DLA DSCC-VID-V62 12667-2013 MICROCIRCUIT DIGITAL 16 BIT DUAL-SUPPLY BUS TRANSCEIVER WITH CONFIGURABLE VOLTAGE TRANSLATION AND 3-STATE OUTPUTS MONOLITHIC SILICON.pdf
《DLA DSCC-VID-V62 12667-2013 MICROCIRCUIT DIGITAL 16 BIT DUAL-SUPPLY BUS TRANSCEIVER WITH CONFIGURABLE VOLTAGE TRANSLATION AND 3-STATE OUTPUTS MONOLITHIC SILICON.pdf》由会员分享,可在线阅读,更多相关《DLA DSCC-VID-V62 12667-2013 MICROCIRCUIT DIGITAL 16 BIT DUAL-SUPPLY BUS TRANSCEIVER WITH CONFIGURABLE VOLTAGE TRANSLATION AND 3-STATE OUTPUTS MONOLITHIC SILICON.pdf(12页珍藏版)》请在麦多课文档分享上搜索。
1、 REVISIONS LTR DESCRIPTION DATE APPROVED Prepared in accordance with ASME Y14.24 Vendor item drawing REV PAGE REV PAGE REV STATUS OF PAGES REV PAGE 1 2 3 4 5 6 7 8 9 10 11 12 PMIC N/A PREPARED BY Phu H. Nguyen DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.landandmaritime.dla.mil/ Origina
2、l date of drawing YY MM DD CHECKED BY Phu H. Nguyen TITLE MICROCIRCUIT, DIGITAL, 16 BIT DUAL-SUPPLY BUS TRANSCEIVER WITH CONFIGURABLE VOLTAGE TRANSLATION AND 3-STATE OUTPUTS, MONOLITHIC SILICON 13-02-07 APPROVED BY Thomas M. Hess SIZE A CODE IDENT. NO. 16236 DWG NO. V62/12667 REV PAGE 1 OF 12 AMSC N
3、/A 5962-V047-13 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DLA LAND AND MARITIME COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/12667 REV PAGE 2 1. SCOPE 1.1 Scope. This drawing documents the general requirements of a high performance 16
4、 bit dual supply bus transceiver with configurable voltage translation and 3-state outputs microcircuit, with an operating temperature range of -55C to +125C. 1.2 Vendor Item Drawing Administrative Control Number. The manufacturers PIN is the item of identification. The vendor item drawing establish
5、es an administrative control number for identifying the item on the engineering documentation: V62/12667 - 01 X E Drawing Device type Case outline Lead finish number (See 1.2.1) (See 1.2.2) (See 1.2.3) 1.2.1 Device type(s). Device type Generic Circuit function 01 SN74LVC16T245-EP 16 bit dual supply
6、bus transceiver with configurable voltage translation and 3-state outputs 1.2.2 Case outline(s). The case outline(s) are as specified herein. Outline letter Number of pins JEDEC PUB 95 Package style X 48 JEDEC MO-153 Plastic small outline package 1.2.3 Lead finishes. The lead finishes are as specifi
7、ed below or other lead finishes as provided by the device manufacturer: Finish designator Material A Hot solder dip B Tin-lead plate C Gold plate D Palladium E Gold flash palladium Z Other Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DLA LAND AND
8、MARITIME COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/12667 REV PAGE 3 1.3 Absolute maximum ratings. 1/ Supply voltage range: (VCCA, VCCB) . -0.5 V to 6.5 V Input voltage range (VI): 2/ I/O ports (A port) -0.5 V to 6.5 V I/O ports (B port) -0.5 V to 6.5 V Control inputs . -0.5 V to 6.5 V V
9、oltage range applied to any output in the high impedance or power off stated, (VO): 2/ A port -0.5 V to 6.5 V B port -0.5 V to 6.5 V Voltage range applied to any output in the high or low state, (VO): 2/ 3/ A port -0.5 V to VCCA+ 0.5 V B port -0.5 V to VCCB+ 0.5 V Input clamp current, (IIK) (VI 0) .
10、 -50 mA Output clamp current, (IOK) (VO 0) -50 mA Continuous output current, (IO) 50 mA Continuous current through each VCCA, VCCB, and GND 100 mA Maximum junction temperature,( TJ) . 150 C Storage temperature range . -65C to 150C 1.4 Thermal characteristics. Thermal metric 4/ Case outline X Units J
11、unction to ambient thermal resistance, JA5/ 59.9 C/W Junction to case (top) thermal resistance, JCtop6/ 13.9 Junction to board thermal resistance, JB7/ 27.1 Junction to top characterization parameter, JT8/ 0.5 Junction to board characterization parameter, JB9/ 26.8 Junction to case (bottom) thermal
12、resistance, JCbot10/ N/A 1/ Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” i
13、s not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability. 2/ The input and output negative voltage ratings may be exceeded if the input and output current ratings are observed. 3/ The output positive-voltage may be exceeded up to 6.5 V maximum i
14、f the output current rating is observed. 4/ For more information about traditional and new thermal metric, see manufacturer “the IC package Thermal Metric application report, SPRA953”. 5/ The junction to ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-stand
15、ard, high-k-board, as specified in JESD51-7, in an environment described in JESD51-2a. 6/ The junction to case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specified JEDEC- standard test exists, but a close description can be found in the ANSI SEMI stan
16、dard G30-88. 7/ The junction to board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB temperature, as described in JESD51-8. 8/ The junction to top characterization parameter, JT, estimates the junction temperature of a device in a rea
17、l system and is extracted from the simulation data for obtaining JA, using a procedure described in JESD51-2a (sections 6 and 7). 9/ The junction to board characterization parameter, JB, estimates the junction temperature of a device in a real system and is extracted from the simulation data for obt
18、aining JA, using a procedure described in JESD51-2a (sections 6 and 7). 10/ The junction to case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specified JEDEC- standard test exists, but a close description can be found in the ANSI SEMI standar
19、d G30-88 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DLA LAND AND MARITIME COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/12667 REV PAGE 4 1.5 Recommended operating conditions. 11/ 12/ 13/ 14/ 15/ VCCIVCCOLimits Unit Min Max Supply voltag
20、e VCCA1.65 5.5 V VCCB1.65 5.5 High level input voltage, (VIH) Data inputs 16/ 1.65 V to 1.95 V VCCIx 0.65 2.3 V to 2.7 V 1.7 3 V to 3.6 V 2 4.5 V to 5.5 V VCCIx 0.7 Low level input voltage, (VIL) Data inputs 16/ 1.65 V to 1.95 V VCCIx 0.35 2.3 V to 2.7 V 0.7 3 V to 3.6 V 0.8 4.5 V to 5.5 V VCCIx 0.3
21、 High level input voltage, (VIH) Control inputs (referenced to VCCA) 17/ 1.65 V to 1.95 V VCCAx 0.65 2.3 V to 2.7 V 1.7 3 V to 3.6 V 2 4.5 V to 5.5 V VCCAx 0.7 Low level input voltage, (VIL) Control inputs (referenced to VCCA) 17/ 1.65 V to 1.95 V VCCAx 0.35 2.3 V to 2.7 V 0.7 3 V to 3.6 V 0.8 4.5 V
22、 to 5.5 V VCCAx 0.3 Input voltage, (VI) Control inputs 0 5.5 Input/output voltage, (VI/O) Active state 0 VCCO3-State 0 5.5 High level output current, (IOH) 1.65 V to 1.95 V -4 mA 2.3 V to 2.7 V -8 3 V to 3.6 V -24 4.5 V to 5.5 V -32 Low level output current, (IOL) 1.65 V to 1.95 V 4 2.3 V to 2.7 V 8
23、 3 V to 3.6 V 24 4.5 V to 5.5 V 32 Input transition rise or fall rate, (t/v) Data inputs 1.65 V to 1.95 V 20 ns/V 2.3 V to 2.7 V 20 3 V to 3.6 V 10 4.5 V to 5.5 V 5 Operating free air temperature, (TA) -55 125 C _ 11/ Use of this product beyond the manufacturers design rules or stated parameters is
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