DLA DSCC-DWG-10014-2012 PRINTED WIRING BOARD RIGID MULTILAYERED TYPE 4 WITH BLIND AND BURIED VIAS.pdf

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1、 REVISIONS LTR DESCRIPTION DATE APPROVED Requirements of DLA Land and Maritime drawing 10012 are applicable. Prepared in accordance with ASME Y14.100 Detail drawing REV PAGE REV STATUS OF PAGES REV PAGE 1 2 3 4 5 6 7 8 9 10 11 12 PMIC N/A PREPARED BY DLA LAND AND MARITIME COLUMBUS, OHIO 432183990 Da

2、vid J. Corbett Original date of drawing 15 April 2012 CHECKED BY TITLE Joshua Civiello PRINTED WIRING BOARD, RIGID, MULTILAYERED, TYPE 4 WITH BLIND AND BURIED VIAS APPROVED BY Thomas M. Hess SIZE CAGE CODE DWG. NO. 10014 A 67268 REV PAGE 1 OF 12 AMSC N/A 5998E064 Provided by IHSNot for ResaleNo repr

3、oduction or networking permitted without license from IHS-,-,-DLA LAND AND MARITIME COLUMBUS, OH 432183990 SIZE CAGE CODE DWG NO. A 67268 10014 REV PAGE 2 1. SCOPE 1.1 Scope. This drawing outlines the requirements for a type 4 rigid multilayer printed wiring board to be used for qualifying to DoD pr

4、inted board specifications. 1.2 Part or Identifying number (PIN). The complete PIN for the printed wring board shall be in accordance with 6.2. 2.1 Government documents. 2.1.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a part of this documen

5、t to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract (see 6.2). SPECIFICATIONS DEPARTMENT OF DEFENSE MILPRF55110 Printed Wiring Board, Rigid, General Specification for. STANDARDS DEPARTMENT OF DEFENSE MILSTD130 Id

6、entification Marking of U.S. Military Property. (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or https:/assist.daps.dla.mil/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 191115094.) 2.1.2 Other Governm

7、ent documents, drawings, and publications. The following other Government documents, drawings, and publications form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DRAWINGS 10012 Print

8、ed Wiring Board, Rigid, Multilayered, General Drawing. (Copies of drawing 10012 is available online http:/www.landandmaritime.dla.mil/programs/milspec/ListDwgs or can be obtained from DLA Land and Maritime (ATTN: code VAC), P.O. Box 3990, Columbus, OH 432183990.) PUBLICATIONS DLA Land and Maritime F

9、orm 19W PWBQPL Application/Authorization to Test. (Copies of this publication are available online at http:/www.landandmaritime.dla.mil/Offices/Sourcing_and_Qualification or can be obtained from DLA Land and Maritime (ATTN: code VQE), P.O. Box 3990, Columbus, OH 432183990.) Provided by IHSNot for Re

10、saleNo reproduction or networking permitted without license from IHS-,-,-DLA LAND AND MARITIME COLUMBUS, OH 432183990 SIZE CAGE CODE DWG NO. A 67268 10014 REV PAGE 3 2.2 Non-Government publications. The following documents form a part of this document to the extent specified herein. Unless otherwise

11、 specified, the issues of these documents are those cited in the solicitation or contract. IPC ASSOCIATION CONNECTING ELECTRONICS INDUSTRIES (IPC) IPC2220 Design Standards Series. IPC2221 Printed Board Design, Generic Standard on. IPC2222 Sectional Design Standard for Rigid Organic Printed Boards. I

12、PC2511 Generic Requirements for Implementation of Product Manufacturing Description Data and Transfer XML Schema Methodology. IPC2615 Printed Board Dimensions and Tolerances. IPCT50 Terms and Definitions for Interconnecting and Packaging Electronic Circuits. IPCD325 Documentation Requirements for Pr

13、inted Boards, Assemblies, and Support Drawings. IPCD350 Printed Board Description in Digital Form. IPCOI645 Standard for Visual Optical Inspection Aids. IPC9252 Guidelines and Requirements for Electrical Testing of Unpopulated Printed Boards. JSTD003 Solderability Tests for Printed Boards. JSTD609 M

14、arking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Pb-Free and Other Attributes. (Copies of these documents are available online at http:/www.ipc.org or should be addressed to IPC Association Connecting Electronics Industries, 3000 Lakeside Drive, Suite 309 S, Bannockburn, IL 6

15、00151249.) (Non-Government standards and other publications are normally available from the organizations which prepare or which distribute the documents. These documents also may be available in or through libraries or other informational services.) 2.3 Order of precedence. Unless otherwise noted h

16、erein or in the contract, in the event of a conflict between the text of this document and the references cited herein, the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREM

17、ENTS 3.1 General. The individual item requirements for the printed wiring board shall be as specified herein and the associated electronic files (see 6.3). The finished printed wiring boards shall meet the requirements of this detail drawing, DLA Land and Maritime drawing 10012, and MILPRF55110, typ

18、e 3 with blind and buried vias. 3.1.1 Dimensions and tolerances. The dimensions and tolerances shall be in accordance with IPC2615. Unless otherwise specified herein, all dimensions are in inches. Unless otherwise specified, tolerances are .01 inch (0.25 mm) for two place decimals, .005 inch (0.12 m

19、m) for three place decimals, and 2 degrees for angles. 3.1.2 Qualification inspection. Qualification inspection for the printed wiring board specified herein shall be required. 3.2 Definitions and terms. The definitions for all terms used herein shall be as specified in IPCT50, IPCD325, and those co

20、ntained herein. 3.3 Conflicting requirements. In the event of conflict between the requirements of this drawing and other requirements of the qualifying approved DLA Land and Maritime Form 19W, the precedence in which documents shall govern, in descending order, is as follows: a. The qualifying acti

21、vity approved DLA Land and Maritime Form 19W. b. This drawing. c. Specifications, standards, and other documents referenced in section 2. 3.4 Material. Materials shall be as defined on DLA Land and Maritime drawing 10012 and herein. Unspecified materials shall be selected by the printed board manufa

22、cturer and shall be specified on DLA Land and Maritime Form 19W. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DLA LAND AND MARITIME COLUMBUS, OH 432183990 SIZE CAGE CODE DWG NO. A 67268 10014 REV PAGE 4 3.4.1 Base material and prepegs. 3.4.1.1 Cop

23、per clad laminates. Copper clad base material used in the manufacturing of the printed wiring board shall have a minimum starting foil of 3/8 oz/ft (12 microns) or greater for internal layers. For external layers, any starting copper foil thickness is permissible. Copper film for semi-additive and f

24、ull additive copper plating is permitted provided the final conductor thickness is met. The copper clad base material used as the dielectric in the printed wiring boards shall be included in the PIN (see 6.2). 3.4.1.2 Prepregs. Unless otherwise specified, the prepreg used in the manufacturing of the

25、 printed wiring board shall be of the same resin type and reinforcement media as the copper clad laminates. 3.4.1.3 Material selection. The printed wiring board manufacturer shall select the base material and prepregs needed to create the board stack-up requirements of 3.5.1. Unless otherwise specif

26、ied on the qualifying activity approved DLA Land and Maritime Form 19W, the base materials shall be of the natural color system of primary resin. 3.4.2 Conductor surface finish. The conductor surface finish shall be in accordance with DLA Land and Maritime drawing 10012. The conductor surface finish

27、 used on the printed wiring board shall be included in the PIN (see 6.2). 3.4.3 Copper plating. Copper plating shall be in accordance with DLA Land and Maritime drawing 10012. 3.4.4 Metallic foils. Copper foil and resin coated foils, if used, shall be in accordance with DLA Land and Maritime drawing

28、 10012. 3.4.5 Marking ink. Marking ink shall be in accordance with DLA Land and Maritime drawing 10012. 3.4.6 Solder mask. Solder mask shall be in accordance with DLA Land and Maritime drawing 10012. 3.5 Design, construction, and physical dimensions. The design, construction, and physical dimensions

29、 shall be as specified herein and on figures 1, 2, and 3 herein. Unless otherwise specified, if individual design details are not specified on this detail drawing, then the baseline design parameters to be used for acceptability of finished printed wiring board requirements shall be the default desi

30、gn shall be performance class 3 of IPC2221. 3.5.1 Board construction (cross sectional view). A cross sectional view of the stack-up of the finished printed wiring board shall be as depicted on figure 1. 3.5.1.1 Dielectric separation between layers. Unless otherwise specified on the qualifying activi

31、ty approved DLA Land and Maritime Form 19W, the minimum dielectric thickness between layers shall be .0035 inch (0.089 mm). 3.5.1.2 Overall printed board thickness. Unless otherwise specified on the qualifying activity approved DLA Land and Maritime Form 19W, the finished printed wiring board thickn

32、ess, when measured across the conductor surfaces including plating, shall be .055 to .075 inch (1.4 to 1.9 mm). 3.5.2 Bow and twist. Unless otherwise specified on the qualifying activity approved DLA Land and Maritime Form 19W, the maximum allowable bow and twist of the finished printed wiring board

33、 shall be no greater than .005 inch/inch (0.127 mm/mm). 3.5.3 Conductor pattern. The conductor patterns shall be generated from the supplied master pattern database (see 6.3) and represents the finished printed wiring board requirements with zero process allowance added for etch. 3.5.3.1 Annular rin

34、g. The minimum finished printed wiring board annular ring shall be .001 inch (0.025 mm) for internal lands and .002 inch (0.051 mm) for external supported holes. 3.5.3.2 Conductor spacing. The minimum finished printed wiring board conductor spacing shall be .005 inch (0.127 mm) for external conducto

35、rs and .004 inch (0.102 mm) for internal conductors. 3.5.3.3 Conductor width. The finished printed wiring board conductors shall be within 20 percent of the positions specified by the master pattern database. 3.5.3.4 Surface mount lands. The finished printed wiring board surface mount lands shall be

36、 located within +.002 inch (0.051 mm) and .001 inch (0.025 mm) of the positions specified by the master pattern database. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DLA LAND AND MARITIME COLUMBUS, OH 432183990 SIZE CAGE CODE DWG NO. A 67268 1001

37、4 REV PAGE 5 Layer 1 Layer 2 Layer 3 Layer 4 Layer 5 Layer 6 Layer 7 Layer 8 Layer 9 Layer 10 NOTE: Layers 1 and 10 may be constructed using foil lamination (prepreg and metal foil) or cap laminate. Key: Base material = Plated copper = Copper foil = FIGURE 1. Cross sectional view (stack-up) without

38、soldermask. 3.5.4 Holes and vias. 3.5.4.1 Hole diameter and tolerance. The diameter and tolerances of all holes on the printed wiring board are listed in table I and their general location shown on figure 2. The hole diameters specified in table I shall be the diameter of the finished hole after all

39、 plating processes. 3.5.4.1.2 Hole location. Unless otherwise specified, the coordinates for un-dimensioned drill hole locations shall be determined from the supplied drill report database and the hole data chart. 3.5.4.2 Hole plating. All holes identified as plated in table I shall contain a minimu

40、m of .001 inch (0.025 mm) of electrolytic deposited copper plating. Unless otherwise prior approved by the qualifying activity, the total copper (plating and foil) on the surface of the printed wiring boards shall not exceed .003 inch (0.08 mm). The copper plating shall have the following characteri

41、stics: a purity of 99.5 percent minimum, the elongation shall be 12 percent minimum, and the tensile strength shall be 248 MPa (36,000 psi) minimum. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DLA LAND AND MARITIME COLUMBUS, OH 432183990 SIZE CAG

42、E CODE DWG NO. A 67268 10014 REV PAGE 6 TABLE I. Hole schedule data chart. Symbol Description Diameter inch (mm) Design diameter inch (mm) Quantity Tolerance (+/) Notes + Plated .002 to .006 (0.051 to 0.152) .004 (0.102) 384 .002 BZ Plated .010 to .016 (0.254 to 0.406) .013 (0.33) 1248 .003 B, BX, B

43、Y X Plated .020 to .028 (0.51 to 0.71) .024 (0.61) 66 .004 A Plated .028 to .036 (0.71 to 0.91) .032 (0.81) 56 .004 E, D Plated .036 to .044 (0.91 to 1.11) .040 (1.02) 64 .004 S Plated .018 to .022 (0.46 to 0.56) .020 (0.51) 12 .002 G Non-plated 78.7 (2.00) 78.7 (2.00) 24 .0005 T All 1854 3.5.5 Prof

44、ile (board outline). Figure 3 depicts the routing profile with test specimen identifiers. The minimum finished printed wiring board profile tolerance shall be in accordance with 3.1.1. 3.5.6 Solder mask. The solder mask shall be applied on the external layers over bare copper (SMOBC). The printed wi

45、ring board shall meet the contamination requirements of 3.6.4 prior to the application of solder mask. 3.5.6.1 Color. Unless otherwise specified on the qualifying activity approved DLA Land and Maritime Form 19W, the solder mask shall be either clear or light green in color. 3.5.6.2 Misregistration

46、and overlap. Solder mask overlap is permitted on circular pads only and shall not exceed .001 inch (0.025 mm). Solder mask overlap on rectangular SMT pads shall not be acceptable. 3.5.6.3 Tenting. Solder mask shall be used to tent the vias on test coupon “T“ up to a maximum hole diameter of .028 inc

47、h (0.71 mm). 3.5.6.4 Thickness. Solder mask thickness shall be measured. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DLA LAND AND MARITIME COLUMBUS, OH 432183990 SIZE CAGE CODE DWG NO. A 67268 10014 REV PAGE 7 FIGURE 2. Hole locations (viewed fro

48、m layer 1). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DLA LAND AND MARITIME COLUMBUS, OH 432183990 SIZE CAGE CODE DWG NO. A 67268 10014 REV PAGE 8 NOTES: 1. Conductor patterns are shown for reference only. 2. Red blocks between test coupons represent break-away tabs. FIGURE 3. Printed wiring board profile (viewed from layer 1). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DLA LAND AND MARITIME COLUMBUS, OH 432183990 SIZE C