DLA DSCC-DWG-03017 REV A-2007 RESISTOR THERMAL THERMISTOR DIE CHIP POSITIVE TEMPERATURE COEFFICIENT (PTC) style 0303《0303型正温度系数(PTC)芯片热敏电阻器》.pdf

《DLA DSCC-DWG-03017 REV A-2007 RESISTOR THERMAL THERMISTOR DIE CHIP POSITIVE TEMPERATURE COEFFICIENT (PTC) style 0303《0303型正温度系数(PTC)芯片热敏电阻器》.pdf》由会员分享，可在线阅读，更多相关《DLA DSCC-DWG-03017 REV A-2007 RESISTOR THERMAL THERMISTOR DIE CHIP POSITIVE TEMPERATURE COEFFICIENT (PTC) style 0303《0303型正温度系数(PTC)芯片热敏电阻器》.pdf（9页珍藏版）》请在麦多课文档分享上搜索。

1、 REVISIONS LT DESCRIPTION DATE APPROVED A Inactivated for new design. 12 MAR 07 M. RadeckiDSCC drawing 03017 is inactive for new design as of 12 March 2007. Use MIL-PRF-32192/1 for all new design and replacement purposes. Prepared in accordance with ASME Y14.100 Selected item drawing REV STATUS REV

2、A A A A A A A A A OF PAGES PAGES 1 2 3 4 5 6 7 8 9 PMIC N/A PREPARED BY Dennis L. Cross DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OH Original date of drawing 24 April 2003 CHECKED BY Andrew R. Ernst TITLE RESISTOR, THERMAL, THERMISTOR, DIE CHIP, POSITIVE TEMPERATURE COEFFICIENT (PTC) APPROVED BY And

3、rew R. Ernst STYLE 0303 SIZE A CODE IDENT. NO. 037Z3 DWG NO. 03017 REV A PAGE 1 OF 9 AMSC N/A 5905-E637Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 03017 REV A PAGE

4、 2 1. SCOPE 1.1 Scope. This drawing describes the requirements for a thermally sensitive die chip thermistor available in 1 percent, 2 percent, 5 percent, and 10 percent resistance tolerances. These thermistors exhibit positive temperature coefficient (PTC) characteristics and are primarily intended

5、 for incorporation into epoxy/wire bond applications. The size of these thermistors is value dependent (see figure 1). 1.2 Part or Identifying Number (PIN). The complete PIN is as follows: 03017 - 5102 J Drawing number Resistance value (see 3.3.1) Resistance tolerance (see 3.3.3) 2. APPLICABLE DOCUM

6、ENTS 2.1 Government documents. 2.1.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract

7、. DEPARTMENT OF DEFENSE SPECIFICATIONS MIL-PRF-32192 - Resistors, Chip, Thermal (Thermistor), General Specification for. MIL-PRF 55342 - Resistors, Chip, Fixed, Film, Non-Established Reliability, Established Reliability, and Space Level, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL

8、-STD-202 - Test Methods for Electronic and Electrical Component Parts. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.

9、) 2.2 Order of precedence. In the event of a conflict between the text of this document and the references cited herein, the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIRE

10、MENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-32192 and as specified herein. 3.2 Interface and physical dimensions. The interface and physical dimensions shall be as specified in MIL-PRF-32192 and herein (see figure 1). 3.3 Electrical characteristi

11、cs. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 03017 REV A PAGE 3 DIMENSION 0.010(0.254) 10-12 OHMS 15-1800 OHMS 2200-4700 OHMS 5600-8200 OHMS 10000 OHMS L 0.032(

12、0.812) 0.032(0.812) 0.038(0.965) 0.030(0.762) 0.022(0.558) W 0.032(0.812) 0.032(0.812) 0.038(0.965) 0.030(0.762) 0.022(0.558) T 0.028(0.711) 0.050(1.27) 0.072(1.828) 0.072(1.828) 0.072(1.828) NOTES: 1. Dimensions are in inches. 2. Millimeter equivalents are given for general information. 3. Die dime

13、nsions by available R25 resistance values. FIGURE 1. Resistor, thermally sensitive, PTC die. 3.3.1 Resistance. The resistance values available are as specified in table I at 25C. The resistance values are identified by a four digit number (see 1.2). The first three digits represent significant figur

14、es, and the last digit specifies the number of zeros to follow. The standard resistance values for every decade shall be as specified in table II. 3.3.2 Resistance at temperatures other than 25C. Resistance at temperatures other than 25C shall be as specified in table I. TABLE I. Resistance multipli

15、ers for temperatures other than 25C. TEMPERATURE C 10-27 OHMS 33-68 OHMS 82-330 OHMS 390-2700 OHMS 3300-10000 OHMS -55 0.552 0.519 0.493 0.481 0.493 -15 0.739 0.728 0.716 0.709 0.717 0 0.830 0.822 0.813 0.810 0.816 25 1.000 1.000 1.000 1.000 1.000 50 1.190 1.201 1.208 1.211 1.205 75 1.408 1.411 1.44

16、1 1.446 1.430 100 1.651 1.669 1.706 1.709 1.660 125 1.908 1.940 1.993 1.983 1.862 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 03017 REV A PAGE 4 TABLE II. Standard

17、 resistance values for the 10 to 100 decade by tolerance. Tolerance (+%) Tolerance (+%) Tolerance (+%) 1 (F) 2 (G) 5 (J) 10 (K) 1 (F) 2 (G) 5 (J) 10 (K) 1 (F) 2 (G) 5 (J) 10 (K) 1.00 2.15 4.64 1.02 1.00 2.21 2.15 4.75 4.64 1.05 2.26 4.87 1.07 1.05 1.0 2.32 2.26 2.2 4.99 4.87 4.7 1.10 2.37 5.11 1.13

18、1.10 2.43 2.37 5.23 5.11 1.15 2.49 5.36 1.18 1.15 1.1 1.0 2.55 2.49 2.4 2.2 5.49 5.36 5.1 4.7 1.21 2.61 5.62 1.24 1.21 2.67 2.61 5.76 5.62 1.27 2.74 5.90 1.30 1.27 1.2 2.80 2.74 2.7 6.04 5.90 5.6 1.33 2.87 6.19 1.37 1.33 2.94 2.87 6.34 6.19 1.40 3.01 6.49 1.43 1.40 1.3 1.2 3.09 3.01 3.0 2.7 6.65 6.4

19、9 6.2 5.6 1.47 3.16 6.81 1.50 1.47 3.24 3.16 6.98 6.81 1.54 3.32 7.15 1.58 1.54 1.5 3.40 3.32 3.3 7.32 7.15 6.8 1.62 3.48 7.50 1.65 1.62 3.57 3.48 7.68 7.50 1.69 3.65 7.87 1.74 1.69 1.6 1.5 3.74 3.65 3.6 3.3 8.06 7.87 7.5 6.8 1.78 3.83 8.25 1.82 1.78 3.92 3.83 8.45 8.25 1.87 4.02 8.66 1.91 1.87 1.8

20、4.12 4.02 3.9 8.87 8.66 8.2 1.96 4.22 9.09 2.00 1.96 4.32 4.22 9.31 9.09 2.05 4.42 9.53 2.10 2.05 2.0 1.8 4.53 4.42 4.3 3.9 9.76 9.53 9.1 8.2 3.3.3 Resistance tolerance. The thermistor specified herein is available in resistance tolerances F (1 percent), G (2 percent), J (5 percent), and K (10 perce

21、nt) plus the resistance deviation at specified temperature as specified in table III. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 03017 REV A PAGE 5 TABLE III. Res

22、istance tolerances at temperatures other than 25 C. TEMPERATURE C F PERCENT() G PERCENT() J PERCENT() K PERCENT() -55 15 17 20 25 -15 9 10 13 18 0 3 4 7 12 25 1 2 5 10 50 3 4 7 12 75 5 6 9 14 100 7 9 12 17 125 10 12 15 20 3.3.4 Resistance ratio. The resistance ratio (Rt/R25) is the resistance at an

23、arbitrary temperature (T) divided by the resistance of the device at a reference temperature of 25C (see 4.3.2). 3.3.5 Power rating. The thermistor shall be capable of dissipating a maximum power of 0.125 watts at 25C derated to zero power at 125 C (See figure 2). FIGURE 2. Derating curve for temper

24、atures above 25 C. 3.3.6 Time constant. The thermal time constant shall be 30 seconds maximum in still air. 3.3.7 Dissipation constant. The dissipation constant shall be 2.5 mW/C minimum in still air. 3.3.8 Operating temperature range. The operating temperature range shall be -65C to +150C. 3.4 Term

25、inals. Units shall be constructed with 99% pure gold end terminations. 3.4.1 Pure tin. The use of pure tin, as an underplate or final finish is prohibited both internally and externally. Tin content of resistor components and solder shall not exceed 97 percent, by mass. Tin shall be alloyed with a m

26、inimum of 3 percent lead, by mass (see 6.3). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 03017 REV A PAGE 6 3.5 Zero power resistance. When thermistors are tested

27、as specified in 4.3.1 each thermistor shall have a zero power resistance value within the specified tolerance of the nominal resistance value specified. 3.6 Thermal shock. When thermistors are tested as specified in 4.3.3 they shall show no evidence of mechanical damage. The change in zero power res

28、istance shall not exceed 2 percent. 3.7 Short time overload. When thermistors are tested as specified in 4.3.4, they shall not arc, burn, char, or open circuit. The change in zero power resistance shall not exceed 2 percent. 3.8 Low temperature storage. When thermistors are tested as specified in 4.

29、3.5, there shall be no evidence of mechanical damage and the change in zero power resistance shall not exceed 2 percent. 3.9 High temperature storage. When thermistors are tested as specified in 4.3.6, the change in zero power resistance shall not exceed 2 percent. 3.10 Wire bonding integrity. When

30、thermistors are tested as specified in 4.3.7, there shall be no evidence of mechanical damage. 3.11 Marking. Marking of individual chip thermistors is not required but is permitted; however, each unit pack shall be marked with the PIN assigned herein (see 1.2), the manufacturers identification code

31、(CAGE), the date code, and the lot code. At the option of the manufacturer, the resistor may be marked (i.e., laser, color dot, etc.). The marking shall remain legible after all tests. 3.12 Recycled, recovered, or environmentally preferable materials. Recycled, recovered, or environmentally preferab

32、le materials should be used to the maximum extent possible provided that the material meets or exceeds the operational and maintenance requirements, and promotes economically advantageous life cycle costs. 3.13 Certificate of compliance. A certificate of compliance shall be required from manufacture

33、rs requesting to be a suggested source of supply. 3.14 Workmanship. Thermistors shall be uniform in quality and free from any defects that will affect life, serviceability, or appearance. 4. VERIFICATION 4.1 Qualification inspection. Qualification inspection is not applicable to this document. 4.2 C

34、onformance inspection. 4.2.1 Inspection of product for delivery. Inspection of product for delivery shall consist of group A and group B inspections as specified herein and MIL-PRF-32192. 4.2.1 Certification. The procuring activity may accept a certificate of compliance in lieu of group B inspection

35、. 4.2.2 Group A inspection. Group A inspection shall consist of the inspections specified in table IV, and shall be made on the set of sample units, in the order shown. Thermistors subjected to subgroup II shall not be supplied against purchase order. 4.2.2.1 Subgroup 1. Subgroup 1 tests shall be pe

36、rformed as specified in MIL-PRF-32192. 4.2.2.2 Subgroup 2 (thermal shock). Ten sample units of any zero power resistance shall be subjected to the test of subgroup 2. One defective unit will be allowed. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,

37、-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 03017 REV A PAGE 7 TABLE IV. Group A Inspection. Inspection Requirement paragraph Method paragraph Subgroup 1 Visual and mechanical examination Interface and physical dimensions Workmanship Zero power resistance Resi

38、stance ratio characteristic 3.2 3.14 3.5 3.3.4 4.3.1 4.3.2 Subgroup 2 Thermal shock 3.6 4.3.3 4.2.3 Group B inspection. Group B inspection shall consist of the test specified in table V in the order shown. They shall be performed on sample units that have passed the group A tests. 4.2.3.1 Subgroup 1

39、. Subgroup 1 tests shall be performed as specified in MIL-PRF-32192. 4.2.3.2 Subgroup 2 (wire bonding integrity). Ten sample units of any zero power resistance shall be subjected to the test of subgroup 2. One defective unit will be allowed. 4.2.3.3 Certification. The acquiring activity, at its disc

40、retion, may accept a certificate of compliance with group B requirements in lieu of performing group B tests (see 6.2d). TABLE V. Group B inspection. Inspection Requirement paragraph Method paragraph Subgroup 1 Short time overload Low temperature storage High temperature storage 3.7 3.8 3.9 4.3.4 4.

41、3.5 4.3.6 Subgroup 2 Wire bonding integrity 3.10 4.3.7 4.3 Methods of inspections. 4.3.1 Zero power resistance (see 3.5). Thermistors shall be tested as specified in MIL-PRF-32192. The following details and exceptions shall apply: a. Measurements: All resistance measurements shall be made in a contr

42、olled uniform medium capable of maintaining an accuracy of 0.05C. b. Mounting: Mounting shall be in accordance with the specified mounting for wire bondable devices of MIL-PRF-55342. 4.3.2 Resistance ratio characteristic (see 3.3.4). Compute the resistance ratio using the zero power resistance measu

43、rement at 25C and 125C (see 4.3.1). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 03017 REV A PAGE 8 4.3.3 Thermal shock (see 3.6). When resistors are tested in acco

44、rdance with method 107 of MIL-STD-202, there shall be no evidence of mechanical damage. The following details and exceptions shall apply: a. Test condition A. b. Upper temperature of 125C. 4.3.4 Short time overload (see 3.7). Thermistors shall be tested as specified in MIL-PRF-32192. The following d

45、etails and exceptions shall apply: Mounting: See 4.3.1b. 4.3.5 Low temperature storage (see 3.8). Thermistors shall be tested as specified in MIL-PRF-32192. The following details and exceptions shall apply: Mounting: Mounting in accordance with 4.3.1b is optional. 4.3.6 High temperature storage (see

46、 3.9). Thermistors shall be tested as specified in MIL-PRF-32192. The following details and exceptions shall apply: Mounting: Mounting in accordance with 4.3.1b is optional. 4.3.7 Wire bonding integrity (see 3.10). Thermistors shall be tested as specified in MIL-PRF-55342 for mounting integrity of w

47、ire bondable devices. 5. PACKAGING 5.1 Packaging. For acquisition purposes, the packaging requirements shall be as specified in the contract or order (see 6.2). When packaging of materiel is to be performed by DoD or in-house contractor personnel, these personnel need to contact the responsible pack

48、aging activity to ascertain requisite requirements. Packaging requirements are maintained by the Inventory Control Points packaging activities within the Military Service or Defense Agency, or within the Military Services System Command. Packaging data retrieval is available from the managing Milita

49、ry Departments or Defense Agencys automated packaging files, CD-ROM products, or by contacting the responsible packaging activity. 6. NOTES (This section contains information of a general or explanatory nature that may be helpful, but is not mandatory.) 6.1 Intended use. Resistors conforming to this drawing