DLA DSCC-DWG-91011 REV B-2003 SEMICONDUCTOR DEVICE DIODE ULTRA FAST《超快二极管半导体器件》.pdf

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1、 REVISIONS LTR DESCRIPTION DATE APPROVED A Update of source information and various testing. Editorial changes throughout. 18 Jan 1994 Kendall Cottongim B Update sources and format 16 June 2003 Thomas M. Hess Prepared in accordance with ASME Y14.100 Selected item drawing REV PAGE REV PAGE REV STATUS

2、 OF PAGES REV B B B B B B B B B B B PAGES 1 2 3 4 5 6 7 8 9 10 11 PMIC N/A PREPARED BY Robert Petty DEFENSE ELECTRONICS SUPPLY CENTER, DAYTON, OH http:/www.dscc.dla.mil/programs/milspec/docsearch.asp Original date of drawing CHECKED BY Alan Barone TITLE 13 February 1991 APPROVED BY Kendall A. Cotton

3、gim SEMICONDUCTOR DEVICE, DIODE, ULTRA FAST SIZE A CODE IDENT. NO. 14933 DWG NO. 91011 REV B PAGE 1 OF 11 AMSC N/A 5961-E069 DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.CURRENT DESIGN ACTIVITY CAGE CODE 037Z3 DEFENSE LOGISTICS AGENCY DEFENSE SUPPLY CENTER COLUMBU

4、S COLUMBUS, OHIO 43216-5000 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 91011 REV B PAGE 2 1. SCOPE 1.1 Scope. This drawing describes the requirements for fast rec

5、overy rectifiers. 1.2 Part or Identifying Number (PIN). The complete PIN shall be as follows: 91011 - 01 R TX, TXV Drawing Dash number Polarity Quality number (see 1.2.1) Indicator Level 1/ 1.2.1 Device types. The device type shall identify the polarity and voltage of the devices as follows: Device

6、type Generic Figure number Polarity Voltage 91011-01 UFR3120 1 200 91011-01R UFR3120R 1 2/ 200 91011-02 UFR3130 1 300 91011-02R UFR3130R 1 2/ 300 91011-03 UFR3140 1 400 91011-03R UFR3140R 1 2/ 400 1.2.2 Quality levels. The TX and TXV suffix part shall be as specified in MIL-PRF-19500 paragraph 3.3.

7、1.3 Maximum ratings. Type PTTC= +25C VRWMIOat TC= +100C Topand TSTGIFSM8.3 ms 01 02 03 W 83.3 83.3 83.3 V dc 200 300 400 A dc 20 20 20 C -55 to +150 -55 to +150 -55 to +150 A (pk) 300 300 300 1.4 Primary electrical characteristics. Primary electrical characteristics at TC= +25C. Type IR1VR=rated VRW

8、MIR2VR=rated VRWMTA= +125C VFM1at IF= 20 A VFM2at IF= 20 A TC= +125C Reverse recovery time -01 -02 -03 A 50 50 50 mA 10 10 10 V(pk) 1.25 1.25 1.25 V(pk) 1.15 1.15 1.15 ns 50 50 50 1/ TXV devices supplied to this drawing shall be marked with the abbreviated suffix TV. 2/ The R suffix indicates polart

9、iy is anode to stud. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 91011 REV B PAGE 3 2. APPLICABLE DOCUMENTS 2.1 Government documents. 2.1.1 Specifications, standar

10、ds, and handbooks. The following specifications, standards, and handbooks form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of the Department of Defense Index of Specifications and Standards (DoDISS) a

11、nd supplement thereto, cited in the solicitation (see 6.2). SPECIFICATION DEPARTMENT OF DEFENSE MIL-PRF-19500 - Semiconductor Devices, General Specification for. STANDARD DEPARTMENT OF DEFENSE MIL-STD-750 - Test Methods for Semiconductor Devices. (Unless otherwise indicated, copies of the above spec

12、ifications, standards, and handbooks are available from the Document Automation and Production Services (DAPS), Building 4D (DPM-DODSSP), 700 Robbins Avenue, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this document and the references cited h

13、erein, the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Interface and physical dimensions. 3.2 Design, construction, and physical dimensions. The design, constr

14、uction, and physical dimensions shall be as specified in MIL-PRF-19500. Package dimensions shall be in accordance with MIL-PRF-19500, DO-203AA, (formerly DO-4). 3.2.1 Lead material and finish. Lead material shall be copper, copper Kovar or Alloy 52; a copper core or a copper plate is permitted. Lead

15、 finish shall be nickel plated and solder dipped. Where a choice of lead material or finish is desired, it shall be specified in the acquisition document (see 6.2). 3.2.2 Internal construction. Multiple chip construction shall not be permitted. 3.3 Recycled, recovered, or environmentally preferable

16、materials. Recycled, recovered, or environmentally preferable materials should be used to the maximum extent possible provided that the material meets or exceeds the operational and maintenance requirements, and promotes economically advantageous life cycle costs. 3.4 Certificate of compliance. A ce

17、rtificate of compliance shall be required from manufacturers requesting to be a suggested source of supply. 3.5 Marking. Marking shall be in accordance with MIL-PRF-19500. Devices supplied to TXV quality level shall be marked with the abbreviated TV suffix. 3.6 Manufacturer eligibility. To be eligib

18、le to supply devices to this drawing, the manufacturer shall have an approved facility in accordance with MIL-PRF-19500 for at least one line and at least one qualified JAN device listed on QML-19500. In addition, all devices specified herein shall meet all requirements of MIL-PRF-19500 except quali

19、fication requirements. It is prohibited for a manufacturer not listed in 6.5 to mark devices with this drawing number. 3.7 Submission of certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as a source of supply in 6.5. The certificate of

20、 compliance submitted to DSCC-VAC, prior to listing as an approved source of supply in 6.5, shall state that the manufacturers product meets the requirements of MIL-PRF-19500 and the requirements herein. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-

21、,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 91011 REV B PAGE 4 NOTES: 1. Dimensions are in inches. 2. Metric equivalents are given for general information only. 3. Units must not be damaged by torque of 15 inch-pounds applied to 10-32NF-2B nut assembled on th

22、read. 4. Diameter of unthreaded portion .189 inch (4.80 mm) max and .163 inch (4.14 mm) min. 5. Complete threads to extend to within 2.5 threads of seating plane. 6. Angular orientation of this terminal is undefined. 7. Max pitch diameter of plated threads shall be basic pitch diameter .169 inch (4.

23、31 mm) reference FED-STD-H28. 8. The A.S.A. thread reference is 10-32UNF2A. 9. Terminal shape is unrestricted. 10. Polarity is cathode to stud, R-Suffix polarity is anode to stud. FIGURE 1. Physical dimensions (DO-203AA, formerly DO-4). Ltr Dimensions Notes Inches Millimeters Min Max Min Max CH .405

24、 10.29 CD .424 10.77 HF .424 .437 10.77 11.10 HT .075 .175 1.90 4.44 OAH .800 20.32 C .250 6.35 9 T .060 1.52 SL .422 .453 10.72 11.51 K 3,5,7 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE

25、IDENT NO. 14933 DWG NO. 91011 REV B PAGE 5 3.8 Certificate of conformance. A certificate of conformance shall be provided with each lot of devices delivered in accordance with this drawing. 3.9 Workmanship. The semiconductor shall be uniform in quality and free from any defects that will affect life

26、, serviceability, or appearance. 4. VERIFICATION 4.1 Sampling and inspection. Unless otherwise specified, sampling and inspection procedures shall be performed in accordance with MIL-PRF-19500, and as specified herein. 4.2 Screening. All devices shall be screened in accordance with MIL-PRF-19500 (ta

27、ble II, JANTX and JANTXV requirements) and as specified herein. The following measurements shall be made in accordance with table I herein. Devices that exceed the limits of table I herein shall not be acceptable. Screen (see table IV of MIL-PRF-19500) TX and TXV levels Thermal response (1) 10 Not a

28、pplicable 11 Not applicable 12 Method 1038 of MIL-STD-750, test condition A, 96 hours min, TA= 125C, V = rated VRWM(see 4.3.3) 13 Not applicable (1) Shall be performed anytime before screen 10. 4.3 Conformance inspection. Conformance inspection shall consist of the examinations and tests specified i

29、n tables I, II, and III. 4.3.1 Group A inspection. Group A inspection shall consist of the inspections and tests specified in table I. 4.3.2 Group B inspection. Group B inspection shall be conducted in accordance with the conditions specified for subgroup testing of table IVb in MIL-PRF-19500 and ta

30、ble II herein. Electrical measurements shall be in accordance with table IV herein. 4.3.3 Group C inspection. Group C inspection shall be conducted in accordance with the conditions for subgroup testing in table V of MIL-PRF-19500, and table III herein. Electrical measurements (end-points) shall be

31、in accordance with the applicable steps of table IV herein. 4.4 Methods of inspection. Methods of inspection shall be as specified in the appropriate tables and as follows. 4.4.1 Pulse measurements. Conditions for pulse measurement shall be as specified in section 4 of MIL-STD-750. 4.4.2 Thermal res

32、istance. Thermal resistance measurements shall be performed in accordance with method 3101 or 4081 of MIL-STD-750. The maximum limit of RJC(max) shall be 1.5C/W. 4.4.3 Thermal response (VFmeasurements). The VFmeasurements shall be performed in accordance with method 3101 of MIL-STD-750. The VFcondit

33、ions and maximum VFlimit shall be derived by each vendor. The chosen VFmeasurements and conditions for each device in the qualification lot shall be submitted in the qualification report and a thermal response curve shall be plotted. The chosen VFvalue shall be considered final after the manufacture

34、r has had the opportunity to test five consecutive lots. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 91011 REV B PAGE 6 4.4.4 Reverse recovery time. The reverse re

35、covery time shall be measured as specified in the circuit of figure 2 or equivalent. Care should be exercised to minimize stray inductance in the test circuit and to insure that the total resistance of the reverse current loop can be adjusted sufficiently low so that more than one ampere will flow i

36、f not blocked by the diode being tested. Switch SW shall be activated and the regulated voltage source adjusted to achieve the specified forward current when SW is open. Inductor L and resistor R shall be adjusted to achieve the specified di/dt. The reverse recovery time shall be determined from the

37、 current waveform as shown on figure 2 or equivalent. TABLE I. Group A inspection. Inspection 1/ MIL-STD-750 Symbol Limits Unit Method Condition Min Max Subgroup 1 Visual and mechanical Inspection 2071 Subgroup 2 Reverse current 4016 VR= rated VRWMIR150 A dc Forward current 4011 IF= 20 A (pk) VF11.2

38、5 V (pk) Subgroup 3 High temperature operation TA= 125C Reverse current 4016 VR= rated VRWMIR210 mA dc Forward current 4011 IF= 20 A (pk) VF21.15 V (pk) Subgroup 4 Reverse recovery time 4031 TA= 25C, IF= 0.5 A, IR= 1 A, IREC= 0.25 A, see 4.4.4. trr50 ns Subgroup 5 Not applicable Subgroup 6 Surge cur

39、rent 4066 Tp= 8.3 ms, IO= 0, Ifsm= 300 A, 6 surges minimum. 1 surge per minute, maximum Electrical measurements See table IV, steps 1 and 2 1/ For sampling plan, see MIL-PRF-19500. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER

40、, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 91011 REV B PAGE 7 TABLE II. Group B inspection. Inspections MIL-STD-750 Method Condition Subgroup 1 1/ Solderability Resistance to solvents Subgroup 2 Thermal shock (temperature cycling) Hermetic seal a. Fine leak b. Gross leak Electrica

41、l measurements Subgroup 3 Steady state blocking Electrical measurements Subgroup 4 Decap internal visual (design verification), see 3.3.2 Subgroup 5 Thermal resistance Subgroup 6 High temperature (nonoperating) Electrical measurements 2026 1022 1051 1071 1038 2075 3010 or 4081 1032 TLow= -55C Thigh=

42、 150C Table IV, steps 1 and 2 Condition A, TA= 125C, IO= 0, f = 60 Hz, VR= rated VRWMor dc, VR= 85 percent rated VRWMTable IV, steps 1 and 2 See 4.4.2 TA = 150C Table IV, steps 1 and 2 1/ For sampling plan, see MIL-PRF-19500. Provided by IHSNot for ResaleNo reproduction or networking permitted witho

43、ut license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 91011 REV B PAGE 8 TABLE III. Group C inspection. Inspection 1/ MIL-STD-750 Method Condition Subgroup 1 Physcial dimensions 2066 See 3.2 Subgroup 2 Thermal shock (glass strain) 1056 Condition B

44、 Thermal shock (tension) 2036 Test condition A; weight = 5 pounds; t = 15 s Hermetic seal Fine leak Gross leak 1071 Moisture resistance 1021 Omit initial conditioning Visual and mechanical evaluation 2071 Electrical measurements Table IV, steps 1 and 2 Subgroup 3 Not applicable Subgroup 4 Salt atmos

45、phere (corrosion) 1041 Subgroup 5 Not applicable Subgroup 6Steady state blocking 1038 Condition A, TA = 125C, IO= 0, f = 60 Hz, VR= rated VRWMor dc, VR= 85 percent rated VRWMHermetic seal Fine leak Gross leak Electrical measurements 1071 Table IV, steps 1 and 2 1/ For sampling plan, see MIL-PRF-1950

46、0. TABLE IV. Groups A, B and C end-point measurements. MIL-STD-750 Limits Unit Step Inspection Method Conditions Symbol Min Max 50 1.25 A dc V (pk) 1. 2. 3. Reverse current Forward voltage Reverse current 4061 4011 4016 VR= rated VRWMIF= 20 A (pk) IR1VF1IR1100% of initial value or 2.5 A whichever is

47、 greater Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 91011 REV B PAGE 9 NOTES: 1. Monitoring oscilloscope requirements: Tr 14 ns, Rin 9 M, Cin 12 pF, Lin(series) 0

48、.5 H. 2. SW characteristics: Mercury-wetted make-before-break relay switches at a 60 Hz rated. The relay should conduct for approximately 7.7 ms. (C.P. Clare HGP 1004 or equivalent). Pulse generator may be used to satisfy input requirements. 3. Voltage source characteristics: Output impedance 0.5 fr

49、om 0 to 2 kHz. FIGURE 2. Reverse recovery test circuit and current waveform through device under test. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 91011 REV B PAGE