DLA QML-31032-2013 Printed Circuit Board Printed Wiring Board General Specification for.pdf

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1、QML-310322013-11-14QUALIFIED PRODUCT LISTOFPRODUCTS QUALIFIED UNDER PERFORMANCE SPECIFICATIONMIL-PRF-31032Printed Circuit Board/Printed Wiring Board, General Specification forThis list has been prepared for use by or for the Government in the acquisition of products covered by the subject specificat

2、ion and such listing of a product is not intended to and does not connote endorsement of the product by the Department of Defense. This list is subject to change without notice; revision or amendment of this list will be issued as necessary. The listing of a product does not release the contractor f

3、rom compliance with the specification requirements.THE ACTIVITY RESPONSIBLE FOR THIS QUALIFICATION DATASET is the DeDLA Land and Maritime - VQ, Columbus, OH 43218-3990.DLA Land and Maritime-VQ supplemental information available at: http:/www.landandmaritime.dla.mil/programs/qmlqpl/QPLdetail.asp?QPL=

4、31032GOVERNMENT DESIGNATION MANUFACTURER DESIGNATION TEST REFERENCE CAGE CODESupplier TypeCertified StatusStop ShipMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mounting.3DR67 M Gre

5、en Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mounting.75815 M Green Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass R

6、einforced thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mounting.0MHG5 M Green Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mount

7、ing.6T499 M Green Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mounting.3BKL5 M Green Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered,

8、Woven E-Glass Reinforced thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mounting.1VUH8 M Green Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin Base Material, With Plated Through Holes, For Sold

9、ered Part Mounting.65200 M Green Until: 14-NOV-15NQML-310321 of 25Source: QPD at https:/assist.daps.dla.mil - QPL Date: 2013-11-14If past the certification date, contact Qualifying Activity for status.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-G

10、OVERNMENT DESIGNATION MANUFACTURER DESIGNATION TEST REFERENCE CAGE CODESupplier TypeCertified StatusStop ShipMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mounting.4AA34 M Green Unt

11、il: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mounting.03640 M Green Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinfor

12、ced thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mounting.0GN71 M Green Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mounting.1K

13、XU6 M Green Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mounting.3AF82 M Green Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven

14、E-Glass Reinforced thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mounting.6T499 M Green Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin Base Material, With Plated Through Holes, For Soldered P

15、art Mounting.65723 M Green Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mounting.1VUH8 M Green Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multi

16、layered, Woven E-Glass Reinforced thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mounting.63695 M Green Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin Base Material, With Plated Through Holes,

17、 For Soldered Part Mounting.75815 M Green Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mounting.3C7D2 M Green Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Boar

18、d, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mounting.L2665 M Green Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin Base Material, With Plated

19、 Through Holes, For Soldered Part Mounting.5L706 M Green Until: 14-NOV-15NQML-310322 of 25Source: QPD at https:/assist.daps.dla.mil - QPL Date: 2013-11-14If past the certification date, contact Qualifying Activity for status.Provided by IHSNot for ResaleNo reproduction or networking permitted withou

20、t license from IHS-,-,-GOVERNMENT DESIGNATION MANUFACTURER DESIGNATION TEST REFERENCE CAGE CODESupplier TypeCertified StatusStop ShipMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mo

21、unting.4MEG7 M Green Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mounting.C4831 M Green Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayere

22、d, Woven E-Glass Reinforced thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mounting.U4538 M Green Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin Base Material, With Plated Through Holes, For S

23、oldered Part Mounting.3DR67 M Green Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mounting.63695 M Green Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Board, Rig

24、id, Multilayered, Woven E-Glass Reinforced thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mounting.38898 M Green Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin Base Material, With Plated Throu

25、gh Holes, For Soldered Part Mounting.57034 M Green Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mounting.4AA34 M Green Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wi

26、ring Board, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mounting.L2665 M Green Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin Base Material, Wi

27、th Plated Through Holes, For Soldered Part Mounting.45032 M Green Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mounting.0MHG5 M Green Until: 14-NOV-15NMIL-PRF-3103

28、2/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mounting.03640 M Green Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin Ba

29、se Material, With Plated Through Holes, For Soldered Part Mounting.03640 M Green Until: 14-NOV-15NQML-310323 of 25Source: QPD at https:/assist.daps.dla.mil - QPL Date: 2013-11-14If past the certification date, contact Qualifying Activity for status.Provided by IHSNot for ResaleNo reproduction or net

30、working permitted without license from IHS-,-,-GOVERNMENT DESIGNATION MANUFACTURER DESIGNATION TEST REFERENCE CAGE CODESupplier TypeCertified StatusStop ShipMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin Base Material, With Plated Through Hol

31、es, For Soldered Part Mounting.7Z463 M Green Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mounting.4MEG7 M Green Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring B

32、oard, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mounting.5L706 M Green Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin Base Material, With Pla

33、ted Through Holes, For Soldered Part Mounting.5L706 M Green Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mounting.66982 M Green Until: 14-NOV-15NMIL-PRF-31032/1: P

34、rinted Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mounting.1KXU6 M Green Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin Base Mat

35、erial, With Plated Through Holes, For Soldered Part Mounting.01KV9 M Green Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mounting.66766 M Green Until: 14-NOV-15NMIL

36、-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mounting.01KV9 M Green Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting

37、 Resin Base Material, With Plated Through Holes, For Soldered Part Mounting.3CP65 M Green Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mounting.7Z463 M Green Until

38、: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mounting.04RV5 M Green Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforce

39、d thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mounting.6RJS1 M Green Until: 14-NOV-15NQML-310324 of 25Source: QPD at https:/assist.daps.dla.mil - QPL Date: 2013-11-14If past the certification date, contact Qualifying Activity for status.Provided by IHSNot for Resa

40、leNo reproduction or networking permitted without license from IHS-,-,-GOVERNMENT DESIGNATION MANUFACTURER DESIGNATION TEST REFERENCE CAGE CODESupplier TypeCertified StatusStop ShipMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin Base Material,

41、 With Plated Through Holes, For Soldered Part Mounting.30598 M Green Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mounting.3CP65 M Green Until: 14-NOV-15NMIL-PRF-3

42、1032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mounting.45032 M Green Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin

43、 Base Material, With Plated Through Holes, For Soldered Part Mounting.65745 M Green Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mounting.0K703 M Green Until: 14-N

44、OV-15NMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mounting.65916 M Green Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced ther

45、mosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mounting.3ECL3 M Green Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mounting.3AF82 M Gr

46、een Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mounting.0YYS4 M Green Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass

47、Reinforced thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mounting.79616 M Green Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Moun

48、ting.4GZ84 M Green Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mounting.3ECL3 M Green Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered,

49、 Woven E-Glass Reinforced thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mounting.0YYS4 M Green Until: 14-NOV-15NQML-310325 of 25Source: QPD at https:/assist.daps.dla.mil - QPL Date: 2013-11-14If past the certification date, contact Qualifying Activity for status.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-GOVERNMENT DESIGNATION MANUFACTURER DESIGNATION T