DLA DSCC-VID-V62 03646 REV A-2009 MICROCIRCUIT DIGITAL ADVANCED HIGH SPEED CMOS HEX INVERTER MONOLITHIC SILICON.pdf
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1、 REVISIONS LTR DESCRIPTION DATE APPROVED A Update boilerplate paragraphs to current requirements. - PHN 09-03-16 Thomas M. Hess Prepared in accordance with ASME Y14.24 Vendor item drawing REV PAGE REV PAGE REV A A A A A A A A A A A REV STATUS OF PAGES PAGE 1 2 3 4 5 6 7 8 9 10 11 PMIC N/A PREPARED B
2、Y Charles F. Saffle DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO 43218-3990 Original date of drawing CHECKED BY Charles F. Saffle APPROVED BY Thomas M. Hess TITLE MICROCIRCUIT, DIGITAL, ADVANCED HIGH SPEED CMOS, HEX INVERTER, MONOLITHIC SILICON SIZE A CODE IDENT. NO. 16236 DWG NO. V62/03646 YY-MM-
3、DD 03-08-12 REV A PAGE 1 OF 11 AMSC N/A 5962-V048-09 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/03646 REV A PAGE 2 1. SCOPE 1.1 Scope. This drawing documents
4、the general requirements of a high performance hex inverter microcircuit, with an operating temperature range of -55C to +125C. 1.2 Vendor Item Drawing Administrative Control Number. The manufacturers PIN is the item of identification. The vendor item drawing establishes an administrative control nu
5、mber for identifying the item on the engineering documentation: V62/03646 - 01 X E Drawing Device type Case outline Lead finish number (See 1.2.1) (See 1.2.2) (See 1.2.3) 1.2.1 Device type(s). Device type Generic Circuit function 01 74AHC04-EP Hex inverter 1.2.2 Case outlines. The case outlines are
6、as specified herein. Outline letter Number of pins JEDEC PUB 95 Package style X 14 JEDEC MO-153 Plastic small-outline Y 14 JEDEC MS-012 Plastic small-outline 1.2.3 Lead finishes. The lead finishes are as specified below or other lead finishes as provided by the device manufacturer: Finish designator
7、 Material A Hot solder dip B Tin-lead plate C Gold plate D Palladium E Gold flash palladium Z Other 1.3 Absolute maximum ratings. 1/ Supply voltage range (VCC) . -0.5 V to +7.0 V Input voltage range (VI). -0.5 V to +7.0 V 2/ Output voltage range (VO) . -0.5 V to VCC+ 0.5 V 2/ Input clamp current (II
8、K) (VIVCC) 20 mA Continuous output current (IO) (VO= 0 to VCC) 25 mA Continuous current through VCCor GND. 50 mA Package thermal impedance (JA): X package . 113C/W 3/ Y package . 86C/W 3/ Storage temperature range (TSTG). -65C to +150C 1/ Stresses beyond those listed under “absolute maximum rating”
9、may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affe
10、ct device reliability. 2/ The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 3/ The package thermal impedance is calculated in accordance with JESD 51-7. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from
11、IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/03646 REV A PAGE 3 1.4 Recommended operating conditions. 4/ 5/ Supply voltage range (VCC) . 2.0 V to 5.5 V Minimum high level input voltage (VIH): VCC= 2.0 V 1.5 V VCC= 3.0 V 2.1 V VCC= 5.5 V 3.85 V Maximu
12、m low level input voltage (VIL): VCC= 2.0 V 0.5 V VCC= 3.0 V 0.9 V VCC= 5.5 V 1.65 V Input voltage range (VI). 0.0 V to 5.5 V Output voltage range (VO) . 0.0 V to VCCMaximum high level output current (IOH): VCC= 2.0 V -50 A VCC= 3.3 V 0.3 V. -4.0 mA VCC= 5.0 V 0.5 V. -8.0 mA Maximum low level output
13、 current (IOL): VCC= 2.0 V 50 A VCC= 3.3 V 0.3 V. 4.0 mA VCC= 5.0 V 0.5 V. 8.0 mA Maximum input transition rise or fall rate (t/v): VCC= 3.3 V 0.3 V. 100 ns/V VCC= 5.0 V 0.5 V. 20 ns/V Operating free-air temperature range (TA). -55C to +125C 2. APPLICABLE DOCUMENTS JEDEC PUB 95 - Registered and Stan
14、dard Outlines for Semiconductor Devices JESD 51-7 - High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages (Applications for copies should be addressed to the Electronic Industries Alliance, 2500 Wilson Boulevard, Arlington, VA 22201-3834 or online at http:/www.jedec.org) 4
15、/ Use of this product beyond the manufacturers design rules or stated parameters is done at the users risk. The manufacturer and/or distributor maintain no responsibility or liability for product used beyond the stated limits. 1/ All unused inputs of the device must be held at VCCor GND to ensure pr
16、oper device operation. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/03646 REV A PAGE 4 3. REQUIREMENTS 3.1 Marking. Parts shall be permanently and legibly marke
17、d with the manufacturers part number as shown in 6.3 herein and as follows: A. Manufacturers name, CAGE code, or logo B. Pin 1 identifier C. ESDS identification (optional) 3.2 Unit container. The unit container shall be marked with the manufacturers part number and with items A and C (if applicable)
18、 above. 3.3 Electrical characteristics. The maximum and recommended operating conditions and electrical performance characteristics are as specified in 1.3, 1.4, and table I herein. 3.4 Design, construction, and physical dimension. The design, construction, and physical dimensions are as specified h
19、erein. 3.5 Diagrams. 3.5.1 Case outlines. The case outlines shall be as shown in 1.2.2 and figure 1. 3.5.2 Truth table. The truth table shall be as shown in figure 2. 3.5.3 Logic diagram. The logic diagram shall be as shown in figure 3. 3.5.4 Terminal connections. The terminal connections shall be a
20、s shown in figure 4. 3.5.5 Timing waveforms and test circuit. The timing waveforms and test circuit shall be as shown in figure 5. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16
21、236 DWG NO. V62/03646 REV A PAGE 5 TABLE I. Electrical performance characteristics. 1/ Limits Test Symbol Conditions VCCTemperature, TADevice type Min Max Unit 2.0 V 1.9 3.0 V 2.9 IOH= -50 A 4.5 V 25C, -55C to 125C 4.4 25C 2.58 IOH = -4 mA 3.0 V -55C to 125C 2.48 25C 3.94 High level output voltage V
22、OHIOH= -8 mA 4.5 V -55C to 125C 01 3.80 V 2.0 V 0.1 3.0 V 0.1 IOL= 50 A 4.5 V 25C, -55C to 125C 0.1 25C 0.36 IOL = 4 mA 3.0 V -55C to 125C 0.5 25C 0.36 Low level output voltage VOLIOL= 8 mA 4.5 V -55C to 125C 01 0.5 V 25C 01 0.1 Input current II VI = 5.5 V or GND 0.0 V to 5.5 V -55C to 125C 1.0 A 25
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