DLA DSCC-VID-V62 04611 REV A-2010 MICROCIRCUIT DIGITAL 1394b OHCI-LYNX CONTROLLER MONOLITHIC SILICON.pdf

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1、 REVISIONS LTR DESCRIPTION DATE APPROVED A Update boilerplate paragraphs to current requirements. - PHN 10-01-19 Thomas M. Hess Prepared in accordance with ASME Y14.24 Vendor item drawing REV PAGE REV PAGE REV STATUS OF PAGES REV A A A A A A A A A PAGE 1 2 3 4 5 6 7 8 9 PMIC N/A PREPARED BY Phu H Ng

2、uyen DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO. 43218-3990 Original date of drawing CHECKED BY Phu H. Nguyen TITLE MICROCIRCUIT, DIGITAL, 1394b OHCI-LYNX CONTROLLER, MONOLITHIC SILICON YY MM DD 04-02-11 APPROVED BY Thomas M. Hess SIZE A CODE IDENT. NO. 16236 DWG NO. V62/04611 REV A PAGE 1 OF 9

3、AMSC N/A 5962-V023-10 .Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/04611 REV A PAGE 2 1. SCOPE 1.1 Scope. This drawing documents the general requirements of a

4、high performance 1394b OHCIO-Lynx controller microcircuit, with an operating temperature range of -40C to +85C. 1.2 Vendor Item Drawing Administrative Control Number. The manufacturers PIN is the item of identification. The vendor item drawing establishes an administrative control number for identif

5、ying the item on the engineering documentation: V62/04611 - 01 X E Drawing Device type Case outline Lead finish number (See 1.2.1) (See 1.2.2) (See 1.2.3) 1.2.1 Device type(s). 1/ Device type Generic Circuit function 01 TSB82AA2-EP 1394b OHCI-Lynx controller 1.2.2 Case outline(s). The case outlines

6、are as specified herein. Outline letter Number of pins Package style X 144 Plastic quad flat pack 1.2.3 Lead finishes. The lead finishes are as specified below or other lead finishes as provided by the device manufacture: Finish designator Material A Hot solder dip B Tin-lead plate C Gold plate D Pa

7、lladium E Gold flash palladium Z Other 1.3 Absolute maximum ratings. 2/ Supply voltage range, (VCC) . -0.5 V to +3.6 V Supply voltage range, (VCCP) -0.5 V to +5.5 V Input voltage range for PCI, (VI) . -0.5 V to VCCP+ 0.5 V Input voltage range for PHY interface, (VI) . -0.5 V to VCC+ 0.5 V Output vol

8、tage range for PCI, (VO) . -0.5 V to VCC+ 0.5 V Output voltage for PHY interface, (VO) . -0.5 V to VCC+ 0.5 V Input clamp current, IIK(VIVCC) . 20 mA 3/ Output clamp current, IOK(VOVCC) 20 mA 4/ Storage temperature range, (TSTG) -65C to +150C 1/ Users are cautioned to review the manufacturers data m

9、anual for additional user information relating to this device. 2/ Stresses beyond those listed under “absolute maximum rating” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under

10、 “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 3/ Applies to external input and bidirectional buffers. VI VCCP4/ Applies to external output and bidirectional buffers. VO VCCPProvided by IHSNot for

11、ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/04611 REV A PAGE 3 1.4 Recommended operating conditions. 5/ Operation Min Max Unit Core voltage, (VCC) Commercial 3.3 V 3.0 3.6 V PCI I/O

12、clamping voltage, (VCCP) Commercial 3.3 V 3.0 3.6 V 5.0 V 4.5 5.5 High level input voltage, (VIH) 6/ PCI 3.3 V 0.475VCCPVCCPV 5.0 V 2.0 VCCPPHY interface 2.0 3.6 Low level input voltage, (VIL) 6/ PCI 3.3 V 0 0.325VCCPV 5.0 V 0 0.8 PHY interface 0 0.8 Input voltage, (VI) PCI 3.3 V 0 VCCPV PHY interfa

13、ce 0 3.6 Output voltage, (VO) 7/ PCI 3.3 V 0 VCCPV PHY interface 0 3.6 Input transition time, (trand tf) PCI 0 6 ns Operating ambient temperature, (TA) -40 85 C Virtual junction temperature, (TJ) 8/ 0 115 C 2. APPLICABLE DOCUMENTS IEEE Standard 1394b - IEEE Standard for High Speed Serial Buses Allow

14、ing Gigabit Signaling. (Applications for copies should be addressed to the Institute of Electrical and Electronic Engineers, 445 Hoes Lane, Piscataway, NJ 08854-4150 JEDEC PUB 95 Registered and Standard Outlines for Semiconductor Devices (Applications for copies should be addressed to the Electronic

15、 Industries Alliance, 2500 Wilson Boulevard, Arlington, VA 22201-3834 or online at http:/www.jedec.org) 3. REQUIREMENTS 3.1 Marking. Parts shall be permanently and legibly marked with the manufacturers part number as shown in 6.3 herein and as follows: A. Manufacturers name, CAGE code, or logo B. Pi

16、n 1 identifier C. ESDS identification (optional) 3.2 Unit container. The unit container shall be marked with the manufacturers part number and with items A and C (if applicable) above. 5/ Use of this product beyond the manufacturers design rules or stated parameters is done at the users risk. The ma

17、nufacturer and/or distributor maintain no responsibility or liability for product used beyond the stated limits. 6/ Applies to external input and bidirectional buffers without hysteresis. 7/ Applies to external output buffers. 8/ The junction temperatures reflect simulation conditions. Customer is r

18、esponsible for verifying junction temperature. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/04611 REV A PAGE 4 3.3 Electrical characteristics. The maximum and r

19、ecommended operating conditions and electrical performance characteristics are as specified in 1.3, 1.4, and table I herein. 3.4 Design, construction, and physical dimension. The design, construction, and physical dimensions are as specified herein. 3.5 Diagrams. 3.5.1 Case outline(s). The case outl

20、ine(s) shall be as shown in 1.2.2 and figure 1. 3.5.2 Terminal connections. The terminal connections shall be as shown in figure 2. 3.5.3 Block diagram. The block diagram shall be as specified in figure 3. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-

21、,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/04611 REV A PAGE 5 TABLE I. Electrical performance characteristics. 1/ Test Symbol Test condition -40C TA+85C 3.0 V VCC 3.6 V 3.0 V VCCP 3.6 V 2/ 4.5 V VCCP 5.5 V 3/ unless otherwise noted Operation Limits Uni

22、t Min Max High level output voltage PCI VOHIOH= -0.5 mA 0.9 VCCV IOH= -2.0 mA 2.4 PHY interface IOH= -4.0 mA 2.8 IOH= -8.0 mA VCC 0.6 Low level output voltage 4/ PCI VOLIOL= 1.5 mA 0.1 VCCIOL= 6.0 mA 0.55 PME_PCI IOL= 4.0 mA 0.5 PHY interface IOL= 8.0 mA 0.5 Three- state output high impedance Output

23、 terminals IOZVO = VCC or GND 3.6 V 20 A Low level input current Input terminals IILVI= GND 5/ 3.6 V 20 I/O terminals 4/ 3.6 V 20 High level input current PCI 4/ IIHVI = VCC 5/ 3.6 V 20 Others 4/ 3.6 V 20 Switching characteristics for PCI interface 4/ Setup time before PCLK tsu7 ns Hold time after P

24、CLK th0 Delay time, PCLK to data valid tval2 11 Switching characteristics for PHY-Link interface Setup time, Dn, CTLn, LREQ to PHY_CLK tsu6 ns Hold time, Dn, CTLn, LREQ after PHY_CLK th0 Delay time, PHY_CLK to Dn, CTLn td1 10 1/ Testing and other quality control techniques are used to the extent dee

25、med necessary to assure product performance over the specified temperature range. Product may not necessarily be tested across the full temperature range and all parameters may not necessarily be tested. In the absence of specific parametric testing, product performance is assured by characterizatio

26、n and/or design. 2/ For 3.3 V operation. 3/ For 5.0 V operation. 4/ For I/O terminals, input leakage (IILand IIH) includes IOZof the disabled output. 5/ Theses parameters are ensured by design. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE

27、SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/04611 REV A PAGE 6 Case X Millimeters Symbol Min Max Symbol Min Max A 1.60 D1/E1 19.80 20.20 A1 1.35 1.45 D2/E2 17.50 TYP b 0.17 0.27 e 0.50 TYP c 0.05 K 0.45 0.75 D/E 21.80 22.20 Notes: 1. All linear dimension are in mil

28、limeters. 2. This drawing is subject to change without notice. 3. Falls within JEDEC MS-026 FIGURE 1. Case outlines. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V6

29、2/04611 REV A PAGE 7 Case X Pin No. Terminal Name Pin No. Terminal Name Pin No. Terminal Name Pin No. Terminal Name 1 MFUNC 37 PCI_AD17 73 64REQ_PCI 109 PCI_AD42 2 EN_REG 38 PCI_AD16 74 PCI_C/ 7BE 110 PCI_AD41 3 SCL 39 PCI_C/ 2BE 75 VCC111 PCI_AD40 4 SDA 40 FRAME_PCI 76 GND 112 GND 5 INTA_PCI 41 IRD

30、Y_PCI 77 PCI_C/ 6BE 113 PCI_A39D 6 RST_PCI 42 VCC78 PCI_C/ 5BE 114 PCI_AD38 7 RST_G 43 GND 79 PCI_C/ 4BE 115 PCI_AD37 8 VCC44 TRDY_PCI 80 PCI_PAR64 116 PCI_AD36 9 GND 45 DEVSEL_PCI 81 GND 117 VCCP10 PCI_CLK 46 STOP_PCI 82 PCI_AD63 118 PCI_AD35 11 NC 47 PERR_PCI 83 PCI_AD62 119 PCI_AD34 12 GNT_PCI 48

31、 SERR_PCI 84 PCI_AD61 120 PCI_AD33 13 REQ_PCI 49 PCI_PAR 85 PCI_AD60 121 PCI_AD32 14 PME_PCI 50 PCI_C/ 1BE 86 VCC122 GND 15 VCC51 PCI_AD15 87 REG18 123 PHY_D7 16 REG18 52 GND 88 PCI_AD59 124 PHY_D6 17 PCI_AD31 53 PCI_AD14 89 PCI_AD58 125 PHY_D5 18 PCI_AD30 54 PCI_AD13 90 PCI_AD57 126 VCC19 PCI_AD29

32、55 VCCP91 VCCP127 GND 20 PCI_AD28 56 PCI_AD12 92 PCI_AD56 128 PHY_D4 21 VCCP57 PCI_AD11 93 GND 129 PHY_D3 22 GND 58 PCI_AD10 94 PCI_AD55 130 PHY_D2 23 PCI_AD27 59 PCI_AD9 95 PCI_AD54 131 PHY_D1 24 PCI_AD26 60 PCI_AD8 96 PCI_AD53 132 PHY_D0 25 PCI_AD25 61 PCI_C/ 0BE 97 PCI_AD52 133 PHY_CTL1 26 PCI_AD

33、24 62 VCC98 PCI_AD51 134 PHY_CTL0 27 PCI_C/ 3BE 63 GND 99 PCI_AD50 135 VCC28 PCI_IDSEL 64 PCI_AD7 100 PCI_AD49 136 PHY_LCLK 29 PCI_AD23 65 PCI_AD6 101 PCI_AD48 137 GND 30 PCI_AD22 66 PCI_AD5 102 VCC138 PHY_PCLK 31 VCC67 PCI_AD4 103 GND 139 VCC32 GND 68 PCI_AD3 104 PCI_AD47 140 GND 33 PCI_AD21 69 PCI

34、_AD2 105 PCI_AD46 141 PHY_LREQ 34 PCI_AD20 70 PCI_AD1 106 PCI_AD45 142 PHY_LINKON 35 PCI_AD19 71 PCI_AD0 107 PCI_AD44 143 PHY_PINT 36 PCI_AD18 72 64ACK_PCI 108 PCI_AD43 144 PHY_LPS FIGURE 2 Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license fro

35、m IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/04611 REV A PAGE 8 FIGURE 3. Block diagram. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE ID

36、ENT NO. 16236 DWG NO. V62/04611 REV A PAGE 9 4. VERIFICATION 4.1 Product assurance requirements. The manufacturer is responsible for performing all inspection and test requirements as indicated in their internal documentation. Such procedures should include proper handling of electrostatic sensitive

37、 devices, classification, packaging, and labeling of moisture sensitive devices, as applicable. 5. PREPARATION FOR DELIVERY 5.1 Packaging. Preservation, packaging, labeling, and marking shall be in accordance with the manufacturers standard commercial practices for electrostatic discharge sensitive

38、devices. 6. NOTES 6.1 ESDS. Devices are electrostatic discharge sensitive and are classified as ESDS class 1 minimum. 6.2 Configuration control. The data contained herein is based on the salient characteristics of the device manufacturers data book. The device manufacturer reserves the right to make

39、 changes without notice. This drawing will be modified as changes are provided. 6.3 Suggested source(s) of supply. Identification of the suggested source(s) of supply herein is not to be construed as a guarantee of present or continued availability as a source of supply for the item. Vendor item dra

40、wing administrative control number 1/ Device manufacturer CAGE code Vendor part number V62/04611-01XE 01295 TSB82AA2IPGEEP 1/ The vendor item drawing establishes an administrative control number for identifying the item on the engineering documentation. CAGE code Source of supply 01295 Texas Instrum

41、ents, Inc. Semiconductor Group 8505 Forest Lane P.O. Box 660199 Dallas, TX 75243 Point of contact: U.S. Highway 75 South P.O. Box 84, M/S 853 Sherman, TX 75090-9493 | This value was obtained with continuous external writes, CLKOFF = 0 and load = 15 pF. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-