DLA SMD-5962-77004 REV E-2004 MICROCIRCUIT DIGITAL BIPOLAR SCHOTTKY TTL DECODER MONOLITHIC SILICON《硅单片译码器肖脱基TTL数字微型电路》.pdf

《DLA SMD-5962-77004 REV E-2004 MICROCIRCUIT DIGITAL BIPOLAR SCHOTTKY TTL DECODER MONOLITHIC SILICON《硅单片译码器肖脱基TTL数字微型电路》.pdf》由会员分享，可在线阅读，更多相关《DLA SMD-5962-77004 REV E-2004 MICROCIRCUIT DIGITAL BIPOLAR SCHOTTKY TTL DECODER MONOLITHIC SILICON《硅单片译码器肖脱基TTL数字微型电路》.pdf（11页珍藏版）》请在麦多课文档分享上搜索。

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED D Delete vendors, CAGE 18324, CAGE 34335, and CAGE 07263. Change in terminal connections and truth table. Add logic diagram. Revise to military drawing format. Change code ident. no 87-08-31 N. A. Hauck E Update to reflect latest changes in format

2、and requirements. Editorial changes throughout. -les 04-05-13 Raymond Monnin THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED. CURRENT CAGE CODE 67268 REV SHET REV SHET REV STATUS REV E E E E E E E E E OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 PMIC N/A PREPARED BY Monica L. Grosel DEFENSE SUPPLY CE

3、NTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY D. A. DiCenzo COLUMBUS, OHIO 43216 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY N. A. Hauck MICROCIRCUIT, DIGITAL, BIPOLAR SCHOTTKY TTL, DECODER, AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROV

4、AL DATE 77-02-23 MONOLITHIC SILICON AMSC N/A REVISION LEVEL E SIZE A CAGE CODE 14933 77004 SHEET 1 OF 9 DSCC FORM 2233 APR 97 5962-E523-03 .Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 77004 DEFENSE SUPPLY CENT

5、ER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL E SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The c

6、omplete PIN is as shown in the following example: 77004 01 E X Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54S139 Dual 2 to 4 lin

7、e decoder/demultiplexer 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 dual-in-line F GDFP2-F16 or CDFP3-F16 16 flat 1.2.3 Lead finish. The lead finish is as specif

8、ied in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage . -0.5 V dc to +7.0 V dc Input voltage range -1.2 V dc at -18 mA to +5.5 V dc Storage temperature range -65C to +150C Maximum power dissipation (PD) 1/ 495 mW Lead temperature (soldering, 10 seconds) . +300C Thermal resis

9、tance, junction-to-case (JC): See MIL-STD-1835 Junction temperature (TJ) +175C 1.4 Recommended operating conditions. Supply voltage range (VCC) . 4.5 V dc minimum to 5.5 V dc maximum Minimum high level input voltage (VIH) 2.0 V dc Maximum low level input voltage (VIL) . 0.8 V dc Case operating tempe

10、rature range (TC) . -55C to +125C _ 1/ Maximum power dissipation is defined as VCCx ICC, and must withstand the added PDdue to short-circuit test; e.g., IOS. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 77004 D

11、EFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL E SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unl

12、ess otherwise specified, the issues of these documents are those listed in the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the solicitation. SPECIFICATION DEPARTMENT OF DEFENSE MIL-PRF-38535 - Integrated Circuits, Manufacturing,

13、General Specification for. STANDARDS DEPARTMENT OF DEFENSE MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. HANDBOOKS DEPARTMENT OF DEFENSE MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircu

14、it Drawings. (Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this draw

15、ing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance

16、with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 m

17、ay be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall no

18、t affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design,

19、 construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth

20、table shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full case

21、operating temperature range. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 77004 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL E SHEET 4 DSCC FORM 2234 APR 97 TABLE I. Electrical perfor

22、mance characteristics. Test Symbol Conditions -55C TC +125C 1/ unless otherwise specified Group A subgroupsDevice type Limits Unit Min Max High level output voltage VOHVCC= 4.5 V, IOH= -1.0 mA, VIH= 2.0 V, VIL= 0.8 V 1, 2, 3 All 2.5 V Low level output voltage VOL VCC= 4.5 V, IOL= 20 mA, VIH= 2.0 V,

23、VIL= 0.8 V 1, 2, 3 All 0.5 V Input clamp voltage VIC VCC= 4.5 V, IIN= -18 mA 1, 2, 3 All -1.5 V High level input current IIH1 VCC= 5.5 V, VIH= 2.7 V 1, 2, 3 All 50 A IIH2 VCC= 5.5 V, VIH= 5.5 V 1, 2, 3 All 1.0 mA Low level input current IIL VCC= 5.5 V, VIL= 0.5 V 1, 2, 3 All -2.0 mA Short circuit ou

24、tput current IOSVCC= 5.5 V, Vout= 0.0 V 1/ 1, 2, 3 All -40 -100 mA Supply current ICCVCC= 5.5 V 1, 2, 3 All 90 mA Functional tests See 4.3.1c 7 All 9 All 10 ns Propagation delay time, output from binary select tPHL1VCC= 5.0 V, RL= 280 5% CL= 15 pF 10% 10, 11 All 14 ns 9 All 19 ns to any 2 levels of

25、delay 2/ CL= 50 pF 10% 10, 11 All 27 ns 9 All 8 ns tPLH1CL= 15 pF 10% 10, 11 All 11 ns 9 All 13 ns CL= 50 pF 10% 10, 11 All 18 ns 9 All 12 ns Propagation delay time, output from binary select tPHL2CL= 15 pF 10% 10, 11 All 17 ns 9 All 17 ns to any 3 levels of delay CL= 50 pF 10% 10, 11 All 24 ns 9 Al

26、l 12 ns tPLH2CL= 15 pF 10% 10, 11 All 17 ns 9 All 17 ns CL= 50 pF 10% 10, 11 All 24 ns 9 All 10 ns Propagation delay time, output from enable tPHL3CL= 15 pF 10% 10, 11 All 14 ns 9 All 15 ns to any 2 levels of delay CL= 50 pF 10% 10, 11 All 21 ns 9 All 8 ns tPLH3CL= 15 pF 10% 10, 11 All 11 ns 9 All 1

27、3 ns CL= 50 pF 10% 10, 11 All 18 ns 1/ Not more than one output should be shorted at a time and the duration of the short circuit condition should not exceed one second. 2/ Propagation delay time testing and maximum clock frequency testing may be performed using either CL= 15 pF or CL= 50 pF. Howeve

28、r, the manufacturer must certify and guarantee that the microcircuits meet the switching test limits specified for a 50 pF load. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 77004 DEFENSE SUPPLY CENTER COLUMBUS

29、 COLUMBUS, OHIO 43216-5000 REVISION LEVEL E SHEET 5 DSCC FORM 2234 APR 97 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 77004 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL E SHEET 6 DSC

30、C FORM 2234 APR 97 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked wi

31、th the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked as listed in MIL-HDBK-103 (see 6.6 herein). 3.5.1 Certification/compliance mark. A compliance indicator C shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance ind

32、icator C shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in M

33、IL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate

34、 of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required in accordance with MIL-PRF-38535, appendix A. 3.9 Verification and review. DSCC, DSCCs

35、agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. Device types 01 Case outlines E, F Terminal number Terminal symbols 1 1 G 2 1A 3 1B 4

36、1Y0 5 1Y1 6 1Y2 7 1Y3 8 GND 9 2Y3 10 2Y2 11 2Y1 12 2Y0 13 2B 14 2A 15 2 G 16 VCC FIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 77004 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO

37、43216-5000 REVISION LEVEL E SHEET 7 DSCC FORM 2234 APR 97 Inputs Outputs Enable Select G B A Y0 Y1 Y2 Y3 H X X H H H H L L L L H H H L L H H L H H L H L H H L H L H H H H H L H = High voltage level L = Low voltage level X = Irrelevant FIGURE 2. Truth table. Provided by IHSNot for ResaleNo reproducti

38、on or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 77004 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL E SHEET 8 DSCC FORM 2234 APR 97 FIGURE 3. Logic diagram. Provided by IHSNot for ResaleNo reproduction or networking permitted wit

39、hout license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 77004 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL E SHEET 9 DSCC FORM 2234 APR 97 4. QUALITY ASSURANCE PROVISIONS 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL

40、-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B,

41、 C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance wi

42、th the intent specified in test method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. TABLE II. Elect

43、rical test requirements. MIL-STD-883 test requirements Subgroups (in accordance with MIL-STD-883, method 5005, table I) Interim electrical parameters (method 5004) - - - Final electrical test parameters (method 5004) 1*, 2, 3, 9 Group A test requirements (method 5005) 1, 2, 3, 7, 9, 10*, 11* Groups

44、C and D end-point electrical parameters (method 5005) 1, 2, 3 * PDA applies to subgroup 1. * Subgroups 10 and 11, if not tested, shall be guaranteed to the specified limits in table I. 4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-S

45、TD-883 including groups A, B, C, and D inspections. The following additional criteria shall apply. 4.3.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 4, 5, 6 and 8 in table I, method 5005 of MIL-STD-883 shall be omitted. c. Subgroup 7 shall include verification

46、 of the truth table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 77004 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL E SHEET 10 DSCC FORM 2234 APR 97 4.3.2 Groups C and D inspections.

47、 a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life test conditions, method 1005 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available

48、 to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1005 of MIL-STD-883. (2) TA= +125C, minimum. (3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535, appendix A. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are inten