DLA SMD-5962-11237 REV A-2012 MICROCIRCUIT MEMORY DIGITAL CMOS 512K X 32-BIT (16M) WITH EMBEDDED EDAC LOW VOLTAGE SRAM MONOLITHIC SILICON.pdf
《DLA SMD-5962-11237 REV A-2012 MICROCIRCUIT MEMORY DIGITAL CMOS 512K X 32-BIT (16M) WITH EMBEDDED EDAC LOW VOLTAGE SRAM MONOLITHIC SILICON.pdf》由会员分享,可在线阅读,更多相关《DLA SMD-5962-11237 REV A-2012 MICROCIRCUIT MEMORY DIGITAL CMOS 512K X 32-BIT (16M) WITH EMBEDDED EDAC LOW VOLTAGE SRAM MONOLITHIC SILICON.pdf(27页珍藏版)》请在麦多课文档分享上搜索。
1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add new footnote 5/ to tAVQV1 resulting in changes to the rest of the footnote sequence in Table IA. Removed erroneous footnote from tAVET parameter in Table IA. Changed footnotes 5/ through 8/ to be 6/ through 9/ and added new footnote 5/ at the
2、 end of Table IA. lhl 12-05-01 Charles F. Saffle REV SHEET REV A A A A A A A A A A A A SHEET 15 16 17 18 19 20 21 22 23 24 25 26 REV STATUS REV A A A A A A A A A A A A A A OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Laura H. Leeper DLA LAND AND MARITIME COLUMBUS, OHIO 43218
3、-3990 http:/www.landandmaritime.dla.mil STANDARD MICROCIRCUIT DRAWING CHECKED BY Rajesh Pithadia THIS DRAWING IS AVAILABLE FOR USE BY All DEPARTMENTS APPROVED BY Charles F. Saffle MICROCIRCUIT, MEMORY, DIGITAL, CMOS, 512K X 32-BIT (16M) WITH EMBEDDED EDAC, LOW VOLTAGE SRAM, MONOLITHIC SILICON AND AG
4、ENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 12-03-21 AMSC N/A REVISION LEVEL A SIZE A CAGE CODE 67268 5962-11237 SHEET 1 OF 26 DSCC FORM 2233 APR 97 5962-E328-12 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAW
5、ING SIZE A 5962-11237 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice
6、of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN. 1.2 PIN. The PIN shall be as shown in the following example: 5962 - 11237 01 V X C Federal RHA D
7、evice Device Case Lead stock class designator type class outline finish designator (see 1.2.1) (see 1.2.2) designator (see 1.2.4) (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-PRF-38535 specified RHA levels and are marke
8、d with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device types. The device types shall identify the circuit function as
9、follows: Device type Generic number Circuit function Access time 01 SMV512K32 512K X 32-bit CMOS SRAM 20 ns 1.2.3 Device class designator. The device class designator shall be a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor
10、self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q, V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) shall be as designated in MIL-STD-1835 and as follows: O
11、utline letter Descriptive designator Terminals Package style X See figure 1 76 Flat pack 1.2.5 Lead finish. The lead finish shall be as specified in MIL-PRF-38535 for classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted
12、 without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-11237 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ 2/ Supply voltage range, (VDD1) . -0.3 V dc to +2.0 V dc Supply voltage range, (VDD2) . -0.3 V
13、 dc to +3.8 V dc Voltage range on any pin . -0.3 V dc to +3.8 V dc Storage temperature range, (TSTG) -65C to +150C Power dissipation, (PD) 1.2 W Junction temperature, (TJ) . +150C Input current, dc (II) + 5 mA Thermal resistance, junction-to-case, (JC): Case X +5C/W 1.4 Recommended operating conditi
14、ons. 1/ Supply voltage range, (VDD1) . +1.7 V dc to +1.9 V dc Supply voltage range, (VDD2) . +3.0 V dc to +3.6 V dc Supply voltage, (VSS) . 0 V dc Operating case temperature range, (TC) -55C to +125C Input voltage, dc 0 V dc to VDD2 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, an
15、d handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Cir
16、cuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780
17、 - Standard Microcircuit Drawings. (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Non-Government publications. The following document(s) for
18、m a part of this document to the extent specified herein. Unless otherwise specified, the issues of the documents are the issues of the documents cited in the solicitation. JEDEC INTERNATIONAL (JEDEC) JEDEC Standard No. 78 - IC Latch-Up Test. (Copies of this document are available online at www.jede
19、c.org/ or from JEDEC Solid State Technology Association, 3103 North 10th Street, Suite 240-S, Arlington, VA 22201). (Non-Government standards and other publications are normally available from the organizations that prepare or distribute the documents. These documents also may be available in or thr
20、ough libraries or other informational services.) _ 1/ Over operating free-air temperature range (unless otherwise noted). 2/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. P
21、rovided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-11237 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 4 DSCC FORM 2234 APR 97 2.3 Order of precedence. In the event of a conflict between
22、the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements fo
23、r device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein, or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for d
24、evice class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q a
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