DLA DSCC-VID-V62 07639 REV A-2010 MICROCIRCUIT DIGITAL-LINEAR DUAL OUTPUT SYNCHRONOUS REGULATOR MONOLITHIC SILICON.pdf
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1、 REVISIONSLTR DESCRIPTION DATE APPROVEDA Add -01XE device. - ro 10-12-14 C. SAFFLE CURRENT DESIGN ACTIVITY CAGE CODE 16236 HAS CHANGED NAMES TO: DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 Prepared in accordance with ASME Y14.24 Vendor item drawing REV PAGE REV PAGE REV STATUS OF PAGES REV A A A
2、 A A A A A A A A A A A A PAGE 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 PMIC N/A PREPARED BY RICK OFFICER DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 Original date of drawing YY-MM-DD CHECKED BY RAJESH PITHADIA TITLE MICROCIRCUIT, DIGITAL-LINEAR, DUAL OUTPUT SYNCHRONOUS REGULATOR, MONOLITHIC
3、SILICON 07-10-30 APPROVED BY ROBERT M. HEBER SIZE A CODE IDENT. NO. 16236 DWG NO. V62/07639 REV A PAGE 1 OF 15 AMSC N/A 5962-V023-11 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO.
4、16236 DWG NO. V62/07639 REV A PAGE 2 1. SCOPE 1.1 Scope. This drawing documents the general requirements of a high performance dual output synchronous regulator microcircuit, with an operating temperature range of -55C to +125C. 1.2 Vendor Item Drawing Administrative Control Number. The manufacturer
5、s PIN is the item of identification. The vendor item drawing establishes an administrative control number for identifying the item on the engineering documentation: V62/07639 - 01 X B Drawing Device type Case outline Lead finish number (See 1.2.1) (See 1.2.2) (See 1.2.3) 1.2.1 Device type(s). Device
6、 type Generic Circuit function 01 ISL65426 Dual output synchronous regulator 1.2.2 Case outline(s). The case outline(s) are as specified herein. Outline letter Number of pins JEDEC PUB 95 Package style X 50 See figure 1 Quad leadless flat package 1.2.3 Lead finishes. The lead finishes are as specifi
7、ed below or other lead finishes as provided by the device manufacture: Finish designator Material A Hot solder dip B Tin-lead plateC Gold plateD PalladiumE Gold flash palladium Z Other Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CE
8、NTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/07639 REV A PAGE 3 1.3 Absolute maximum ratings. 1/ Supply voltage range at VCC, PVINx, LXx pins GND -0.3 V to +6 V Supply voltage range at FBx, ENx, VxSETx, ISETx, PGOODx pins -0.3 V to VCC+0.3 V Power dissipation (PD) . 1.23 W M
9、aximum junction temperature range (TJ) . +150C Maximum storage temperature range (TSTG) . -65C to +150C Maximum lead temperature (soldering 10 seconds) +260C Electrostatic discharge (ESD) classification: Human body model (HBM) . 2 kV Machine model (MM) . 200 V Thermal resistance, junction to case (J
10、C) . 2.5C/W 2/ Thermal resistance, junction to ambient (JA) 23C/W 3/ 1.4 Recommended operating conditions. 4/ Supply voltage range at VCCand PVINx pins 2.375 V to +5.5 V Operating free-air temperature range (TA) . -55C to +125C 1/ Stresses beyond those listed under “absolute maximum rating” may caus
11、e permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect devic
12、e reliability. 2/ Thermal resistance, junction to ambient (JA) is measured in free air with the component mounted on a high effective thermal conductivity test board with direct attach features. See manufacturers technical brief TB379 for details. 3/ Thermal resistance, junction to case (JC), the ca
13、se temperature location is the center of the exposed metal pad on the package underside. See manufacturers technical brief TB379 for details. Continuous operation at a TJ +125C and at maximum conditions will reduce the life expectancy of the device to as little as two years. 4/ Use of this product b
14、eyond the manufacturers design rules or stated parameters is done at the users risk. The manufacturer and/or distributor maintain no responsibility or liability for product used beyond the stated limits. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-
15、,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/07639 REV A PAGE 4 2. APPLICABLE DOCUMENTS JEDEC PUB 95 Registered and Standard Outlines for Semiconductor Devices (Applications for copies should be addressed to the Electronic Industries Alliance, 2500 Wilson
16、Boulevard, Arlington, VA 22201-3834 or online at http:/www.jedec.org) 3. REQUIREMENTS 3.1 Marking. Parts shall be permanently and legibly marked with the manufacturers part number as shown in 6.3 herein and as follows: A. Manufacturers name, CAGE code, or logo B. Pin 1 identifier C. ESDS identificat
17、ion (optional) 3.2 Unit container. The unit container shall be marked with the manufacturers part number and with items A and C (if applicable) above. 3.3 Electrical characteristics. The maximum and recommended operating conditions and electrical performance characteristics are as specified in 1.3,
18、1.4, and table I herein. 3.4 Design, construction, and physical dimension. The design, construction, and physical dimensions are as specified herein. 3.5 Diagrams. 3.5.1 Case outline. The case outline shall be as shown in 1.2.2 and figure 1. 3.5.2 Terminal connections. The terminal connections shall
19、 be as shown in figure 2. 3.5.3 Block diagram. The block diagram shall be as shown in figure 3. 4. VERIFICATION 4.1 Product assurance requirements. The manufacturer is responsible for performing all inspection and test requirements as indicated in their internal documentation. Such procedures should
20、 include proper handling of electrostatic sensitive devices, classification, packaging, and labeling of moisture sensitive devices, as applicable. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A C
21、ODE IDENT NO. 16236 DWG NO. V62/07639 REV A PAGE 5 TABLE I. Electrical performance characteristics. 1/ Test Symbol Conditions VCC= PVIN = 5.0 V unless otherwise specifiedTemperature, TADevice type Limits Unit Min Max Power supply section Quiescent supply current EN1 = EN2 = EN = VCC= 5 V, IOUT1= IOU
22、T2= 0 mA +25C 01 30 typical mA Shutdown supply EN1 = EN2 = EN = GND, -55C to +125C 01 7.5 mA current VCC= PVIN = 5.5 V +25C 5.4 typical EN1 = EN2 = EN = GND, -55C to +125C 3.4 VCC= PVIN = 3.3 V +25C 2.8 typical EN1 = EN2 = EN = GND, VCC= PVIN = 2.375 V +25C 1.7 typical Phase configuration section In
23、ductor (LX) pull down LX1, LX3, LX4, LX5, LX6 only, configuration only +25C 01 1 typical mA Inductor (LX) output Low level, single LX output -55C to +125C 01 -5 5 A leakage High level, single LX output -5 5 Minimum controllable ON time 2/ +25C 01 125 typical ns Output voltage tolerance section Refer
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