this drawing. 3.9 Ver

29、ification and review. DLA Land and Maritime -VA, DLA Land and Maritime -VA s agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 4. VERIFI

30、CATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following

31、additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test cir

32、cuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical par

33、ameter tests prior to burn-in are optional at the discretion of the manufacturer. 4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD-883 including groups A, B, C, and D inspections. The following additional criteria shall apply. 4.3.

34、1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 4, 5, and 6 in table I, method 5005 of MIL-STD-883 shall be omitted. c. Subgroups 7 and 8 shall include verification of the truth table. 4.3.2 Groups C and D inspections. a. End-point electrical parameters shall be

35、 as specified in table II herein. b. Steady-state life test conditions, method 1005 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon

36、 request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. (2) TA= +125C, minimum. (3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. Provided by IH

37、SNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 78015 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL J SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ -55

38、C TC +125C unless otherwise specified Group A subgroups Device type Limits Unit Min Max Output high voltage VOHVCC= min, IOH= -2.0 mA VIN=VIHor VILAll 1, 2, 3 2.4 V Output low voltage VOLVCC= min, VIN=VIHor VILIOL= 16 mA 01, 03, 05 1, 2, 3 0.45 V IOL= 8 mA 04, 06 IOL= 20 mA 01, 03, 05 0.5 IOL= 10mA

39、04, 06 IOL= 16 mA 02 Input low current IILVCC= max, WE , D0-D3, A0-A3, CS VIN= 0.40 V 01, 03, 04, 05, 06 1, 2, 3 -0.25 mA VIN= 0.45 V 02 Input high current IIHVCC= max VIN= 2.7 V 01, 03, 04, 05, 06 1, 2, 3 10 A VIN= 5.5 V 02 25 Output short-circuit current IOSVCC= max, VOUT= 0.0 V 2/ 01, 03, 04, 05,

40、 06 1, 2, 3 -20 -90 mA 02 -20 -100 Power supply current ICCVCC= max, All inputs = GND 01, 03, 05 1, 2, 3 105 mA 04, 06 38 02 110 Input clamp voltage VICVCC= min IIN= -18 mA 01, 03, 04, 05, 06 1, 2, 3 -1.2 V IIN= -12 mA 02 -1.5 Output leakage current IOZVCS= VIHor VWE= VILVOUT= 2.4 V VCC= max 01, 03,

41、 04, 05, 06 1, 2, 3 40 A 02 50 VCS= VIHor VWE= VILVOUT= 0.4 V VCC= max 01, 03, 04, 05, 06 -40 02 -50 Propagation delay, address to output tPLH(A)tPHL(A)3/ 01, 06 9, 10, 11 30 ns 04 65 05 20 02, 03 50 Propagation delay, chip select (low) to activate output and correct data tPZH(CS)tPZL(CS)3/ 4/ 01, 0

42、5, 06 9, 10, 11 20 ns 04 35 02, 03 25 Propagation delay, write enable (high) to active output and correct data tPZH(WE)tPZL(WE)3/ 4/ 5/ 01 9, 10, 11 25 ns 04 35 05, 06 15 02, 03 40 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license fro

43、m IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 78015 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL J SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions 1/ -55C TC +125C unless otherwise specified Group A subgroups Device

44、 type Limits Unit Min Max Setup time address tS(A)3/ All 9, 10, 11 0 ns Hold time address th(A)3/ 01, 03, 04, 05, 06 9, 10, 11 0 ns 02 10 Setup time data input tS(DI)3/ 01, 03 9, 10, 11 25 ns 04 55 05 20 02, 06 30 Hold time data input th(DI)3/ 01, 03, 04, 05, 06 9, 10, 11 0 ns 02 10 Minimum write en

45、able pulse width tPW(WE)3/ 01, 03 9, 10, 11 25 ns 04 55 05 20 02, 06 30 Propagation delay, chip select (high) to inactive output (HI-Z) tPHZ(CS)tPLZ(CS)3/ 4/ 01, 05 9, 10, 11 20 ns 03, 06 25 02 40 04 35 Propagation delay, write enable (low) to inactive output (HI-Z) tPLZ(WE)tPHZ(WE)3/ 4/ 01, 06 9, 1

46、0, 11 25 ns 02 50 03, 04 35 05 20 1/ For device types 01, 03, 04, 05, and 06 the VCCcondition is 4.5 V dc VCC 5.5 V dc, and for device type 02, the VCCcondition is 4.75 V dc VCC 5.25 V dc. 2/ Not more than one output shall be grounded at one time. 3/ See figure 3 test load (measured to output = 1.5

47、V) and figure 4 switching waveforms. 4/ For three-state output tPZH(WE)and tPZH(CS)are measured with S1open, CL= 30 pF and with both the input and output timing referenced to 1.5 V. tPZL(WE)and tPZL(CS)are measured with S1closed, CL= 30 pF and with both the input and output timing referenced to 1.5 V. tPHZ(WE)and tPHZ(CS)are measured with S1open and CL 5 pF and are measured between the 1.5 V level on the input to the VOH-500 mV level on the output. tPLZ(WE)and tPLZ(CS)are measured with S1closed and CL 5 p