DLA MIL-M-38510J (1)-1992 MICROCIRCUITS GENERAL SPECIFICATION FOR.pdf
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1、a71 The document and processconversion measure. necessary ro Icomply with this amendment shall IIbe completed by 1 September 92. IH1L-H-3851OJ6RENDKEMT11 JUIY 92hlLITARY SPECIF1 CATIONMICROCIRCUITS,GENERAL SPECIF 1CATION FORThis amendment forms part of ?I1L-W-M51OJ, dated 1S November 19Vl,end is e+w
2、oved for use by all Cwart=nts Awcie$ Of theOepartmcnt of Defense.The attached insertable replacement pages Li steal bclw are replmcemmts for the sc ipulaud pages. UhMthe neu pages have been a71ntered in the document, jnsert the amendment as the cover sheet to thespecification.Replacement paws P.acte
3、s replacedW.a Ntu pageG4b Ntw pageo 2.1.1, add to STANDARDS, MILITARY: PAGE 2WL-STD-1562 - Li5t of Star!dard microcircuits. ”PAGE 63.1.3:30, add sentence to the end of paragraph: “Cons$deratioc must be given to the worst caseelectrical wndi t ions (e.g. CIUS Leakage current) in selection of the. pac
4、kage fami lY and AechnolcgyCO distritathan is unlimited.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-H1L-H-3651OJAMENDMENT1PAGE 110IAdd the following new paragraph:3.6.1 .2.8 Third w cty man. foct.rinq. Third party manufacturing, i“cludiy the circ
5、uit design process,s permitted ?M approved by the qualifying activity. The a71lements (i.e. processes of design, waferfabrication, nssembly, screening, testing and sample testing) “ece%sary for the c.a.ufacturing of themicrocircuit .haL be eppro.ed, by the qualifying activity, as elements of the mm.
6、ufacturerscertification. The certified manufacturer is responsible for tffecli.ely conxrotling the third partyand assumes comptete responsibility for the prcduct. ”PAGE 163.5.1, Second sentence: Delete in the device specification or drawing (e.g. polyiside in%ertnyerdielectric or aLp4w particle die
7、coating) .- and substitute i” the associated detel specificationor standardized a75ilitary drawing (e.g. yimide inter lmyer dielectric, alpha particle diecoating ).-,PAGE 263.5.9, delete and substitute:,3.5.9 Die thickness. Appropriate die thickness requirements for each prcduct or process shall bed
8、efined n the manufacturers baseline documentation. This thickness shall be sufficient to avoid diecracks due t- handling, die attach wire tci?ding or other process stresses, tiich can lead to latentfie Ld failure. ”PAGE 354.4.1, add smtmce to the a71nd of the paragraph: For DJS device (see 3.1.3. S4
9、) qualificationrequirtc-ants, see appendix l.-PAGE 414.5.5 .Ic, delete end substitute:“c. Different device rypts may be used for different %Ubgrcups. Testing of a subgroup using a singledevice type enclosed i“ the peckt+ge type shall bt considered as coying with the rcquir-ts forthat subgrcup for al
10、l detail dtvice specifications utilizing the package family and lead finifi.Technical justificatico m.t%t be givzn for device $electhns for mkgrwps D-3 and D-4 in rrds todevice technology a71lectrical pcrfo-nce and pnckage interaction (e.g. if thtre is m interaction,cdy .ane group b-3 and D-4 test f
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