DLA SMD-5962-04203-2004 MICROCIRCUIT LINEAR WIDEBAND VIDEO OPERATIONAL AMPLIFIER WITH SHUT DOWN MONOLITHIC SILICON《硅单片降压宽带视频运算扬声器线性微型电路》.pdf

《DLA SMD-5962-04203-2004 MICROCIRCUIT LINEAR WIDEBAND VIDEO OPERATIONAL AMPLIFIER WITH SHUT DOWN MONOLITHIC SILICON《硅单片降压宽带视频运算扬声器线性微型电路》.pdf》由会员分享，可在线阅读，更多相关《DLA SMD-5962-04203-2004 MICROCIRCUIT LINEAR WIDEBAND VIDEO OPERATIONAL AMPLIFIER WITH SHUT DOWN MONOLITHIC SILICON《硅单片降压宽带视频运算扬声器线性微型电路》.pdf（11页珍藏版）》请在麦多课文档分享上搜索。

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED REV SHET REV SHET REV STATUS REV OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 PMIC N/A PREPARED BY RICK OFFICER DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY RAJESH PITHADIA COLUMBUS, OHIO 43216 http:/www.dscc.dla.mil THIS DRAWING

2、 IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY RAYMOND MONNIN MICROCIRCUIT, LINEAR, WIDEBAND VIDEO OPERATIONAL AMPLIFIER WITH SHUT DOWN, AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 04-03-22 MONOLITHIC SILICON AMSC N/A REVISION LEVEL SIZE A CAGE CODE 67268 5962-04203 SHEET 1

3、 OF 10 DSCC FORM 2233 APR 97 5962-E189-04 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-04203 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1

4、.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a c

5、hoice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 04203 01 Q P X Federal stock class designator RHA designator (see 1.2.1) Devicetype (see 1.2.2) Device class designator Caseoutline (see 1.2.4) Lead finish (see

6、1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are mark

7、ed with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 LMH6720 Wideband video operational amplifier with shut down 1.2.3 Device class designator.

8、The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix

9、A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style P GDIP1-T8 or CDIP2-T8 8 Dual-in-line Z GDFP1-G10 10 Flat pack with gullwing leads 1.2.

10、5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-04203 DEFENSE SUPPLY

11、 CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ Supply voltage ( VCC) . 6.75 V dc Output current ( IOUT) . 2/ Common mode input voltage . VCCDifferential input voltage 2.2 V Shutdown pin voltage . +VCCto +VCC/ 2 1 V 3/ Maximum

12、junction temperature ( TJ) . +150C 4/ Lead temperature (soldering, 10 seconds) +300C Storage temperature range -65C TA +150C Thermal resistance, junction to case ( JC): Case P 30C/W Case Z 40C/W Thermal resistance, junction to ambient ( JA): Case P 170C/W still air 105C/W 500 linear feet per minute

13、air flow Case Z 230C/W still air 170C/W 500 linear feet per minute air flow 1.4 Recommended operating conditions. Nominal supply voltage range ( VCC) . 5 V dc to 6 V dc Operating ambient temperature range ( TA) . -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and hand

14、books. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits,

15、 Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. _ 1/ Absolute maximum ratings are limits beyond which damage to the device may occur. Operating ratings a

16、re conditions for which the device is functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions see the electrical characteristics. The guaranteed specifications apply only for the test conditions listed. Some performance characteristics may degr

17、ade when the device is not operated under the listed test conditions. 2/ The maximum output current ( IOUT) is determined by device power dissipation limitations. 3/ The shutdown pin is designed to work between 0 and VCCwith split supplies ( VCC= -VEE). With single supplies ( VEE= ground ) the shutd

18、own pin should not be taken below VCC / 2. 4/ The maximum power dissipation must be derated at elevated temperatures and is dictated by TJ(maximum junction temperature), JA(package junction to ambient thermal resistance), and TA(ambient temperature). The maximum allowable power dissipation at any te

19、mperature is PDmaximum = (TJmaximum TA) / JAor the number given in 1.3 herein, whichever is lower. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-04203 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-500

20、0 REVISION LEVEL SHEET 4 DSCC FORM 2234 APR 97 DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or www.dodssp.daps.mil or fro

21、m the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however

22、, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers

23、Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Desi

24、gn, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2

25、.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are a

26、s specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be mar

27、ked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option,

28、 the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a

29、 “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply

30、 to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing

31、 as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate

32、 of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change

33、of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-04203 DEFENSE SUPPLY CENTER COLUMBU

34、S COLUMBUS, OHIO 43216-5000 REVISION LEVEL SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ -55C TA +125C unless otherwise specified Group A subgroups Device type Limits 2/ Unit Min Max DC parameter section Input offset voltage VIO1 01 -6 +6 mV

35、 2,3 -10 +10 Input bias current IbnNon-inverting 1 01 -10 +10 A 2,3 -15 +15 IbiInverting 1 -12 +12 2,3 -20 +20 Power supply rejection ratio PSRR 1 01 48 dB 2,3 47 Positive supply current +ICCRL= infinity 1 01 3.0 7.5 mA 2,3 3.0 8.0 Negative supply current -ICCRL= infinity 1 01 -7.5 -3 mA 2,3 -8 -3 S

36、upply current during shutdown ICCD1 01 0.67 mA 2,3 1 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-04203 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVE

37、L SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics Continued. Test Symbol Conditions 1/ -55C TA +125C unless otherwise specified Group A subgroups Device type Limits 2/ Unit Min Max Frequency domain response section Small signal bandwidth SSBW -3 dB bandwidth, TA= +25C,

38、VOUT 1.0 VPP4 01 345 MHz Gain flatness rolloff GFRH 0.1 MHz to 30 mHz, TA= +25C 4 01 0.3 dB Distortion and Noise test section Second harmonic distortion HD2 2 VPPat 10 MHz, VOUT= 2 VPP4 01 46 dB Third harmonic distortion HD3 2 VPPat 10 MHz, VOUT= 2 VPP4 01 50 dB 1/ Unless otherwise specified, VCC= 5

39、 V, load resistance ( RL) = 100 , gain ( AV) = +2, and feedback resistance ( RF) = 348 . 2/ The algebraic convention, whereby the most negative value is a minimum and the most positive is a maximum, is used in this table. Negative current shall be defined as conventional current flow out of a device

40、 terminal. 3.9 Verification and review for device class M. For device class M, DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the revie

41、wer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 49 (see MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT

42、 DRAWING SIZE A 5962-04203 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL SHEET 7 DSCC FORM 2234 APR 97 Device type 01 Case outlines P Z Terminal number Terminal symbol 1 NC NC 2 VINVVINV3 VNON-INVVNON-INV4 -VCC-VCC5 NC NC 6 VOUTNC 7 +VCCNC 8 SD VOUT9 - +VCC10 - SD NC = No c

43、onnection FIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-04203 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL SHEET 8 DSCC FORM 2234 APR 97 4. VERIFIC

44、ATION 4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as describe

45、d herein. For device class M, sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to qualification and technology conforma

46、nce inspection. For device class M, screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. 4.2.1 Additional criteria for device class M. a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C,

47、or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with t

48、he intent specified in method 1015. (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein. 4.2.2 Additional criteria for device classes Q and V. a. The burn-in test duration, test condition and test temperature, or approved alternatives shall be as specified in the device manufacturers QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under document revision level control of the device manufacturers Technology Review Board (TRB) in accordance with MIL-PRF-38535 and sh