DLA DSCC-DWG-87018 REV H-2012 RESISTOR NETWORK 16 PIN LEADLESS CHIP CARRIER.pdf

《DLA DSCC-DWG-87018 REV H-2012 RESISTOR NETWORK 16 PIN LEADLESS CHIP CARRIER.pdf》由会员分享，可在线阅读，更多相关《DLA DSCC-DWG-87018 REV H-2012 RESISTOR NETWORK 16 PIN LEADLESS CHIP CARRIER.pdf（8页珍藏版）》请在麦多课文档分享上搜索。

1、 REVISIONS LTR DESCRIPTION DATE APPROVED A Add new B tolerance. Change resistance temperature characteristics to 25 ppm/oC. Dimensional changes. Change resistance range to 100 ohms to 100 kilohms. Add new suppliers. 23 MAY 88 D. MOORE B Add new requirements for resistance characteristic, power ratin

2、gs, solderability, and dimensions. 26 MAY 89 D. MOORE C Deleted ozone depleting substance. Editorial changes throughout. 1 OCT 93 D. MOORE D Changes in accordance with NOR 5905-R007-94. 23 AUG 94 D. MOORE E Update and validation of drawing. Change reference specification to MIL-PRF-914. Editorial ch

3、anges throughout. 24 AUG 00 K. COTTONGIM F Add characteristic “R” to existing source of supply. 18 OCT 01 K. COTTONGIM G Changes in accordance with NOR 5905-R006-03. 17 DEC 02 K. COTTONGIM H Add pure tin, manufacturers eligibility, and pulse application paragraphs. Editorial changes throughout. 3 JU

4、L 12 M. Radecki CURRENT DESIGN ACTIVITY CAGE CODE 037Z3 HAS CHANGED NAMES TO: DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 Prepared in accordance with ASME Y14.100 Source control drawing REV STATUS OF PAGES REV H H H H H H H H PAGES 1 2 3 4 5 6 7 8 PMIC N/A PREPARED BY Allen R. Knox DEFENSE SUPPL

5、Y CENTER, COLUMBUS COLUMBUS, OH Original date of drawing: 20 AUGUST 1987 CHECKED BY David W. Withrow TITLE RESISTOR NETWORK, 16 PIN, LEADLESS CHIP CARRIER APPROVED BY David E. Moore SIZE A CODE IDENT. NO. 14933 DWG NO. 87018 REV H PAGE 1 OF 8 AMSC N/A 5905-2012-E18 Provided by IHSNot for ResaleNo re

6、production or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 87018 REV H PAGE 2 1. SCOPE 1.1 Scope. This drawing describes the requirements for a resistor network, fixed, film, leadless chip carrier, 16 pin, suppli

7、ed to the requirements of MIL-PRF-914/3 except as noted herein. These networks are available in hermetically sealed and nonhermetically sealed packages. 1.2 Part or Identifying Number (PIN). The complete PIN is as follows: 87018 - * * * * | | | | | | | | | | Drawing number Schematic (1.2.1) Resistan

8、ce (1.2.1.1) Tolerance (1.2.1.2) Characteristic (1.2.1.3) 1.2.1 Schematic. The schematic of the resistor network is identified by a single letter in accordance with figure 1. FIGURE 1. Schematics. 1.2.1.1 Resistance. The resistance is in accordance with MIL-PRF-914. 1.2.1.2 Resistance tolerance. The

9、 resistance tolerance is identified as a single letter in accordance with table I. TABLE I. Resistance tolerance. Symbol Resistance tolerance (in percent) B 0.1 D 0.5 F 1.0 G 2.0 J 5.0 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CE

10、NTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 87018 REV H PAGE 3 1.2.1.3 Characteristic. Resistor networks are available in characteristics R, V, H, or C, in accordance with MIL-PRF-914 (see 3.2). 2. APPLICABLE DOCUMENTS 2.1 Government documents. * 2.1.1 Specifications, standards

11、, and handbooks. The following specifications, standards, and handbooks form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-914 - Resistor N

12、etworks, Fixed, Film, Surface Mount, Nonestablished Reliability, and Established Reliability, General Specification For. DEPARTMENT OF DEFENSE STANDARD MIL-STD-202 - Test Methods for Electronic and Electrical Component Parts. MIL-STD-790 - Established Reliability and High Reliability Qualified Produ

13、cts List (QPL) Systems for Electrical, Electronic, and Fiber Optic Parts Specifications. MIL-STD-1285 - Marking of Electrical and Electronic Parts. * (Copies of these documents are available online at https:/assist.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Ave

14、nue, Building 4D, Philadelphia, PA 19111-5094.) * 2.2 Order of precedence. Unless otherwise noted herein or in the contract, in the event of a conflict between the text of this document and the references cited herein (except for related, specification sheets), the text of this document takes preced

15、ence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-914 and as specified herein. 3.2 Interface and physical dimen

16、sions. The resistor shall meet the interface and physical dimensions as specified in MIL-PRF-914 and herein (see figure 2). Cavity construction using wire bonding techniques shall be supplied only as a characteristic C (hermetically sealed) network 3.2.1 Termination. Termination finish shall be tin-

17、lead or hot solder dip as specified in MIL-PRF-914. * 3.2.2 Pure tin. The use of pure tin, as an underplate or final finish is prohibited both internally and externally. Tin content of resistor components and solder shall not exceed 97 percent, by mass. Tin shall be alloyed with a minimum of 3 perce

18、nt lead, by mass (see 6.5). 3.3 Electrical characteristics. 3.3.1 Resistance range. The resistance range shall be 100 ohms to 100 kilohms. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDEN

19、T NO. 14933 DWG NO. 87018 REV H PAGE 4 Inches mm Inches mm Inches mm Inches mm .003 0.08 .015 0.38 .025 0.64 .085 2.16 .005 0.13 .016 0.41 .040 1.02 .250 6.35 .010 0.25 .020 0.51 .050 1.27 .300 7.62 NOTES: 1. Dimensions are in inches. 2. Metric equivalents are given for general information only. 3.

20、Unless otherwise specified, tolerances are .008 (0.20 mm). 4. Adjacent corner pads may be rounded or diagonally cut to meet the .015 (0.38 mm) minimum requirement. FIGURE 2. Leadless chip carrier. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFEN

21、SE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 87018 REV H PAGE 5 3.3.2 Resistor power rating. The resistor power rating for individual resistors shall be in accordance with table II. TABLE II. Power ratings. Schematic Characteristics C, H, R, and V Element (watts) Net

22、work (watts) A 0.050 0.40 B 0.025 0.375 3.3.3 Package power rating. The package power rating shall be in accordance with table II. For temperatures in excess of 70oC, power rating shall be derated in accordance with MIL-PRF-914. 3.3.4 Power conditioning. Power conditioning shall be in accordance wit

23、h MIL-PRF-914 at 1.5 times the rated power specified for individual resistors (see 3.3.2). 3.3.5 Operating voltage. The maximum operating voltage shall be 50 Vdc. 3.3.6 Operating temperature. The operating temperature shall be -55oC to +125oC. 3.3.7 Resistance temperature characteristic. The resista

24、nce temperature characteristic shall be in accordance with MIL-PRF-914. 3.3.8 TC tracking. The TC tracking shall be 10 ppm/oC. 3.3.9 Solderability. When resistors are tested as specified in 4.5, there shall be no evidence of electrical or mechanical damage. 3.3.9.1 Failure criteria for leadless pack

25、ages. The criteria for acceptable solderability during evaluation of the terminations are: a. The total surface area of the dipped part of the termination is at least 95 percent covered by a continuous new solder coating. b. That pinholes, voids, porosity, nonwetting, or dewetting are not concentrat

26、ed in one area and do not exceed 5 percent of the total metallized termination area. c. That there shall be no solder bridging between any termination area and any other termination area not connected to it by design. In the event that the solder dipping causes bridging, the test shall not be consid

27、ered a failure provided that a local application of heat (i.e., gas, soldering iron, or redipping) results in solder pullback and no wetting of the dielectric area is indicated by microscope examination at a magnification of between 10x and 20x. That area of the surface to be tested as specified in

28、4.5c shall include the total metallized area of both the castellations and the terminal pads. In case of a dispute, the percentage of coverage with pinholes or voids shall be determined by actual measurement of these areas, as compared to the total area. 3.4 Environmental characteristic. The environ

29、mental characteristics shall be in accordance with MIL-PRF-914 characteristic R, V, H, or C. 3.5 Marking. Marking shall be in accordance with MIL-STD-1285, except the PIN shall be as specified in 1.2, with the manufacturers CAGE number or trade mark and date code. Provided by IHSNot for ResaleNo rep

30、roduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 87018 REV H PAGE 6 3.6 Recycled, recovered, or environmentally preferable materials. Recycled, recovered, or environmentally preferable materials should b

31、e used to the maximum extent possible provided that the material meets or exceeds the operational and maintenance requirements, and promotes economically advantageous life cycle costs. * 3.7 Manufacturer eligibility. To be eligible for listing as a approved source of supply, a manufacturer shall be

32、listed on the MIL-PRF-914 Qualified Products List for at least one part, or perform the group A and group B inspections specified herein on a sample agreed upon by the manufacturer and DLA Land and Maritime-VAT. * 3.7.1 Certificate of compliance. A certificate of compliance shall be required from ma

33、nufacturers requesting to be listed as an approved source of supply. 3.8 Workmanship. Resistors shall be uniform in quality and free from any defects that will affect life, serviceability, or appearance. 4. VERIFICATION 4.1 Product assurance program. The product assurance program specified in MIL-PR

34、F-914 and maintained in accordance with MIL-STD-790 is not applicable to this document. 4.2 Qualification inspection. Qualification inspection is not applicable to this document. 4.2.1 Failure rate qualification. The failure rate qualification specified in MIL-PRF-914 is not applicable to this docum

35、ent. 4.3 Conformance inspections. 4.3.1 Inspection of product for delivery. Inspection of product for delivery shall consist of group A and group B inspections of MIL-PRF-914. 4.3.2 Certification. The acquiring activity, at its discretion, may accept a certificate of compliance with group B requirem

36、ents in lieu of performing group B tests (see 6.2d). 4.4 Inspection of packaging. Inspection of packaging shall be in accordance with MIL-PRF-914. 4.5 Solderability. Solderability shall be in accordance with method 208 of MIL-STD-202. The following details shall apply: a. Application of flux. Flux t

37、ype shall be in accordance with MIL-PRF-914. Terminations shall be immersed in the flux, which is at room ambient temperature, to the minimum depth necessary to cover the surface to be tested. The terminations shall be completely immersed by individually dipping each edge with the Y1 axis 30 degrees

38、 to 45 degrees from vertical. The terminations to be tested shall be immersed in the flux for a period of 5 seconds to 10 seconds. b. Solder dip. The dross and burned flux shall be skimmed from the surface of the molten solder. (NOTE: May not require separate operation in wave or flow pot). The molt

39、en solder shall be maintained at a uniform temperature of 245C 5C. The surface of the molten solder shall be skimmed again prior to immersing the terminations in the solder. The part shall be attached to a dipping device and the flux covered terminations immersed one side at a time, in molten solder

40、 to the depth, and in the same manner specified in 4.5a. The immersed and emersion rates shall be 1.000 0.250 inch per second and dwell time in the solder bath shall be 5.0 seconds 0.5 second. After the dipping process, the part shall be allowed to cool in air. Residue flux shall be removed from the

41、 terminations by rinsing in a suitable solvent. If necessary, a soft cloth or cotton swab moistened with clean 91 percent isopropyl alcohol shall be used to remove all remaining flux. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CEN

42、TER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 87018 REV H PAGE 7 c. Examinations of terminations. After each dip coated termination has been thoroughly cleaned of flux, the castellation and pad shall be examined using a magnification between 10x and 20x. 4.6 Visual and mechanical

43、examination. Resistors shall be examined to verify that the materials, design, construction, physical dimensions, marking, and workmanship are in accordance with the applicable requirements of MIL-PRF-914. 5. PACKAGING * 5.1 Packaging. For acquisition purposes, the packaging requirements shall be as

44、 specified in the contract or order (see 6.2). When actual packaging of materiel is to be performed by DoD personnel or in-house contractor personnel, these personnel need to contact the responsible packaging activity to ascertain packaging requirements. Packaging requirements are maintained by the

45、Inventory Control Points packaging activity within the Military Department or Defense Agency, or within the military services system commands. Packaging data retrieval is available from the managing Military Departments or Defense Agencys automated packaging files, CD-ROM products, or by contacting

46、the responsible packaging activity. 6. NOTES (This section contains information of a general or explanatory nature that may be helpful, but is not mandatory.) 6.1 Intended use. Resistor networks are used in surface mounting applications where space is a major concern. 6.2 Ordering data. The contract

47、 or purchase order should specify the following: a. Complete PIN (see 1.2). b. Requirements for delivery: One copy of the conformance inspection data or certification of compliance that parts have passed conformance inspection with each shipment of parts by the manufacturer. c. Requirements for pack

48、aging and packing. (i.e. ESD sensitive packaging). d. Whether the manufacturer performs the group B tests or provides certification of compliance with group B requirements (see 4.3.2). 6.3 Electrostatic charge. Under several combinations of conditions, these resistors can be electrically damaged, by

49、 electrostatic charges, and drift from specified value. Users should consider this phenomena when ordering or shipping resistors. Direct shipment to the Government is controlled by MIL-DTL-39032 which specifies a preventive packaging procedure. 6.4 PIN supersession. PINs in the original 87018 and revision A have been superseded by a new PIN in revision B that includes a characteristic