DLA SMD-5962-07204 REV A-2013 MICROCIRCUIT DIGITAL-LINEAR 14-BIT 400 MSPS DIGITAL TO ANALOG CONVERTER MONOLITHIC SILICON.pdf
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1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Redrawn. Paragraphs updated to MIL-PRF-38535 requirements. - drw 13-08-27 Charles F. Saffle REV SHEET REV A A A A SHEET 15 16 17 18 REV STATUS REV A A A A A A A A A A A A A A OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY R
2、ajesh Pithadia DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.landandmaritime.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY Rajesh Pithadia APPROVED BY Robert M. Heber MICROCIRCUIT, DIGITAL-L
3、INEAR, 14-BIT, 400 MSPS DIGITAL TO ANALOG CONVERTER, MONOLITHIC SILICON DRAWING APPROVAL DATE 07-08-22 AMSC N/A REVISION LEVEL A SIZE A CAGE CODE 67268 5962-07204 SHEET 1 OF 18 DSCC FORM 2233 APR 97 5962-E549-13 Provided by IHSNot for ResaleNo reproduction or networking permitted without license fro
4、m IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-07204 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device class Q) and space application
5、 (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 07204 0
6、1 V X C Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2) Device class designator Case outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA level
7、s and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type. The device type identifies the circuit function as follows: Device type Generic number Circuit function 01 DAC5675A 14 bit, 400 MSPS digital-to-analog converter 1.2.3 Device class designat
8、or. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline. The case outline are as designated in MIL-STD-1835 and as follows: Outline
9、 letter Descriptive designator Terminals Package style X See figure 1 52 Quad flat pack with non-conductive tie bar 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V. Provided by IHSNot for ResaleNo reproduction or networking permitted without license fro
10、m IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-07204 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ Supply voltage range: AVDD-0.3 V to +3.6 V 2/ DVDD-0.3 V to +3.6 V 3/ AVDDto DVDD. -3.6 V to +3.6 V Voltage betwee
11、n AGND and DGND -0.3 V to +0.5 V CLK, CLKC -0.3 V to AVDD+0.3 V 2/ Digital input D130A, D130B 3/, SLEEP, DLLOFF . -0.3 V to DVDD+0.3 V IOUT1, OUT2 -1 V to AVDD+ 0.3 V 2/ EXTIO, BIAS -1 V to AVDD+ 0.3 V 2/ Peak input current (any input) 20 mA Peak total input current (all inputs) -30 mA Storage tempe
12、rature range (TSTG) -65C to +150C Lead temperature 1.6 mm (1/16 inch) from the case for 10 seconds +260C Thermal resistance, junction-to-ambient (JA) 21.813C/W 4/, 5/ Thermal resistance, junction-to-case (JC) . 0.849C/W 4/, 5/, 6/ 1.4 Recommended operating conditions. Supply voltage : AVDD3.3 V DVDD
13、3.3 V Operating free-air temperature range (TA) -55C to +125C Estimated device life at elevated temperatures electromigration fail modes: _ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and aff
14、ect reliability. 2/ Measured with respect to AGND. 3/ Measured with respect to DGND. 4/ Heat slug connected to PCB thermal plane. Airflow is at 0 LFM (no airflow). 5/ Specified with the thermal bond pad on the backside of the package soldered to a 2 ounce CU plate PCB thermal plane. 6/ Per MIL-STD-8
15、83 method 1012.1. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-07204 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 4 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government sp
16、ecification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-
17、PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcirc
18、uit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/quicksearch.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflic
19、t between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requi
20、rements for device classes Q and V shall be in accordance with MIL-PRF-38535 as specified herein, or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. 3.2 Design, construction, and ph
21、ysical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V. 3.2.1 Case outline. The case outline shall be in accordance with 1.2.4 herein and figure 1. 3.2.2 Terminal connections. The terminal connections shall be
22、 as specified on figure 2. 3.2.3 Block diagram. The block diagram shall be as specified on figure 3. 3.2.4 Timing waveform. The timing waveform shall be as specified on figure 4. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the e
23、lectrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical te
24、sts for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the opt
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