DLA SMD-5962-78013 REV P-2011 MICROCIRCUIT HYBRID LINEAR HIGH CURRENT AMPLIFIER THICK THIN FILM.pdf

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1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Convert to approved source format; Change vendor. 82-04-01 N. A. Hauck B Change test method references to 5008; Reinstate vendor, FSCM 27014. 82-05-14 W. E. Shoup C Add vendor, FSCM 23223; Modify paragraph 3.7. 83-04-22 N. A. Hauck D Add vendors

2、FSCM 63071 and 64762. Editorial changes throughout. 84-12-14 N. A. Hauck E Page 2, add case outline. Page 6, add dimensions for optional base and seating plane. 85-08-30 N. A. Hauck F Change to Military Drawing format. Remove vendor CAGE 13856. 87-02-13 W. Heckman G Remove CAGE 63071. Changed to ref

3、lect MIL-H-38534 processing. Changed drawing CAGE to 67268. 90-05-09 W. HeckmanH Update document to current MIL-H-38534 requirements. Editorial changes throughout. 92-05-20 G. A. Lude J Changes in accordance with NOR 5962-R126-94. 94-03-29 K. A. Cottongim K Add vendor CAGE 51651. Change to table 1 a

4、nd figure 1. 98-06-22 K. A. Cottongim L Update drawing boilerplate. 04-02-23 Raymond Monnin M Table I, Rise time test, conditions column, correct RS= 100 k to RS= 100 06-02-09 Raymond MonninN Add class K, device type 02, and Radiation Hardness Assurance (RHA) requirements. -gz 10-06-28 Charles F. Sa

5、ffle P 1.5, remove “” from maximum total dose. Table I, IIOtest limits for device type 02, RHA level R, correct 25 A to 30 A. -gz 11-11-07 Charles F. Saffle THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED. CURRENT CAGE CODE 67268 REV SHEET REV SHEET REV STATUS REV P P P P P P P P P P P P

6、OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 PMIC N/A PREPARED BY Joan M. Fisher DLA LAND AND MARITIME STANDARD MICROCIRCUIT DRAWING CHECKED BY C. R. Jackson COLUMBUS, OHIO 43218-3990http:/www.landandmaritime.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY N. A. Hauck MICROCIR

7、CUIT, HYBRID, LINEAR, HIGH AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 79-01-17 CURRENT AMPLIFIER, THICK/THIN FILM AMSC N/A REVISION LEVEL P SIZE A CAGE CODE 14933 78013 SHEET 1 OF 12 DSCC FORM 2233 APR 97 5962-E034-12Provided by IHSNot for ResaleNo reproduction or networking per

8、mitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 78013 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL P SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents five product assurance classes as defined in paragraph 1.2.3 and MIL-PRF-38534. A c

9、hoice of case outlines and lead finishes which are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of radiation hardness assurance levels are reflected in the PIN. 1.2 PIN. The PIN shall be as shown in the following example: For class H devices: 78013 01

10、 X X Drawing number Device type Case outline Lead finish (see 1.2.2) (see 1.2.4) (see 1.2.5) For classes H and K radiation hardened devices: 5962 R 78013 02 K X X Federal RHA Device Device Case Lead stock class designator type class outline finish designator (see 1.2.1) (see 1.2.2) designator (see 1

11、.2.4) (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 Radiation hardness assurance (RHA) designator. Device classes H and K RHA marked devices shall meet the MIL-PRF-38534 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Devi

12、ce types. The device types identify the circuit function as follows: Device type Generic number Circuit function 01 0002, MSK 0002H Current amplifier 02 MSK 0002RH Current amplifier 1.2.3 Device class designator. This device class designator shall be a single letter identifying the product assurance

13、 level. All levels are defined by the requirements of MIL-PRF-38534 and require QML Certification as well as qualification (Class H, K, and E) or QML Listing (Class G and D). The product assurance levels are as follows: Device class Device performance documentation K Highest reliability class availa

14、ble. This level is intended for use in space applications. H Standard military quality class level. This level is intended for use in applications where non-space high reliability devices are required. G Reduced testing version of the standard military quality class. This level uses the Class H scre

15、ening and In-Process Inspections with a possible limited temperature range, manufacturer specified incoming flow, and the manufacturer guarantees (but may not test) periodic and conformance inspections (Group A, B, C, and D). Provided by IHSNot for ResaleNo reproduction or networking permitted witho

16、ut license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 78013 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL P SHEET 3 DSCC FORM 2234 APR 97 E Designates devices which are based upon one of the other classes (K, H, or G) with exception(s) taken to the requirements of that class.

17、 These exception(s) must be specified in the device acquisition document; therefore the acquisition document should be reviewed to ensure that the exception(s) taken will not adversely affect system performance. D Manufacturer specified quality class. Quality level is defined by the manufacturers in

18、ternal, QML certified flow. This product may have a limited temperature range. 1.2.4 Case outlines. The case outlines shall be as designated in MIL-STD-1835 and as follows: 1/ Outline letter Descriptive designator Terminals Package style G MACY1-X8 8 Can X See figure 1 Can 1.2.5 Lead finish. The lea

19、d finish shall be as specified in MIL-PRF-38534. 1.3 Absolute maximum ratings. 2/ Supply voltage (VS) 22 V dc Input voltage range 22 V dc Storage temperature range -65C to +150C Power dissipation (PD), TA= +25C . 600 mW 3/ Lead temperature (soldering, 10 seconds) +300C Thermal resistance, junction-t

20、o-case (JC) . 40C/W Junction temperature (TJ) +175C 1.4 Recommended operating conditions. Ambient operating temperature range (TA) -55C to +125C 1.5 Radiation features. Maximum total dose available: Device type 02 100 krads(Si) 4/ 5/ 6/ 1/ Use 7801301XX to replace older devices marked 7801301GX (dat

21、e codes prior to 30 August 1985) for applications requiring the case outline described on figure 1 herein. 2/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 3/ No heat sink.

22、 4/ These parts may be dose rate sensitive in a space environment and may demonstrate enhanced low dose rate effects. Radiation end-point limits for the noted parameters are guaranteed only for the conditions as specified in MIL-STD-883, method 1019, condition A. Dose rate shall be in accordance wit

23、h MIL-STD-883, method 1019, condition A. 5/ Bipolar device types may degrade from displacement damage from radiation which could affect RHA levels. These device types have not been characterized for displacement damage. 6/ See figure 3. Provided by IHSNot for ResaleNo reproduction or networking perm

24、itted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 78013 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL P SHEET 4 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and han

25、dbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38534 - Hybrid Microcircuits, General Specification for. DEPARTMENT OF DEFENSE STA

26、NDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard for Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are avai

27、lable online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 3. REQUIREMENTS 3.1 Item requirements. The individual item performance requirements for device classes D, E, G, H, and K shall be in

28、 accordance with MIL-PRF-38534. Compliance with MIL-PRF-38534 may include the performance of all tests herein or as designated in the device manufacturers Quality Management (QM) plan or as designated for the applicable device class. The manufacturer may eliminate, modify or optimize the tests and i

29、nspections herein, however the performance requirements as defined in MIL-PRF-38534 shall be met for the applicable device class. In addition, the modification in the QM plan shall not affect the form, fit, or function of the device for the applicable device class. 3.2 Design, construction, and phys

30、ical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38534 and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein and figure 1. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.

31、3.2.3 Radiation exposure circuits. The radiation exposure circuits shall be as specified on figure 3. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full specified operatin

32、g temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking of devices. Marking of devices shall be in accordance with MIL-PRF-38534. The device shall

33、be marked with the PIN listed in 1.2 herein. In addition, the manufacturers vendor similar PIN may also be marked. 3.6 Data. In addition to the general performance requirements of MIL-PRF-38534, the manufacturer of the device described herein shall maintain the electrical test data (variables format

34、) from the initial quality conformance inspection group A lot sample, for each device type listed herein. Also, the data should include a summary of all parameters manually tested, and for those which, if any, are guaranteed. This data shall be maintained under document revision level control by the

35、 manufacturer and be made available to the preparing activity (DLA Land and Maritime-VA) upon request. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 78013 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION

36、 LEVEL P SHEET 5 DSCC FORM 2234 APR 97 3.7 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to supply to this drawing. The certificate of compliance (original copy) submitted to DLA Land and Maritime-VA shall affirm that the manufacturers product

37、meets the performance requirements of MIL-PRF-38534 and herein. 3.8 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38534 shall be provided with each lot of microcircuits delivered to this drawing. 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection p

38、rocedures shall be in accordance with MIL-PRF-38534 or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. 4.2 Screening. Screening shall be in accordance with MIL-PRF-38534. The follow

39、ing additional criteria shall apply: a. Pre-seal burn-in test, method 1030 of MIL-STD-883. (optional for class H) (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to either DLA Land and Mariti

40、me-VA or the acquiring activity upon request. Also, the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1030 of MIL-STD-883. (2) TAas specified in accordance with table I of method 1015 of MIL-STD-883. b.

41、 Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to either DLA Land and Maritime-VA or the acquiring activity upon request. Also, the test circuit sh

42、all specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TAas specified in accordance with table I of method 1015 of MIL-STD-883. c. Interim and final electrical test parameters shall be as specified in

43、table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 78013 DLA LAND AND MARITIME COLUMBUS,

44、 OHIO 43218-3990 REVISION LEVEL P SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ 2/ 3/ -55C TA+125C unless otherwise specified Group A subgroups Device type Limits Unit Min Max DC input offset current IIORS= 10 k, RL= 1.0 k 1,2,3 01 -10 +10 A

45、 1 02 -15 +15 2,3 -20 +20 M,D,P,L,R 2/ 1 02 -30 +30 DC input offset voltage VIORS= 300 , RL= 1.0 k 1,2,3 01,02 -30 +30 mV Output voltage swing VOVIN= 12 V, RL= 1.0 k, TA= +25C 4 01,02 10 V VIN= 10 V, RL= 100, VS= 15 V, TA= +25C 9.5 M,D,P,L,R 2/ 4 02 8.4 Supply currents +ICCRS= 10 k, RL= 1.0 k VIN= 0

46、 V, TA= +25C 1 01,02 +10.0 mA -ICC-10.0 Voltage gain AVVIN= 3.0 Vp-p, RS= 10 k, RL= 1.0 k, f = 1.0 kHz 4,5,6 4/ 01,02 0.95 V/V M,D,P,L,R 2/ 4 02 0.90 Input impedance 5/ ZINVIN= 1.0 V rms, RS= 200 k, RL= 1.0 k, f = 1.0 kHz, TA= +25C 4 01,02 180 k Output impedance 5/ ZOUTVIN= 1.0 V rms, RS= 10 k, RL=

47、50 , f = 1.0 kHz, TA= +25C 4 01,02 10 Rise time trVOUT= 2.5 Vp-p, RS= 100 , RL= 50 , TA= +25C 4 01,02 12 ns See footnotes on the next page. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 78013 DLA LAND AND MARITI

48、ME COLUMBUS, OHIO 43218-3990 REVISION LEVEL P SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. 1/ VS= 12 V, unless otherwise specified. 2/ Device type 02 has been characterized through all levels M, D, P, L, and R of irradiation. However, device type 02 is tested at 1.5 times the R level. Pre and post irradiation values are identical unless otherwise specified in table