DLA SMD-5962-07217 REV A-2009 MICROCIRCUIT DIGITAL MIL-STD-1750A 16-BIT MICROPROCESSOR MONOLITHIC SILICON.pdf

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1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add maximum pin current rating to paragraph 1.3 on sheet 3. Update boilerplate paragraphs to current MIL-PRF-38535 requirements. - CFS 09-04-07 Thomas M. Hess REV SHET REV A A A A A A A A A A A A A A A SHEET 15 16 17 18 19 20 21 22 23 24 25 26 27

2、 28 29 REV STATUS REV A A A A A A A A A A A A A A OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Charles F. Saffle DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Charles F. Saffle COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILAB

3、LE FOR USE BY ALL DEPARTMENTS APPROVED BY Thomas M. Hess MICROCIRCUIT, DIGITAL, MIL-STD-1750A 16-BIT AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 07-11-02 MICROPROCESSOR, MONOLITHIC SILICON AMSC N/A REVISION LEVEL SIZE A CAGE CODE 67268 5962-07217 A SHEET 1 OF 29 DSCC FORM 2233 AP

4、R 97 5962-E234-09 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-07217 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing

5、 documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Har

6、dness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 07217 01 Q X A Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2)Device class designatorCase outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) /

7、Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate

8、 RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 MDC281 MIL-STD-1750A 16-Bit Microprocessor 1.2.3 Device class designator. The device class designator is a single

9、letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification

10、 to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style X See figure 1 256 Land grid array 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and

11、 V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-07217 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 3 DSCC FORM 2234 APR 9

12、7 1.3 Absolute maximum ratings. 1/ 2/ Supply voltage range (VDD) . -0.3 V dc to 7.0 V dc Input voltage range (all inputs) (VIN) . -0.3 V dc to VDD+0.3 V dc Current through any pin (except VDDand GND) (IP) . -20 mA to +20 mA Storage temperature range (TSTG) -65oC to +150oC Operating temperature range

13、 (TC) -55oC to +125oC 1.4 Recommended operating conditions. Supply voltage range (VDD) . +4.5 V dc to +5.5 V dc Minimum high-level input voltage (VIH) . +2.4 V dc Maximum low-level input voltage (VIL) +0.8 V dc Maximum low-level output current (IOL) 2.0 mA Maximum high-level output current (IOH) . -

14、1.4 mA Operating temperature range (TC) -55oC to +125oC 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these do

15、cuments are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic C

16、omponent Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700

17、 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations u

18、nless a specific exemption has been obtained. _ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. These are internal stress ratings, and functional operation of the device at these or any other conditions beyond those indicated in the “Recommended Operating Cond

19、itions” section is not implied. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ All voltages are with respect to GND. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 596

20、2-07217 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 4 DSCC FORM 2234 APR 97 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the d

21、evice manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specif

22、ied herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outline. The case outline shall be in a

23、ccordance with 1.2.4 herein and figure 1. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.2.3 Block diagram. The block diagram shall be as specified on figure 3. 3.2.4 Architecture diagram. The architecture diagram shall be as specified on figure 4. 3.2.5 Te

24、st circuits. The test circuits shall be as specified on figure 5. 3.2.6 Timing waveforms. The timing waveforms shall be as specified on figure 6. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteris

25、tics and postirradiation parameter limits are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in

26、 table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on th

27、e device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certificatio

28、n mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-

29、38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of comp

30、liance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3

31、.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device

32、 class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DSCC, DSCCs agent, and the acquiring activity retain the option

33、 to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group numb

34、er 105 (see MIL-PRF-38535, appendix A).Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-07217 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 5 DSCC FORM 2234 APR 97 TABLE I. El

35、ectrical performance characteristics. Test Symbol Conditions 1/ -55C TC+125C +4.5 V VDD +5.5 V Group A subgroups Device type Limits Unit unless otherwise specified Min Max Low level output voltage VOLVDD= 5.5 V, IOL = 2.0 mA VIH= 2.4 V, VIL= 0.8 V 0.5 V High level output voltage VOHVDD= 4.5 V, IOH=

36、-1.4 mA VIH= 2.4 V, VIL= 0.8 V 2.4 V Low level input current IILVDD= 5.5 V, VIN= 0.0 V -30 A High level input current IIHVDD= 5.5 V, VIN= 5.5 V 30 A High impedance output current high IOZHVDD= 5.5 V, VOUT= 5.5 V 90 A High impedance output current low IOZLVDD= 5.5 V, VOUT= 0.0 V -90 A Dynamic supply

37、current IDDVDD= 5.5 V, f = 24.0 MHz 0.5MHz 1, 2, 3 All 155 mA Functional tests See 4.4.1b 7, 8 All See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-07217 DEFENSE SUPPLY CENTER CO

38、LUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions 1/ 4/ -55C TC+125C +4.5 V VDD +5.5 V Group A subgroups Device type Limits Unit 2/ 3/ unless otherwise specified Min Max Setup time, RESE

39、T to SYNCn low tS15/ 30.0 ns Hold time, RESET to SYNCn low tH25/ 15.0 Delay time, RESET high to RESET low (Measured in SYNCn cycles) tP35/ 2 SYN Delay time, OSC high to SYNCn low tP4Load Circuit 1 See figure 5 10.0 38.0 ns Delay time, OSC high to SYNCn high tP5Load Circuit 1 See figure 5 10.0 40.0 n

40、s Delay time, SYNCn low to SYNCn low (Deviation from 5) tSY66/ 7/ Load Circuit 1 See figure 5 -2.0 2.0 ns Delay time, SYNCn low to AS high (Deviation from 1) tP78/ Load Circuit 2 See figure 5 -5.0 5.0 ns Delay time, SYNCn low to AS low (Deviation from 2.5) tP8Load Circuit 2 See figure 5 -10.0 15.0 n

41、s Delay time, SYNCn low to DSn low (Deviation from 3, Read) tP9Load Circuit 2 See figure 5 -5.0 20.0 ns Delay time, SYNCn low to DSn high (Read) tP10Load Circuit 2 See figure 5 -5.0 25.0 ns Delay time, SYNCn low to DSn low (Deviation from 3, Write) tP11Load Circuit 2 See figure 5 -5.0 20.0 ns Delay

42、time, SYNCn low to DSn high (Deviation from 4.5, Write) tP127/ Load Circuit 2 See figure 5 -5.0 10.0 ns Delay time, SYNCn low to DDn low (Deviation from 3) tP13Load Circuit 1 See figure 5 60.0 ns Delay time, SYNCn low to DDn high tP14Load Circuit 1 See figure 5 9, 10, 11 All -5.0 60.0 ns See footnot

43、es at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-07217 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performanc

44、e characteristics - Continued. Test Symbol Conditions 1/ 4/ -55C TC+125C +4.5 V VDD +5.5 V Group A subgroups Device type Limits Unit 2/ 3/ unless otherwise specified Min Max Delay time, SYNCn low to Address valid tAC15Load Circuit 3 See figure 5 65.0 ns Delay time, Address valid after SYNCn low (Dev

45、iation from 3) tV16Load Circuit 3 See figure 5 0.0 ns Delay time, SYNCn low to AD bus Hi-Z (Deviation from 3, Read) tP175/ 9/ Load Circuit 3 See figure 5 50.0 ns Delay time, SYNCn low to AD bus active (Read) tP185/ Load Circuit 3 See figure 5 5.0 ns Delay time, SYNCn low to data valid (Deviation fro

46、m 3) tV19Load Circuit 3 See figure 5 43.0 ns Delay time, Data valid after SYNCn low (Write) tV20 Load Circuit 3 See figure 5 8.0 ns Setup time, Data to SYNCn low (Read) tS21 25.0 ns Hold time, Data to SYNCn low (Read) tH22 10/ Load Circuit 3 See figure 5 0.0 ns Delay time, SYNCn low to M/IOn, RDWn,

47、INOPn valid tV23Load Circuit 2 See figure 5 57.5 ns Delay time, M/IOn, RDWn, IN/Opn valid after SYNCn low tV24Load Circuit 2 See figure 5 5.0 ns Setup time, RDYn to OSC low tS255/ 10.0 ns Hold time, RDYn after OSC low tH2610.0 ns Delay time, SYNCn low to DMAE valid tV27Load Circuit 1 See figure 5 85

48、.0 ns Delay time, DMAE valid after SYNCn low tV28Load Circuit 1 See figure 5 0.0 ns Setup time, DMARn to SYNCn low tS2930.0 ns Hold time, DMARn after SYNCn low tH309, 10, 11 All 10.0 ns See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-07217 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 8 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions 1/ 4/ -55C TC