DLA DSCC-VID-V62-03671 REV B-2005 MICROCIRCUIT DIGITAL-LINEAR DIFFERENTIAL BUS TRANSCEIVER MONOLITHIC SILICON《微型电路 数字线型 高速差动总线收发器 单块硅》.pdf
《DLA DSCC-VID-V62-03671 REV B-2005 MICROCIRCUIT DIGITAL-LINEAR DIFFERENTIAL BUS TRANSCEIVER MONOLITHIC SILICON《微型电路 数字线型 高速差动总线收发器 单块硅》.pdf》由会员分享,可在线阅读,更多相关《DLA DSCC-VID-V62-03671 REV B-2005 MICROCIRCUIT DIGITAL-LINEAR DIFFERENTIAL BUS TRANSCEIVER MONOLITHIC SILICON《微型电路 数字线型 高速差动总线收发器 单块硅》.pdf(19页珍藏版)》请在麦多课文档分享上搜索。
1、 REVISIONS LTR DESCRIPTION DATE APPROVED A Add device type 02. - ro 04-07-08 R. MONNIN B Make changes to Electrostatic discharge section as specified under 1.3. - ro 05-03-04 R. MONNIN Prepared in accordance with ASME Y14.24 Vendor item drawing REV PAGE REV B B PAGE 18 19 REV B B B B B B B B B B B B
2、 B B B B B REV STATUS OF PAGES PAGE 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 PMIC N/A PREPARED BY RICK OFFICER DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO 43218-3990 Original date of drawing YY MM DD CHECKED BY TOM HESS APPROVED BY RAYMOND MONNIN TITLE MICROCIRCUIT, DIGITAL-LINEAR, DIFFERENTIAL
3、BUS TRANSCEIVER, MONOLITHIC SILICON SIZE A CODE IDENT. NO. 16236 DWG NO. V62/03671 03-08-21 REV B PAGE 1 OF 19 AMSC N/A 5962-V031-05 .Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO.
4、 16236 DWG NO. V62/03671 REV B PAGE 2 1. SCOPE 1.1 Scope. This drawing documents the general requirements of a high performance differential bus transceiver microcircuit, with an operating temperature range of -40C to +125C for device type 01 and -55C to +125C for device type 02. 1.2 Vendor Item Dra
5、wing Administrative Control Number. The manufacturers PIN is the item of identification. The vendor item drawing establishes an administrative control number for identifying the item on the engineering documentation: V62/03671 - 01 X E Drawing Device type Case outline Lead finish number (See 1.2.1)
6、(See 1.2.2) (See 1.2.3) 1.2.1 Device type(s). Device type Generic Circuit function 01 SN65LBC176AQ-EP Differential bus transceiver 02 SN65LBC176AM-EP Differential bus transceiver 1.2.2 Case outline(s). The case outlines are as specified herein. Outline letter Number of pins JEDEC PUB 95 Package styl
7、e X 8 MS-012 Plastic small outline 1.2.3 Lead finishes. The lead finishes are as specified below or other lead finishes as provided by the device manufacture: Finish designator Material A Hot solder dip B Tin-lead plate C Gold plate D Palladium E Gold flash palladium Z Other Provided by IHSNot for R
8、esaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/03671 REV B PAGE 3 1.3 Absolute maximum ratings. 1/ Supply voltage range (VCC) . -0.3 V to 6 V 2/ Voltage range at any bus terminal (A or B
9、) -10 V to 15 V Input voltage, (VI) (D, DE, R, or RE ) . -0.3 V to VCC+ 0.5 V Electrostatic discharge: A, B bus terminals and GND 400 V 3/ All A, B terminals 400 V 3/ Continuous total power dissipation (PD) . See dissipation rating table 4/ Storage temperature range (TSTG) -65C to 150C Lead temperat
10、ure 1.6 mm (1/16 inch) from case for 10 seconds . 260C 1.4 Recommended operating conditions. Supply voltage range (VCC) . 4.75 V to 5.25 V Voltage at any bus terminal (separately or common mode), (VIor VIC) -7 V minimum and 12 V maximum High level input voltage (VIH) (output recessive) (D, DE, and R
11、E ) 2 V to VCCLow level input voltage (VIL) (output dominant) (D, DE, and RE ) . 0 V to 0.8 V Differential input voltage (VID) -12 V to 12 V 5/ 6/ High level output current (IOH): Driver . -60 mA minimum Receiver . -8 mA minimum Low level output current (IOL): Driver . 60 mA maximum Receiver . 8 mA
12、maximum Operating free-air temperature range (TA) : Device type 01 . -40C to +125C Device type 02 . -55C to +125C Case outline TA 25C Power rating Derating factor 7/ Above TA= 25C TA= 70C Power rating TA= 85C Power rating TA= 125C Power rating X 725 mW 5.8 mW/C 464 mW 377 mW 145 mW 1/ Stresses beyon
13、d those listed under “absolute maximum rating” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “ recommended operating conditions” is not implied. Exposure to absolute-maximu
14、m-rated conditions for extended periods may affect device reliability. 2/ All voltage values, except differential I/O bus voltage, are with respect to network ground terminal. 3/ Tested in accordance with MIL-STD-883, test method 3015 (human body model). 4/ The maximum operating junction temperature
15、 is internally limited. Use the dissipation rating table to operate below this temperature. 5/ The algebraic convention, in which the least positive (most negative) limit is designed as minimum, is used in this data sheet. 6/ Differential input/output bus voltage is measured at the noninverting term
16、inal A with respect to the inverting terminal B. 7/ This is the inverse junction-to-ambient thermal resistance when the board is mounted and with no air flow. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, O
17、HIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/03671 REV B PAGE 4 2. APPLICABLE DOCUMENTS JEDEC PUB 95 Registered and Standard Outlines for Semiconductor Devices (Applications for copies should be addressed to the Electronic Industries Alliance, 2500 Wilson Boulevard, Arlington, VA 22201-3834 or online
18、 at http:/www.jedec.org) 3. REQUIREMENTS 3.1 Marking. Parts shall be permanently and legibly marked with the manufacturers part number as shown in 6.3 herein and as follows: A. Manufacturers name, CAGE code, or logo B. Pin 1 identifier C. ESDS identification (optional) 3.2 Unit container. The unit c
19、ontainer shall be marked with the manufacturers part number and with items A and C (if applicable) above. 3.3 Electrical characteristics. The maximum and recommended operating conditions and electrical performance characteristics are as specified in 1.3, 1.4, and table I herein. 3.4 Design, construc
20、tion, and physical dimension. The design, construction, and physical dimensions are as specified herein. 3.5 Diagrams. 3.5.1 Case outline. The case outline shall be as shown in 1.2.2 and figure 1. 3.5.2 Terminal connections. The terminal connections shall be as shown in figure 2. 3.5.3 Logic diagram
21、. The logic diagram shall be as shown in figure 3. 3.5.4 Test circuits. The test circuits shall be as shown in figures 4 and 5. 3.5.5 Timing waveforms and test circuits. The timing waveforms and test circuits shall be as shown in figures 6, 7,and 8. Provided by IHSNot for ResaleNo reproduction or ne
22、tworking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/03671 REV B PAGE 5 TABLE I. Electrical performance characteristics. Limits Test Symbol Conditions 1/Temperature, TADevice type Min Max Unit Driver electrical charact
23、eristics section Input clamp voltage VIKII= -18 mA -40C to +125C 01 -1.5 V -55C to +125C 02 -1.5 Differential output voltage |VOD| IO= 0 -40C to +125C 01 1.5 6 V RL= 54 , see figure 4 0.9 6 Vtest= -7 V to 12 V, see figure 5 0.9 6 IO= 0 -55C to +125C 02 1.5 6 RL= 54 , see figure 4 0.9 6 Vtest= -7 V t
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