DLA SMD-5962-76011 REV H-2005 MICROCIRCUIT DIGITAL LOW-POWER SCHOTTKY TTL MULTIPLEXER MONOLITHIC SILICON《硅单片多路复用器肖脱基小功率TTL数字微型电路》.pdf

《DLA SMD-5962-76011 REV H-2005 MICROCIRCUIT DIGITAL LOW-POWER SCHOTTKY TTL MULTIPLEXER MONOLITHIC SILICON《硅单片多路复用器肖脱基小功率TTL数字微型电路》.pdf》由会员分享，可在线阅读，更多相关《DLA SMD-5962-76011 REV H-2005 MICROCIRCUIT DIGITAL LOW-POWER SCHOTTKY TTL MULTIPLEXER MONOLITHIC SILICON《硅单片多路复用器肖脱基小功率TTL数字微型电路》.pdf（10页珍藏版）》请在麦多课文档分享上搜索。

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED E Remove vendors CAGE 18324, 34335, 07263, 27014. Convert to military drawing format. Add LCC package. 87-06-18 N. A. Hauck F Changes in accordance with NOR 5962-R138-92. -tvn 92-02-21 Monica L. Poelking G Update to reflect latest changes in format

2、 and requirements. Editorial changes throughout. -les 03-01-21 Raymond Monnin H Correct marking paragraph. Editorial changes throughout. - gap 05-12-07 Raymond Monnin CURRENT CAGE CODE 67268 THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED. REV SHET REV SHET REV STATUS REV H H H H H H H H H

3、 OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 PMIC N/A PREPARED BY Joe Kerby DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY D. A. DiCenzo COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY N.A. Hauck MICROCIRCUIT, DIGITAL,

4、LOW-POWER SCHOTTKY TTL, MULTIPLEXER, MONOLITHIC AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 76-03-23 SILICON AMSC N/A REVISION LEVEL H SIZE A CAGE CODE 14933 76011 SHEET 1 OF 9 DSCC FORM 2233 APR 97 5962-E452-05 Provided by IHSNot for ResaleNo reproduction or networking permitted

5、 without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76011 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircui

6、ts in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 76011 01 E X Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) identify the circui

7、t function as follows: Device type Generic number Circuit function 01 54LS153 Dual 4-line to 1-line multiplexer 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 dual-

8、in-line F GDFP2-F16 or CDFP3-F16 16 flat 2 CQCC1-N20 20 square chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage . -0.5 V dc to +7.0 V dc Input voltage range . -1.5 V dc at -18 mA to +5.5 V dc Storage temperatur

9、e range -65C to +150C Maximum power dissipation (PD) 1/ . 55 mW Lead temperature (soldering, 10 seconds) . +300C Thermal resistance, junction-to-case (JC) See MIL-STD-1835 Junction temperature (TJ) . +175C 1.4 Recommended operating conditions. Supply voltage range (VCC) 4.5 V dc minimum to 5.5 V dc

10、maximum Minimum high level input voltage (VIH) . 2.0 V dc Maximum low level input voltage (VIL) 0.7 V dc Case operating temperature range (TC) . -55C to +125C _ 1/ Must withstand the added PDdue to short circuit test (e.g., IOS). Provided by IHSNot for ResaleNo reproduction or networking permitted w

11、ithout license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76011 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and h

12、andbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the solicitation. SPECIFICATION DE

13、PARTMENT OF DEFENSE MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. STANDARDS DEPARTMENT OF DEFENSE MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. HANDBOOKS DEPARTMENT OF DEFENSE MIL-HDBK-103 - Li

14、st of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order

15、 of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Ite

16、m requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufac

17、turer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may mak

18、e modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option

19、 is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal conn

20、ections shall be as specified on figure 1. 3.2.3 Truth table. The truth tables shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance charac

21、teristics are as specified in table I and shall apply over the full case operating temperature range. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76011 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990

22、REVISION LEVEL H SHEET 4 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TC +125C unless otherwise specified Group A subgroupsDevice type Limits Unit Min Max High-level output voltage VOH VCC = 4.5 V, IOH = -400 A VIL= 0.7 V, VIH =2.0 V 1, 2, 3 All

23、2.5 V Low-level output voltage VOL VCC= 4.5 V, IOL= 4 mA VIL= 0.7 V, VIH= 2.0 V 1, 2, 3 All 0.4 V Input clamp voltage VIC VCC= 4.5 V, IIN= -18 mA, TC= +25C 1 All -1.5 V High level input current IIH1 VCC= 5.5 V, VIH= 2.7 V 1, 2, 3 All 20 A IIH2 VCC= 5.5 V, VIH= 5.5 V 1, 2, 3 All 100 A Low level input

24、 current IIL VCC= 5.5 V, VIL= 0.4 V 1, 2, 3 All -400 A Short circuit output current IOS VCC= 5.5 V, VOUT= 0.0 V 1/ 1, 2, 3 All -6 -130 mA Supply current ICCLVCC= 5.5 V 1, 2, 3 All 10 mA Functional tests See 4.3.1c 7 All tPHL19 All 38 ns VCC= 5.0 V, RL= 2 k 5% CL= 15 pF 10% 10, 11 All 53 ns 43 Propag

25、ation delay time, high to low level, select to Y 2/ CL= 50 pF 10% 10, 11 All 60 ns tPLH19 29 CL= 15 pF 10% 10, 11 All 41 ns 34 Propagation delay time, low to high level, select to Y CL= 50 pF 10% 10, 11 All 48 ns tPHL29 32 CL= 15 pF 10% 10, 11 All 45 ns 37 Propagation delay time, high to low level,

26、strobe to Y CL= 50 pF 10% 10, 11 All 52 ns tPLH29 24 CL= 15 pF 10% 10, 11 All 34 ns 29 Propagation delay time, low to high level, strobe to Y CL= 50 pF 10% 10, 11 All 41 ns See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-

27、,-STANDARD MICROCIRCUIT DRAWING SIZE A 76011 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions -55C TC +125C unless otherwise specified Group A subgroupsDevice ty

28、pe Limits Unit Min Max tPHL39 All 26 ns VCC= 5.0 V, RL= 2 k 5% CL= 15 pF 10% 10, 11 All 36 ns 31 Propagation delay time, high to low level, data to Y 2/ CL= 50 pF 10% 10, 11 All 43 ns tPLH39 15 CL= 15 pF 10% 10, 11 All 21 ns 20 Propagation delay time, low to high level, data to Y CL= 50 pF 10% 10, 1

29、1 All 28 ns 1/ Not more than one output should be shorted at a time, and the duration of the short-circuit condition should not exceed one second. 2/ Propagation delay time testing may be performed using either CL= 15 pF or CL= 50 pF. However, the manufacturer must certify and guarantee that the mic

30、rocircuits meet the switching test limits specified for a 50 pF load. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL

31、-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The comp

32、liance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of

33、 supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A

34、 certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required in accordance with MIL-PRF-38535, appendix A. 3.9 Verification and review.

35、DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. Provided by IHSNot for ResaleNo reproduction or networking permitted witho

36、ut license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76011 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 6 DSCC FORM 2234 APR 97 Device types 01 01 Case outlines E, F 2 Terminal number Terminal symbols Terminal symbols 1 (STROBE) 1 G N/C 2 (SELECT) B (STROBE

37、) 1 G 3 (INPUT) 1C3 (SELECT) B 4 (INPUT) 1C2 (INPUT) 1C3 5 (INPUT) 1C1 (INPUT) 1C2 6 (INPUT) 1C0 N/C 7 (OUTPUT) 1Y (INPUT) 1C1 8 GND (INPUT) 1C0 9 (OUTPUT) 2Y (OUTPUT) 1Y 10 (INPUT) 2C0 GND 11 (INPUT) 2C1 N/C 12 (INPUT) 2C2 (OUTPUT) 2Y 13 (INPUT) 2C3 (INPUT) 2C0 14 (SELECT) A (INPUT) 2C1 15 (STROBE)

38、 2 G (INPUT) 2C2 16 VCC N/C 17 - - - (INPUT) 2C3 18 - - - (SELECT) A 19 - - - (STROBE) 2 G 20 - - - VCC FIGURE 1. Terminal connections. SECTION 1 or SECTION 2 Select Inputs Data inputs Strobe Output B A C0 C1 C2 C3 G Y X X X X X X H L L L L X X X L L L L H X X X L H L H X L X X L L L H X H X X L H H

39、 L X X L X L L H L X X H X L H H H X X X L L L H H X X X H L H H = High level. L = Low level. X = Irrelevant. Select inputs A and B are common to both sections FIGURE 2. Truth table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCU

40、IT DRAWING SIZE A 76011 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 7 DSCC FORM 2234 APR 97 FIGURE 3. Logic diagram. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76011 DEFENS

41、E SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 8 DSCC FORM 2234 APR 97 TABLE II. Electrical test requirements. MIL-STD-883 test requirements Subgroups (in accordance with MIL-STD-883, method 5005, table I) Interim electrical parameters (method 5004) - - - Final electrical

42、test parameters (method 5004) 1*, 2, 3, 9 Group A test requirements (method 5005) 1, 2, 3, 7, 9, 10*, 11* Groups C and D end-point electrical parameters (method 5005) 1, 2, 3 * PDA applies to subgroup 1. * Subgroups 10 and 11, if not tested, shall be guaranteed to the specified limits in table I. 4.

43、 QUALITY ASSURANCE PROVISIONS 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance ins

44、pection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upo

45、n request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, e

46、xcept interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. 4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD-883 including groups A, B, C, and D inspections. The following additiona

47、l criteria shall apply. 4.3.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 4, 5, 6, and 8 in table I, method 5005 of MIL-STD-883 shall be omitted. c, Subgroup 7 shall include verification of the truth table. Provided by IHSNot for ResaleNo reproduction or netwo

48、rking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76011 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 9 DSCC FORM 2234 APR 97 4.3.2 Groups C and D inspections. a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life test conditions, method 1005 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and sh