DLA DSCC-VID-V62 08625 REV A-2008 MICROCIRCUIT DIGITAL IEEE-1394 LINK LAYER CONTROLLER MONOLITHIC SILICON《单硅片数字微电路 带 IEEE-1394 连接层控制器》.pdf
《DLA DSCC-VID-V62 08625 REV A-2008 MICROCIRCUIT DIGITAL IEEE-1394 LINK LAYER CONTROLLER MONOLITHIC SILICON《单硅片数字微电路 带 IEEE-1394 连接层控制器》.pdf》由会员分享,可在线阅读,更多相关《DLA DSCC-VID-V62 08625 REV A-2008 MICROCIRCUIT DIGITAL IEEE-1394 LINK LAYER CONTROLLER MONOLITHIC SILICON《单硅片数字微电路 带 IEEE-1394 连接层控制器》.pdf(17页珍藏版)》请在麦多课文档分享上搜索。
1、 REVISIONS LTR DESCRIPTION DATE APPROVED Prepared in accordance with ASME Y14.24 Vendor item drawing REV PAGE REV PAGE REV REV STATUS OF PAGES PAGE 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 PMIC N/A PREPARED BY Phu H. Nguyen DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO 43218-3990 Original date of
2、drawing CHECKED BY Phu H. Nguyen APPROVED BY Thomas M. Hess TITLE MICROCIRCUIT, DIGITAL, IEEE-1394 LINK LAYER CONTROLLER, MONOLITHIC SILICON SIZE A CODE IDENT. NO. 16236 DWG NO. V62/08625 YY MM DD 08-06-24 REV PAGE 1 OF 17 AMSC N/A 5962-V051-08 .Provided by IHSNot for ResaleNo reproduction or networ
3、king permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/08625 REV PAGE 2 1. SCOPE 1.1 Scope. This drawing documents the general requirements of a high performance IEEE-1394 Link Layer controller microcircuit, with an extended
4、 operating temperature range of -55C to +125C. 1.2 Vendor Item Drawing Administrative Control Number. The manufacturers PIN is the item of identification. The vendor item drawing establishes an administrative control number for identifying the item on the engineering documentation: V62/08625 - 01 X
5、E Drawing Device type Case outline Lead finish number (See 1.2.1) (See 1.2.2) (See 1.2.3) 1.2.1 Device type(s). Device type Generic Circuit function 01 TSB12LV21B-EP IEEE-1394 Link layer Controller 1.2.2 Case outline(s). The case outlines are as specified herein. Outline letter Number of pins JEDEC
6、PUB 95 Package style X 176 JEDEC MO-136 Plastic quad flat pack 1.2.3 Lead finishes. The lead finishes are as specified below or other lead finishes as provided by the device manufacture: Finish designator Material A Hot solder dip B Tin-lead plate C Gold plate D Palladium E Gold flash palladium Z Ot
7、her 1.3 Absolute maximum ratings. 1/ 2/ Supply voltage range: VCC-0.5 V to +4.0 V VCCP-0.5 V to +6.0 V VCC5V. -0.5 V to +6.0 V Input voltage range for Universal PCI, (VI) . -0.5 V to VCCP+0.5 V Input voltage range for 5 V tolerant TTL/LVCMOS, (VI) . -0.5 V to VCCP+0.5 V Output voltage range for Univ
8、ersal PCI, (VO) . -0.5 V to VCCP+0.5 V Output voltage range for 5 V tolerant TTL/LVCMOSI, (VO) -0.5 V to VCC5V+0.5 V Input clamp current (VIVCC) (IIK) 20 mA 3/ Output clamp current (VOVCC) (IOK) . 20 mA 4/ _ 1/ Stresses beyond those listed under “absolute maximum rating” may cause permanent damage t
9、o the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 2/ Lo
10、ng term high temperature storage and/or extended use at maximum recommended operating conditions may result in a reduction of overall device life. See manufacturer data for more information on enhanced plastic package. 3/ Applies to external input and bidirectional buffers. For 5 V tolerant buffers,
11、 use VI VCC5V. For Universal PCI, use VI VCCP. 4/ Applies to external output and bidirectional buffers. For 5 V tolerant buffers, use VO VCC5V. For Universal PCI, use VO VCCP. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COL
12、UMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/08625 REV PAGE 3 1.4 Recommended operating conditions. 5/ Core voltage (VCC) +3.0 V to +3.6 V I/O voltage (VCCP) . +3.0 V to +5.5 V I/O voltage (VCC5V) +3.0 V to +5.5 V Minimum high level input voltage (VIH) . 2.0 V 6/ Maximum low level in
13、put voltage (VIL) 0.8 V 6/ Input voltage: Universal PCI (VI) . 0.0 V to VCCP5 V tolerant (VI) . 0.0 V to VCC5VOutput voltage, (VO) . 0.0 V to VCC7/ Input transition times (trand tf) . 0 ns to 6 ns Operating free-air temperature range ( TA). -55C to +125C Virtual junction temperature (Commercial and
14、industrial) . 0C to +115C 8/ 2. APPLICABLE DOCUMENTS IEEE Standard 1394a - IEEE Standard for Higher Performance Serial Buses Allowing Gigabit Signaling. (Applications for copies should be addressed to the Institute of Electrical and Electronic Engineers, 445 Hoes Lane, Piscataway, NJ 08854-4150 JEDE
15、C PUB 95 Registered and Standard Outlines for Semiconductor Devices (Applications for copies should be addressed to the Electronic Industry Alliance, 2500 Wilson Boulevard, Arlington, VA 22201-3834 or at http:/www.jedec.org) 3. REQUIREMENTS 3.1 Marking. Parts shall be permanently and legibly marked
16、with the manufacturers part number as shown in 6.3 herein and as follows: A. Manufacturers name, CAGE code, or logo B. Pin 1 identifier C. ESDS identification (optional) 3.2 Unit container. The unit container shall be marked with the manufacturers part number and with items A and C (if applicable) a
17、bove. 3.3 Electrical characteristics. The maximum and recommended operating conditions and electrical performance characteristics are as specified in 1.3, 1.4, and table I herein. 5/ Unused or floating pin (input or I/O) must be held high or low. 6/ Applies for external input and bidirectional buffe
18、rs without hysteresis. 7/ Applies for external output buffers. 8/ These junction temperatures reflect simulation conditions. Customer is responsible for verifying the junction temperature. Absolute maximum junction temperature is 150C. Provided by IHSNot for ResaleNo reproduction or networking permi
19、tted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/08625 REV PAGE 4 3.4 Design, construction, and physical dimension. The design, construction, and physical dimensions are as specified herein. 3.5 Diagrams. 3.5.1 Case outline(s).
20、The case outline(s) shall be as shown in 1.2.2 and figure 1. 3.5.2 Terminal connections. The terminal connections shall be as shown in figure 2. 3.5.3 Block diagram. The block diagram shall be as specified in figure 3. 3.5.4 PCI interface timing waveforms. The PCI interface timing waveforms shall be
21、 as specified in figure 4. 3.5.5 Phy_Link interface timing waveforms. The Phy_Link interface timing waveforms shall be as specified in figure 5. 3.5.6 Local bus timing waveforms. The local bus timing waveforms shall be as specified in figure 6. 3.5.7 Zoom Video IF timing waveforms (8 bit, divide-by-
22、2 mode). The Zoom Video IF timing waveforms (8 bit, divide-by-2 mode) shall be as specified in figure 7. 3.5.8 Zoom Video IF timing waveforms (16 bit, divide-by-1 mode). The Zoom Video IF timing waveforms (16 bit, divide-by-1 mode) shall be as specified in figure 8. 3.5.9 Zoom Video IF timing wavefo
23、rms (16 bit, divide-by-2 mode). The Zoom Video IF timing waveforms (16 bit, divide-by-2 mode) shall be as specified in figure 9. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 1623
24、6 DWG NO. V62/08625 REV PAGE 5 TABLE I. Electrical performance characteristics. 1/ Limits Test 1/ Symbol Operation Test condition 2/ unless otherwise noted Min Max Unit 3.3 V IOH= -0.5 mA 0.9 VCCPCI 5 V IOH= -2 mA 2.4 TTL/LVCMOS 4/ IOH= -18 mA 2.4 High level output voltage 3/ TTL/LVCMOS 4/ VOHIOH= -
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