DLA SMD-5962-78014 REV K-2005 MICROCIRCUIT LINEAR DUAL ANALOG SWITCH MONOLITHIC SILICON《硅单片双重模拟开关 线性微型电路》.pdf
《DLA SMD-5962-78014 REV K-2005 MICROCIRCUIT LINEAR DUAL ANALOG SWITCH MONOLITHIC SILICON《硅单片双重模拟开关 线性微型电路》.pdf》由会员分享,可在线阅读,更多相关《DLA SMD-5962-78014 REV K-2005 MICROCIRCUIT LINEAR DUAL ANALOG SWITCH MONOLITHIC SILICON《硅单片双重模拟开关 线性微型电路》.pdf(9页珍藏版)》请在麦多课文档分享上搜索。
1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED G Changes in accordance with NOR 5962-R154-92 92-08-31 M. A. FRYE H Drawing updated to reflect current requirements. Incorporate revision G NOR. Editorial changes throughout. -drw 00-10-02 R. MONNIN J Update to current requirements. Editorial chang
2、es throughout. -drw 03-03-11 R. MONNIN K Make correction to marking paragraph 3.5. -rrp 05-06-15 R. MONNIN THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED. CURRENT CAGE CODE 67268 REV SHET REV SHET REV STATUS REV K K K K K K K K OF SHEETS SHEET 1 2 3 4 5 6 7 8 PMIC N/A PREPARED BY WILLIAM
3、 E. SHOUP DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY C. R. JACKSON COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY N. A. HAUCK MICROCIRCUIT, LINEAR, DUAL ANALOG SWITCH, MONOLITHIC SILICON AND AGENCIES OF T
4、HE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 79-01-19 AMSC N/A REVISION LEVEL K SIZE A CAGE CODE 14933 78014 SHEET 1 OF 8 DSCC FORM 2233 APR 97 5962-E330-05 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 78014
5、DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL K SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying
6、Number (PIN). The complete PIN is as shown in the following example: 78014 01 C X Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 DG1
7、29A Dual DPST analog switch 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style A GDFP5-F14 or CDFP6-F14 14 Flat pack C GDIP1-T14 or CDIP2-T14 14 Dual-in-line X CDFP3-F14 14 Flat pack 1.2.3 Lead fi
8、nish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. VCC- VEE36 V dc VCC- VD. 36 V dc VDor VS- VEE. 36 V dc VD- VS. 22 V dc VCC- VR. 25 V dc VR- VEE25 V dc VIN- VEE. 30 V dc VCC- VIN. 25 V dc VIN- VR6 V dc Current (any terminal) 30 mA Storage temperature
9、range -65C to +150C Power dissipation (PD): 1/ 2/ Case A . 750 mW 3/ Case C . 825 mW 4/ Lead temperature (soldering 10 seconds) . 300C Junction temperature (TJ) 150C Thermal resistance, junction to case (JC): Case A . 70C/W Case C . 50C/W 1/ Must withstand the added PDdue to short circuit test (e.g.
10、, IOS). 2/ All leads soldered to board. 3/ Derate 10 mW/C above 75C. 4/ Derate 11 mW/C above 75C. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 78014 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVI
11、SION LEVEL K SHEET 3 DSCC FORM 2234 APR 97 1.4 Recommended operating conditions. Ambient operating temperature range (TA) . -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing
12、to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 -
13、Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/ass
14、ist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of
15、 this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class
16、 level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance wit
17、h the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. T
18、hese modifications shall not affect the PIN as described herein. A “Q” or “QML” certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be
19、as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.3 Electrical performance characteristics. Unless otherwise specified herein
20、, the electrical performance characteristics are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are desc
21、ribed in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-
22、JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q” or “QML” certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. Provided by IHSNot for ResaleNo reproduction or networking permitted with
23、out license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 78014 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL K SHEET 4 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ -55C TA+125C unless otherwise specified Group A subgr
24、oups Device type Limits Unit Min MaxDrain source ON resistance RDS(ON)VD= 10 V, IS= -10 mA, 1, 3 All 30 VIN= 2.5 V 2/ 2 60 Source OFF leakage IS(OFF)VS= 10 V, VD= -10 V, 1 All 1 nA current VIN= 0.8 V 2/ 2 100 Drain OFF leakage ID(OFF)VS= -10 V, VD= 10 V, 1 All 1 nA current VIN= 0.8 V 2/ 2 100 Channe
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