DLA SMD-5962-76002 REV H-2005 MICROCIRCUIT DIGITAL TTL LOW-POWER SCHOTTKY MULTIPLEXER MONOLITHIC SILICON《硅单片多路复用器肖脱基小功率TTL数字微型电路》.pdf

《DLA SMD-5962-76002 REV H-2005 MICROCIRCUIT DIGITAL TTL LOW-POWER SCHOTTKY MULTIPLEXER MONOLITHIC SILICON《硅单片多路复用器肖脱基小功率TTL数字微型电路》.pdf》由会员分享，可在线阅读，更多相关《DLA SMD-5962-76002 REV H-2005 MICROCIRCUIT DIGITAL TTL LOW-POWER SCHOTTKY MULTIPLEXER MONOLITHIC SILICON《硅单片多路复用器肖脱基小功率TTL数字微型电路》.pdf（11页珍藏版）》请在麦多课文档分享上搜索。

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED F Remove vendors CAGE 18234 and 27014 from drawing. Change to Military Drawing. Add LCC package. 87-06-18 N. A. HAUCK G Update to reflect latest changes in format and requirements. Editorial changes throughout. - les 02-11-14 R. MONNIN H Make corre

2、ction to Marking paragraph 3.5. - ro 05-06-14 R. MONNIN CURRENT CAGE CODE 67268 THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED. REV SHET REV SHET REV STATUS REV H H H H H H H H H OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 PMIC N/A PREPARED BY W. A. DANIELS DEFENSE SUPPLY CENTER COLUMBUS STANDARD M

3、ICROCIRCUIT DRAWING CHECKED BY R. F. GONZALEZ COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY N. A. HAUCK AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 76-03-15 MICROCIRCUIT, DIGITAL, TTL, LOW-POWER SCHOTTKY, MULTIPL

4、EXER, MONOLITHIC SILICON AMSC N/A REVISION LEVEL H SIZE A CAGE CODE 14933 76002 SHEET 1 OF 9 DSCC FORM 2233 APR 97 5962-E333-05 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76002 DEFENSE SUPPLY CENTER COLUMBUS

5、COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN

6、is as shown in the following example: 76002 01 E X Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54LS157 Quadruple, 2-input multipl

7、exer 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 Dual-in-line F GDFP2-F16 or CDFP3-F16 16 Flat pack 2 CQCC1-N20 20 Square leadless chip carrier 1.2.3 Lead finish

8、. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage range . -0.5 V dc to +7.0 V dc Input voltage range . -1.5 V dc at -18 mA to +7.0 V dc Storage temperature range -65C to +150C Maximum power dissipation (PD) per device 88 mW 1/ Lead temperatu

9、re (soldering, 10 seconds) +300C Thermal resistance, junction-to-case (JC): Cases E and F . See MIL-STD-1835 Case 2 80C/W Junction temperature (TJ) +175C 1.4 Recommended operating conditions. Supply voltage range (VCC) 4.5 V dc minimum to 5.5 V dc maximum Minimum high level input voltage (VIH) 2.0 V

10、 dc Maximum low level input voltage (VIL) . 0.7 V dc Case operating temperature range (TC) -55C to +125C _ 1/ Must withstand the added PDdue to short circuit test; e.g., IOS. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWI

11、NG SIZE A 76002 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent spec

12、ified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standa

13、rd Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/q

14、uicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing take

15、s precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices a

16、nd as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturer

17、s approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications

18、 shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MI

19、L-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Logic diagram. The

20、logic diagram shall be as specified on figure 3. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The

21、 electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76002 DEFENSE SUPPLY CEN

22、TER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 4 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TC +125C unless otherwise specified Group A subgroupsDevice type Limits Unit Min Max High level output voltage VOH VCC= 4.5 V, IOH= -400

23、A, VIN= 0.7 V or 2.0 V 1, 2, 3 All 2.5 V Low level output voltage VOL VCC= 4.5 V, IOL= 4 mA, VIN= 0.7 V or 2.0 V 1, 2, 3 All 0.4 V Input clamp voltage VIC VCC= 4.5 V, IIN= -18 mA, TC= +25C 1 All -1.5 V High level input current IIH1 VCC= 5.5 V, S or G in 1, 2, 3 All 40 A VIH= 2.7 V A or B in 20 IIH2

24、VCC= 5.5 V, S or G in 200 VIH= 7.0 V A or B in 100 Low level input current IIL VCC= 5.5 V, S or G in 1, 2, 3 All -800 A VIL= 0.4 V A or B in -400 Short-circuit output current IOS VCC= 5.5 V, VOUT= 0.0 V 1/ 1, 2, 3 All -6 -130 mA Supply current ICC VCC= 5.5 V 1, 2, 3 All 16 mA Functional tests See 4.

25、3.1c 7 All tPHL19 All 27 ns VCC= 5.0 V, RL= 2 k 5% CL= 15 pF 10% 10, 11 38 9 32 Propagation delay time, high-to-low-level, 2/ select to Y CL= 50 pF 10% 10, 11 48 tPLH19 All 23 ns VCC= 5.0 V, RL= 2 k 5% CL= 15 pF 10% 10, 11 32 9 28 Propagation delay time, low-to-high-level, 2/ select to Y CL= 50 pF 1

26、0% 10, 11 42 tPHL29 All 21 ns VCC= 5.0 V, RL= 2 k 5% CL= 15 pF 10% 10, 11 29 9 26 Propagation delay time, high-to-low-level, 2/ strobe to Y CL= 50 pF 10% 10, 11 39 tPLH29 All 20 ns VCC= 5.0 V, RL= 2 k 5% CL= 15 pF 10% 10, 11 28 9 25 Propagation delay time, low-to-high-level, 2/ strobe to Y CL= 50 pF

27、 10% 10, 11 38 See footnotes at end of table.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76002 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 5 DSCC FORM 2234 APR 97 TABLE I. E

28、lectrical performance characteristics - Continued. Test Symbol Conditions -55C TC +125C unless otherwise specified Group A subgroupsDevice type Limits Unit Min Max tPHL39 All 14 ns VCC= 5.0 V, RL= 2 k 5% CL= 15 pF 10% 10, 11 20 9 19 Propagation delay time, high-to-low-level, 2/ data to Y CL= 50 pF 1

29、0% 10, 11 29 tPLH39 All 14 ns VCC= 5.0 V, RL= 2 k 5% CL= 15 pF 10% 10, 11 20 9 19 Propagation delay time, low-to-high-level, 2/ data to Y CL= 50 pF 10% 10, 11 29 1/ Not more than one output should be shorted at a time, and the duration of the short-circuit condition should not exceed one second. 2/

30、Propagation delay time testing may be performed using either CL= 15 pF or CL= 50 pF. However, the manufacturer must certify and guarantee that the microcircuits meet the switching test limits specified for a 50 pF load. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The

31、part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall b

32、e replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see

33、 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance

34、as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review. DSCC, DSCCs agent, and the acqui

35、ring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD

36、 MICROCIRCUIT DRAWING SIZE A 76002 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 6 DSCC FORM 2234 APR 97 Device type 01 Case outlines E, F 2 Terminal number Terminal symbol 1 Select A /B NC 2 1A Select A /B 3 1B 1A 4 1Y 1B 5 2A 1Y 6 2B NC 7 2Y 2A 8 GND 2B 9 3Y 2Y 10

37、 3B GND 11 3A NC 12 4Y 3Y 13 4B 3B 14 4A 3A 15 Strobe G 4Y 16 VCCNC 17 - 4B 18 - 4A 19 - Strobe G 20 - VCCFIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76002 DEFENSE SUPPLY CENTER

38、 COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 7 DSCC FORM 2234 APR 97 Inputs Output Y Strobe G Select A /B A B H X X X L L L L X L L L H X H L H X L L L H X H H H = High Level, L = Low level, X = Irrelevant FIGURE 2. Truth table. FIGURE 3. Logic diagram. Provided by IHSNot for ResaleNo

39、reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76002 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 8 DSCC FORM 2234 APR 97 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall b

40、e in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883.

41、(1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as appl

42、icable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufactur

43、er. 4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD-883 including groups A, B, C, and D inspections. The following additional criteria shall apply. 4.3.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Su

44、bgroups 4, 5, 6, and 8 in table I, method 5005 of MIL-STD-883 shall be omitted. c. Subgroups 7 shall include verification of the truth table. 4.3.2 Groups C and D inspections. a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life test conditions, method 10

45、05 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power d

46、issipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. (2) TA= +125C, minimum. (3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,

47、-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76002 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 9 DSCC FORM 2234 APR 97 TABLE II. Electrical test requirements. MIL-STD-883 test requirements Subgroups (in accordance with MIL-STD-883, method 5005, table I) Interim electri

48、cal parameters (method 5004) - Final electrical test parameters (method 5004) 1*,2,3,9 Group A test requirements (method 5005) 1,2,3,7,9,10*,11* Groups C and D end-point electrical parameters (method 5005) 1,2,3 * PDA applies to subgroup 1. * Subgroups 10 and 11, if not tested, shall be guaranteed to the specified limits in table I. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535, appendix A. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for u