DLA SMD-5962-76008 REV L-2010 MICROCIRCUIT DIGITAL LOW-POWER SCHOTTKY TTL COUNTERS MONOLITHIC SILICON.pdf

《DLA SMD-5962-76008 REV L-2010 MICROCIRCUIT DIGITAL LOW-POWER SCHOTTKY TTL COUNTERS MONOLITHIC SILICON.pdf》由会员分享，可在线阅读，更多相关《DLA SMD-5962-76008 REV L-2010 MICROCIRCUIT DIGITAL LOW-POWER SCHOTTKY TTL COUNTERS MONOLITHIC SILICON.pdf（13页珍藏版）》请在麦多课文档分享上搜索。

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED F Convert to military drawing format. Add LCC package. Add logic diagram. Remove vendors CAGE 34335, 07263, 27014. Change Ident. No. to 67268. 87-10-08 M. A. Frye G Add another column for CLR input on the truth table (see figure 2). Add inversion c

2、ircle on the CLR inputs of the flip flops (see figure 3). Editorial changes throughout the document. 88-04-11 M. A. Frye H Changes in accordance with NOR 5962-R178-92. -tvn 92-04-29 Monica L. Poelking J Update to reflect latest changes in format and requirements. Editorial changes throughout. -les 0

3、2-12-12 Raymond Monnin K Add class “V“ to document. Update to reflect latest changes in format and requirements. Editorial changes throughout. -les 04-01-20 Raymond Monnin L Update drawing to current requirements. Editorial changes throughout. - gap 10-05-06 Charles F. Saffle CURRENT CAGE CODE 67268

4、 The original first sheet of this drawing has been replaced. REV SHET REV SHET REV STATUS REV L L L L L L L L L L L L OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 PMIC N/A PREPARED BY W. A. Denick DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil STANDARD MICROCIRCUIT DRA

5、WING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY R. F. Gonzales APPROVED BY N. A. Hauck MICROCIRCUIT, DIGITAL, LOW-POWER SCHOTTKY TTL, COUNTERS, MONOLITHIC SILICON DRAWING APPROVAL DATE 76-03-19 AMSC N/A REVISION LEVEL L SIZE A CAGE CODE

6、14933 76008 SHEET 1 OF 12 DSCC FORM 2233 APR 97 5962-E152-10 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76008 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL L SHEET 2 DSCC FORM 2234 A

7、PR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Whe

8、n available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following examples. For device classes M and Q: 76008 01 E A Drawing number Device type (see 1.2.2) Case outline (see 1.2.4)Lead finish (see 1.2.5)For device class V: 5962

9、- 76008 01 V E X Federal stock class designator RHAdesignator (see 1.2.1) Device type (see 1.2.2)Device class designatorCase outline (see 1.2.4) Leadfinish (see 1.2.5) / (see 1.2.3) /Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA l

10、evels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit

11、 function as follows: Device type Generic number Circuit function 01 54LS161 Synchronous, 4-bit binary counter 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as listed below. Since the device class designator has been added after

12、 the original issuance of this drawing, device classes M and Q designators will not be included in the PIN and will not be marked on the device. Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircui

13、ts in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76008 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-399

14、0 REVISION LEVEL L SHEET 3 DSCC FORM 2234 APR 97 1.2.4 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 Dual-in-line package F GDFP2-F16 or CDFP3-F16 16 Flat package 2 CQCC1-N2

15、0 20 Square chip carrier 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. 1.3 Absolute maximum ratings. 1/ Supply voltage . -0.5 V dc to +7.0 V dc Input voltage range . -1.5 V dc at -18 mA to +5.5 V dc Sto

16、rage temperature range -65C to +150C Maximum power dissipation (PD) 2/ . 176mW Lead temperature (soldering, 10 seconds) +300C Thermal resistance, junction-to-case (JC) See MIL-STD-1835 Junction temperature (TJ) +175C 1.4 Recommended operating conditions. Supply voltage range (VCC) . 4.5 V dc minimum

17、 to 5.5 V dc maximum Minimum high level input voltage (VIH) 2.0 V dc Maximum low level input voltage (VIL) . 0.7 V dc Case operating temperature range (TC) -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbo

18、oks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF

19、DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents a

20、re available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the tex

21、t of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. _ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degr

22、ade performance and affect reliability. 2/ Must withstand the added PDdue to short circuit test e.g., IOS. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76008 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-

23、3990 REVISION LEVEL L SHEET 4 DSCC FORM 2234 APR 97 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modifi

24、cation in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimension

25、s. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. T

26、he terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. 3.2.5 Test circuit. The test circuit shall be as specified on figure 4. 3.3 Electrical performanc

27、e characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The

28、 electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the

29、 entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Markin

30、g for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535,

31、 appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from

32、 a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V

33、, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shal

34、l be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.

35、9 Verification and review for device class M. For device class M, DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Mic

36、rocircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 12 (see MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE

37、 A 76008 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL L SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TC+125C Group A subgroups Limits Unit unless otherwise specified Min Max High level output voltage VOH VCC = 4

38、.5 V, IOH = -400 A VIN= 0.7 V or 2.0 V 1, 2, 3 2.5 V Low level output voltage VOL VCC= 4.5 V, IOL= 4 mA VIN= 0.7 V or 2.0 V 1, 2, 3 0.4 V Input clamp voltage VIC VCC= 4.5 V, IIN= -18 mA, TC= +25C 1 -1.5 V High level input current at data, clear, or enable P IIH1 VCC= 5.5 V, VIH= 2.7 V 1, 2, 3 24 A H

39、igh level input current at load, clock, or enable T IIH2 1, 2, 3 40 A High level input current at data, clear, or enable P IIH3 VCC= 5.5 V, VIH= 5.5 V 1, 2, 3 100 A High level input current at load, clock, or enable T IIH4 1, 2, 3 200 A Low level input current at data, clear, or enable P IIL1 VCC= 5

40、.5 V, VIL= 0.4 V 1, 2, 3 -480 A Low level input current IIL2 VCC= 5.5 V, VIL= 0.4 V Load, Enable T 1, 2, 3 -800 A IIL3 Clock 1, 2, 3 -1200 A Short-circuit output current IOS VCC= 5.5 V 1/ 1, 2, 3 -6 -130 mA High level supply current ICCHVCC= 5.5 V 1, 2, 3 31 mA Low level supply current ICCL1, 2, 3 3

41、2 mA Functional tests See 4.4.1c 7, 8 Maximum clock frequency FMAX VCC= 5.0 V, RL= 2 k5% CL= 15 pF 10% 9 25 MHz 10, 11 152/ CL= 50 pF 10% 9 20 MHz 11 14Propagation delay time, high-to-low level, clear to Q tPHL1CL= 15 pF 10% 9 38 ns 10, 11 53CL= 50 pF 10% 9 43 ns 11 60Propagation delay time, low-to-

42、high level, clock to carry tPLH2CL= 15 pF 10% 9 35 ns 10, 11 49CL= 50 pF 10% 9 40 ns 11 56See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76008 DEFENSE SUPPLY CENTER COLUMBUS COLUMBU

43、S, OHIO 43218-3990 REVISION LEVEL L SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions -55C TC+125C Group A subgroups Limits Unit unless otherwise specified Min Max Propagation delay time, high-to-low level, clock to carry tPHL2VCC= 5.0

44、V, RL= 2 k5% CL= 15 pF 10% 9 35 ns 10, 11 492/ CL= 50 pF 10% 9 40 ns 10, 11 56Propagation delay time, low-to-high level, clock (load input high) to Q tPLH3CL= 15 pF 10% 9 24 ns 10, 11 34CL= 50 pF 10% 9 29 ns 10, 11 41Propagation delay time, high-to-low level, clock (load input high) to Q tPHL3CL= 15

45、 pF 10% 9 27 ns 10, 11 38 ns CL= 50 pF 10% 9 32 ns 10, 11 45Propagation delay time, low-to-high level, clock (load input low) to Q tPLH4CL= 15 pF 10% 9 25 ns 10, 11 35CL= 50 pF 10% 9 30 ns 10, 11 42Propagation delay time, high-to-low level, clock (load input low) to Q tPHL4CL= 15 pF 10% 9 29 ns 10,

46、11 41CL= 50 pF 10% 9 34 ns 10, 11 48Propagation delay time, low-to-high level, enable T to carry tPLH5CL= 15 pF 10% 9 23 ns 10, 11 32CL= 50 pF 10% 9 28 ns 10, 11 39Propagation delay time, high-to-low level, enable T to carry tPHL5CL= 15 pF 10% 9 23 ns 10, 11 32CL= 50 pF 10% 9 28 ns 10, 11 391/ Not m

47、ore than one output should be shorted at a time, and the duration of the short-circuit condition should not exceed one second. 2/ Propagation delay time testing may be performed using either CL= 15 pF or CL= 50 pF. However, the manufacturer must certify and guarantee that the microcircuits meet the

48、switching test limits specified for a 50 pF load. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76008 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL L SHEET 7 DSCC FORM 2234 APR 97 Device type 01 Case outlines E, F 2 Terminal number Terminal symbols Terminal symbols 1 CLR (clear) N/C 2 CLK (clock) CLR (clear) 3 A CLK (clock)4 B A 5 C B 6 D N/C 7 ENP (enable P) C 8 GND D 9 LOAD ENP (enable P)10 ENT (enable T) GND 11 QDN/C 12 QCL