DLA MIL-PRF-19500 375 J-2011 SEMICONDUCTOR DEVICE TRANSISTOR FIELD-EFFECT N-CHANNEL DEPLETION MODE SILICON TYPES 2N3821 2N3821UB 2N3822 2N3822UB 2N3823 AND 2N3823UB JAN JANTX JANTX.pdf
《DLA MIL-PRF-19500 375 J-2011 SEMICONDUCTOR DEVICE TRANSISTOR FIELD-EFFECT N-CHANNEL DEPLETION MODE SILICON TYPES 2N3821 2N3821UB 2N3822 2N3822UB 2N3823 AND 2N3823UB JAN JANTX JANTX.pdf》由会员分享,可在线阅读,更多相关《DLA MIL-PRF-19500 375 J-2011 SEMICONDUCTOR DEVICE TRANSISTOR FIELD-EFFECT N-CHANNEL DEPLETION MODE SILICON TYPES 2N3821 2N3821UB 2N3822 2N3822UB 2N3823 AND 2N3823UB JAN JANTX JANTX.pdf(15页珍藏版)》请在麦多课文档分享上搜索。
1、 MIL-PRF-19500/375J 14 December 2011 SUPERSEDING MIL-PRF-19500/375H 21 July 2011 PERFORMANCE SPECIFICATION SHEET SEMICONDUCTOR DEVICE, TRANSISTOR, FIELD-EFFECT, N-CHANNEL, DEPLETION MODE, SILICON, TYPES 2N3821, 2N3821UB, 2N3822, 2N3822UB, 2N3823, AND 2N3823UB, JAN, JANTX, JANTXV, AND JANS This speci
2、fication is approved for use by all Departments and Agencies of the Department of Defense. The requirements for acquiring the product described herein shall consist of this specification sheet and MIL-PRF-19500. 1. SCOPE 1.1 Scope. This specification covers the performance requirements for N-channel
3、, junction, silicon, field-effect depletion mode transistors. Four levels of product assurance are provided for each device type as specified in MIL-PRF-19500. * 1.2 Physical dimensions. See figure 1 (similar to TO-72) and figure 2 (surface mount, UB suffix). 1.3 Maximum ratings. Unless otherwise sp
4、ecified, TC= +25C. PT(1) TA= +25C VDGand VDSVGSRIGFTJand TSTG2N3821 2N3822 2N3823 2N3821 2N3822 2N3823 2N3821UB 2N3822UB 2N3823UB 2N3821UB 2N3822UB 2N3823UB mW 300 V dc 50 V dc 50 V dc 30 V dc 50 V dc 50 V dc 30 mA dc 10 C -55 to +200 (1) Derate linearly, 1.7 mW/C for TA +25C. 1.4 Primary electrical
5、 characteristics. Unless otherwise specified, TC= +25C. |yfs|1 (1) VDS= 15 V dc f = 1 kHz VGS= 0 |yfs|3 VDS= 15 V dc, VGS= 0 CissVDS= 15 V dc VGS= 0 100 kHz Crss VDS= 15 V dc VGS= 0 100 kHz f 1 MHz f = 100 MHz f = 100 MHz f = 200 MHz 2N3821 2N3822 2N3823 2N3821 2N3822 2N3823 2N3821 2N3822 2N3823 2N3
6、821UB 2N3822UB 2N3823UB 2N3821UB 2N3822UB 2N3823UB f 1 MHz 2N3821UB 2N3822UB 2N3823UB Min Max s 1,500 4,500 s 3,000 6,500 s 3,500 6,500 s 1,500 s 3,000 s 3,200 pF 6 pF 3 pF 3 pF 2 See note at end of 1.4. AMSC N/A FSC 5961INCH-POUND Comments, suggestions, or questions on this document should be addre
7、ssed to DLA Land and Maritime, ATTN: VAC, P.O. Box 3990, Columbus, OH 43218-3990, or emailed to Semiconductordla.mil. Since contact information can change, you may want to verify the currency of this address information using the ASSIST Online database at https:/assist.daps.dla.mil/. The documentati
8、on and process conversion measures necessary to comply with this revision shall be completed by 14 March 2012. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-PRF-19500/375J 2 1.4 Primary electrical characteristics - Continued. IDSS(1) VDS= 15 V
9、dc VGS= 0 VGS(off)VDS= 15 V dc ID= 0.5 nA dc NFVDS= 15 V dc VGS= 0, RG= 1 M f = 10 Hz VDS= 15 V dc VGS= 0, RG= 1 M f = 1 kHz VDS= 15 V dc VGS= 0, RG= 1 M f = 105 MHz 2N3821 2N3822 2N3823 2N3821 2N3822 2N3823 2N3821 2N3822 All 2N3823 2N3821UB 2N3822UB 2N3823UB 2N3821UB 2N3822UB 2N3823UB 2N3821UB 2N38
10、22UB types 2N3823UB Min Max mA dc 0.5 2.5 mA dc 2.0 10.0 mA dc 4.0 20.0 V dc 4.0 V dc 6.0 V dc 8.0 dB 5.0 dB 2.5 dB 2.5 (1) Pulsed (see 4.5.1). 2. APPLICABLE DOCUMENTS 2.1 General. The documents listed in this section are specified in sections 3, 4, or 5 of this specification. This section does not
11、include documents cited in other sections of this specification or recommended for additional information or as examples. While every effort has been made to ensure the completeness of this list, document users are cautioned that they must meet all specified requirements of documents cited in sectio
12、ns 3, 4, or 5 of this specification, whether or not they are listed. 2.2 Government documents. 2.2.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a part of this document to the extent specified herein. Unless otherwise specified, the issues of
13、 these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATIONS MIL-PRF-19500 - Semiconductor Devices, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-750 - Test Methods for Semiconductor Devices. (Copies of these documents are available onli
14、ne at https:/assist.daps.dla.mil/quicksearch/ or https:/assist.daps.dla.mil/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.3 Order of precedence. Unless otherwise noted herein or in the contract, in the event of a conflict between t
15、he text of this document and the references cited herein, the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. Provided by IHSNot for ResaleNo reproduction or networking permitted with
16、out license from IHS-,-,-MIL-PRF-19500/375J 3 Ltr Dimensions Notes Inches Millimeters Min Max Min Max CD .178 .195 4.52 4.95 CH .170 .210 4.32 5.33 HD .209 .230 5.31 5.84 L1 .050 1.27 L2 .250 6.35 LC .100 TP 2.54 TP LD .016 .021 0.41 0.53 2, 6 LL .500 .750 12.70 19.05 6 LU .016 .019 0.41 0.48 3, 6 Q
17、 .040 1.02 r .007 0.18 TL .028 .048 0.71 1.22 8 TW .036 .046 0.91 1.17 45 TP NOTES: 1. Dimensions are in inches. Millimeters are given for general information only. 2. Measured in the zone beyond .250 (6.35 mm) from the seating plane. 3. Measured in the zone .050 (1.27 mm) and .250 (6.35 mm) from th
18、e seating plane. 4. When measured in a gauging plane .054 +.001, -.000 (1.37 +.3, -.00 mm) before the seating plane of the transistor, maximum diameter leads shall be within .007 (.18 mm) of their true location relative to a maximum width tab. Smaller diameter leads shall fall within the outline of
19、the maximum diameter lead tolerance. 5. The active elements are electrically insulated from the case. 6. All 4 leads. 7. Lead 1 is the source, lead 2 is the drain, lead 3 is the gate, and lead 4 is the case. 8. Symbol TL is measured from HD maximum. 9. In accordance with ASME Y14.5M, diameters are e
20、quivalent to x symbology. FIGURE 1. Physical dimensions (similar to TO-72). TO-72 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-PRF-19500/375J 4 Dimensions Symbol Inches Millimeters Note Min Max Min Max BH .046 .056 1.17 1.42 BL .115 .128 2.92
21、3.25 BW .085 .108 2.16 2.74 CL .128 3.25 CW .108 2.74 LL1 .022 .038 0.56 0.96 LL2 .017 .035 0.43 0.89 LS1 .036 .040 0.91 1.02 LS2 .071 .079 1.81 2.01 LW .016 .024 0.41 0.61 r .008 .203 r1 .012 .305 r2 .022 .559 NOTES: 1. Dimensions are in inches. 2. Millimeters are given for general information only
22、. 3. Hatched areas on package denote metallized areas. 4. Lid material: Kovar. 5. Pad 1 = Drain, Pad 2 = Source, Pad 3 = Gate, Pad 4 = Shielding connected to the lid. * FIGURE 2. Physical dimensions, surface mount (2N3821UB, 2N3822UB, AND 2N3823UB). UB Provided by IHSNot for ResaleNo reproduction or
23、 networking permitted without license from IHS-,-,-MIL-PRF-19500/375J 5 3. REQUIREMENTS 3.1 General. The individual item requirements shall be as specified in MIL-PRF-19500 and as modified herein. 3.2 Qualification. Devices furnished under this specification shall be products that are manufactured b
24、y a manufacturer authorized by the qualifying activity for listing on the applicable qualified manufacturers list (QML) before contract award (see 4.2 and 6.3). 3.3 Abbreviations, symbols, and definitions. Abbreviations, symbols, and definitions used herein shall be as specified in MIL-PRF-19500 and
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