DLA DSCC-VID-V62 03642 REV A-2009 MICROCIRCUIT DIGITAL CONFIGURABLE MULTIPLE FUNCTION GATE MONOLITHIC SILICON.pdf
《DLA DSCC-VID-V62 03642 REV A-2009 MICROCIRCUIT DIGITAL CONFIGURABLE MULTIPLE FUNCTION GATE MONOLITHIC SILICON.pdf》由会员分享,可在线阅读,更多相关《DLA DSCC-VID-V62 03642 REV A-2009 MICROCIRCUIT DIGITAL CONFIGURABLE MULTIPLE FUNCTION GATE MONOLITHIC SILICON.pdf(10页珍藏版)》请在麦多课文档分享上搜索。
1、 REVISIONS LTR DESCRIPTION DATE APPROVED A Update boilerplate paragraphs to current requirements. - PHN 09-02-25 Charles F. Saffle Prepared in accordance with ASME Y14.24 Vendor item drawing REV PAGE REV PAGE REV A A A A A A A A A A REV STATUS OF PAGES PAGE 1 2 3 4 5 6 7 8 9 10 PMIC N/A PREPARED BY
2、Phu H. Nguyen DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO 43218-3990 Original date of drawing YY-MM-DD CHECKED BY Phu H. Nguyen APPROVED BY Thomas M. Hess TITLE MICROCIRCUIT, DIGITAL, CONFIGURABLE MULTIPLE FUNCTION GATE, MONOLITHIC SILICON SIZE A CODE IDENT. NO. 16236 DWG NO. V62/03642 03-09-03 R
3、EV A PAGE 1 OF 10 AMSC N/A 5962-V044-09 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/03642 REV A PAGE 2 1. SCOPE 1.1 Scope. This drawing documents the general r
4、equirements of a configurable multiple-function gate, with an operating temperature range of -40C to +85C. 1.2 Vendor Item Drawing Administrative Control Number. The manufacturers PIN is the item of identification. The vendor item drawing establishes an administrative control number for identifying
5、the item on the engineering documentation: V62/03642 01 X E Drawing Device type Case outline Lead finish number (See 1.2.1) (See 1.2.2) (See 1.2.3) 1.2.1 Device type(s). 1/ Device Generic number Circuit function 01 SN74LVC1G97-EP Configurable multiple-function gate 1.2.2 Case outline(s). The case ou
6、tlines are as specified herein. Outline letter Number of pins JEDEC PUB 95 Package style X 6 JEDEC MO-203 Plastic small outline 1.2.3 Lead finishes. The lead finishes are as specified below or other lead finishes as provided by the device manufacturer: Finish designator Material A Hot solder dip B T
7、in-lead plate C Gold plate D Palladium E Gold flash palladium Z Other _ 1/ Users are cautioned to review the manufacturers data manual for additional user information relating to these devices. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE
8、SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/03642 REV A PAGE 3 1.3 Absolute maximum ratings. 2/ Supply voltage range, (VCC) . -0.5 V to +6.5 V Input voltage range, (VI) . -0.5 V to +6.5 V 3/ Voltage range applied to any output in the high-impedance or power-off sta
9、te, (VO) . -0.5 V to +6.5 V 3/ Voltage range applied to any output in the high or low state, (VO) -0.5 V to +6.5 V 3/ 4/ Input clamp current, (IIK) (VI 0) -50 mA Output clamp current, (IOK) (VO 0) . -50 mA Continuous output current, (IO) . 50 mA Continuous current through VCCor GND 100 mA Package th
10、ermal impedance, (JA) . +259C/W 5/ Storage temperature range, (TSTG) -65C to +150C 1.4 Recommended operating conditions. 6/ 7/ Min Max Unit Operating 1.65 5.5 Supply voltage VCCData retention only 1.5 V Input voltage VI0 5.5 V Output voltage VO0 VCCV VCC= 1.65 V -4 VCC= 2.3 V -8 -16 VCC= 3.0 V -24 H
11、igh level output current IOHVCC= 4.5 V -32 mA VCC= 1.65 V 4 VCC= 2.3 V 8 16 VCC= 3.0 V 24 Low level output current IOLVCC= 4.5 V 32 mA Operating ambient temperature TA-40 85 C 2/ Stresses beyond those listed under “absolute maximum rating” may cause permanent damage to the device. These are stress r
12、atings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 3/ The input negative-voltage and out
13、put voltage ratings may be exceeded if the input and output current ratings are observed. 4/ The value of VCCis provided in the recommended operating conditions table. 5/ The package terminal impedance is calculated in accordance with JESD 51-7 6/ Use of this product beyond the manufacturers design
14、rules or stated parameters is done at the users risk. The manufacturer and/or distributor maintain no responsibility or liability for product used beyond the stated limits. 7/ All unused inputs of the device must be held at VCCor GND to ensure proper device operation. Refer to the manufacturer appli
15、cation report, Implications of Slow or Floating CMOS inputs, literature number SCBA004. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/03642 REV A PAGE 4 2. APPLI
16、CABLE DOCUMENTS JEDEC PUB 95 Registered and Standard Outlines for Semiconductor Devices JEDEC STD 51-7 High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages (Applications for copies should be addressed to the Electronic Industries Alliance, 2500 Wilson Boulevard, Arlington
17、, VA 22201-3834 or online at http:/www.jedec.org) 3. REQUIREMENTS 3.1 Marking. Parts shall be permanently and legibly marked with the manufacturers part number as shown in 6.3 herein and as follows: A. Manufacturers name, CAGE code, or logo B. Pin 1 identifier C. ESDS identification (optional) 3.2 U
18、nit container. The unit container shall be marked with the manufacturers part number and with items A and C (if applicable) above. 3.3 Electrical characteristics. The maximum and recommended operating conditions and electrical performance characteristics are as specified in 1.3, 1.4, and table I her
19、ein. 3.4 Design, construction, and physical dimension. The design, construction, and physical dimensions are as specified herein. 3.5 Diagrams. 3.5.1 Case outline(s). The case outline(s) shall be as shown in 1.2.2 and figure 1. 3.5.2 Terminal connections. The terminal connections shall be as specifi
20、ed on figure 2. 3.5.3 Logic diagram. The logic diagram shall be as specified on figure 3. 3.5.4 Logic configuration. The logic configuration shall be as specified on figure 4. 3.5.5 Load circuit and timing waveforms. The load circuit and timing waveforms shall be as specified on figure 5. Provided b
21、y IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/03642 REV A PAGE 5 TABLE I. Electrical performance characteristics. 1/ Limits Test Symbol Test conditions -40C TA +85C unless
- 1.请仔细阅读文档,确保文档完整性,对于不预览、不比对内容而直接下载带来的问题本站不予受理。
- 2.下载的文档,不会出现我们的网址水印。
- 3、该文档所得收入(下载+内容+预览)归上传者、原创作者;如果您是本文档原作者,请点此认领!既往收益都归您。
下载文档到电脑,查找使用更方便
10000 积分 0人已下载
下载 | 加入VIP,交流精品资源 |
- 配套讲稿:
如PPT文件的首页显示word图标,表示该PPT已包含配套word讲稿。双击word图标可打开word文档。
- 特殊限制:
部分文档作品中含有的国旗、国徽等图片,仅作为作品整体效果示例展示,禁止商用。设计者仅对作品中独创性部分享有著作权。
- 关 键 词:
- DLADSCCVIDV6203642REVA2009MICROCIRCUITDIGITALCONFIGURABLEMULTIPLEFUNCTIONGATEMONOLITHICSILICONPDF

链接地址:http://www.mydoc123.com/p-689076.html