DLA DESC-DWG-95011 REV F-2013 RESISTOR FIXED FILM CHIP (MELF) 1 8 WATT STYLE 1206.pdf
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1、 REVISIONS LTR DESCRIPTION DATE APPROVED A Update and validation of drawing. Editorial changes throughout. 3 APR 00 K. Cottongim B Add voltage rating. Change derating curve. Add group B certification. Editorial changes throughout. 5 FEB 01 K. Cottongim C Changes IAW NOR 5905-R008-02 paragraph 3.3.1,
2、 delete “table II” and substitute “3.3.1.1”. 16 JUL 02 K. Cottongim D Add requirements for termination finish (see 3.4); DoD policy corrections throughout. 12 DEC 02 K. Cottongim E Add pure tin, manufacturer eligibility, and high power pulse paragraphs. Editorial changes throughout. 14 JAN 10 M. Rad
3、ecki F Add new plant address. Editorial changes throughout. 17 JAN 13 M. Radecki CURRENT DESIGN ACTIVITY CAGE CODE 037Z3 HAS CHANGED NAMES TO: DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 Prepared in accordance with ASME Y14.100 Source control drawing REV STATUS OF PAGES REV F F F F F F F PAGES 1
4、 2 3 4 5 6 7 PMIC N/A PREPARED BY Andrew R. Ernst DESIGN ACTIVITY: DEFENSE ELECTRONIC SUPPLY CENTER DAYTON, OH 45444-5000 Original date of drawing 9 January 1995 CHECKED BY Andrew R. Ernst TITLE RESISTOR, FIXED, FILM, CHIP (MELF), 1/8 WATT, STYLE 1206 APPROVED BY Bud Boulter SIZE A CODE IDENT. NO. 1
5、4933 DWG NO. 95011 REV F PAGE 1 OF 7 AMSC N/A 5905-2013-E05 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE ELECTRONIC SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 95011 REV F PAGE 2 1. SCOPE 1.1 Scope. This drawing describe
6、s the requirements for a fixed, film, chip resistor (MELF), style 1206. 1.2 Part or Identifying Number (PIN). The complete PIN is as follows: 95011 - * * | | | Drawing Number Resistance value (see 3.3.1) Tolerance (see 3.3.2)2. APPLICABLE DOCUMENTS 2.1 Government documents. 2.2.1 Specifications, sta
7、ndards, and handbooks. The following specifications, standards, and handbooks form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATIONS MIL-PRF-55342 - R
8、esistors, Chip, Fixed, Film, Nonestablished Reliability, Established Reliability, Space Level, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-690 - Failure Rate Sampling Plans and Procedures. MIL-STD-790 - Standard Practice for Established Reliability and High Reliability Qualifi
9、ed Products List (QPL) Systems for Electrical, Electronic, and Fiber Optic Parts Specifications. MIL-STD-1285 - Marking of Electrical and Electronic Parts. (Copies of these documents are available online at https:/assist.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbi
10、ns Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. Unless otherwise noted herein or in the event of a conflict between the text of this document and the references cited herein (except for related specification sheets), the text of this document takes precedence. Nothing
11、in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-55342 and as specified herein. 3.2 Interface and physical dimensions. The i
12、nterface and physical dimensions shall be as specified herein (see figure 1). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE ELECTRONIC SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 95011 REV F PAGE 3 3.3 Electrical characte
13、ristics. 3.3.1 Resistance. The nominal resistance expressed in ohms is identified by four digits; the first three digits represent significant figures and the last digit specifies the number of zeros to follow. When the value of resistance is less than 100 ohms, or fractional values of an ohm are re
14、quired, the letter “R“ shall be substituted for one of the significant figures. The resistance value designations are shown in table I. Minimum and maximum resistance values shall be as specified in 3.3.1.1. Resistance values not listed in the “10 to 100” decade table of MIL-PRF-55342 for the approp
15、riate resistance tolerance shall be considered nonconforming to the specification. Inches mm Inches mm Inches mm .005 0.13 .010 0.25 .057 1.48 .006 0.15 .020 0.51 .126 3.20 NOTES: 1. Dimensions are in millimeters. 2. Inch equivalents are given for general information only. FIGURE 1. Chip resistor. 3
16、.3.1.1 Resistance range. Minimum and maximum resistance shall be from 0.1 to 1 megohms. See table I. TABLE I. Resistance value designations. Designation Resistance ohms R100 to R976 inclusive 0.10 to 0.976 inclusive 1R00 to 9R76 inclusive 1.00 to 9.76 inclusive 10R0 to 97R6 inclusive 10.0 to 97.6 in
17、clusive 1000 to 9760 inclusive 100 to 976 inclusive 1001 to 9761 inclusive 1,000 to 9,760 inclusive 1002 to 9762 inclusive 10,000 to 97,600 inclusive 1003 to 9763 inclusive 100,000 to 976,000 inclusive 1004 to 9764 inclusive 1,000,000 to 9,760,000 inclusiveProvided by IHSNot for ResaleNo reproductio
18、n or networking permitted without license from IHS-,-,-DEFENSE ELECTRONIC SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 95011 REV F PAGE 4 3.3.2 Resistance tolerance. The resistance tolerances shall be in accordance with table II TABLE II. Resistance tolerance. Symbol Resistance tol
19、erance percent F 1 G 2 J 5 3.3.3 Rated power. The rated power shall be 1/8 watt from -55OC to +70OC. For operation at temperatures higher than +70OC, derate in accordance with figure 2. 3.3.4 Temperature range. The temperature range shall be -55OC to +150OC. 3.3.5 Resistance temperature characterist
20、ic. The resistance temperature characteristic shall be 100 ppm/OC. 3.3.6 Voltage rating. The working voltage shall not exceed 200 volts. 3.4 Termination material. Termination material shall be in accordance with MIL-PRF-55342, code letter B. FIGURE 2. Derating curve for high ambient temperatures. 3.
21、5 Pure tin. The use of pure tin, as an underplate or final finish is prohibited both internally and externally. Tin content of resistor components and solder shall not exceed 97 percent, by mass. Tin shall be alloyed with a minimum of 3 percent lead, by mass (see 6.4). 3.6 Marking. Marking of the in
22、dividual chip resistors is not required; however, each unit package shall be marked in accordance with MIL-STD-1285 and include the PIN as specified herein (see 1.2), the manufacturers name or Commercial and Government Entity (CAGE) code, date, and lot codes. 3.7 Recycled, recovered, or environmenta
23、lly preferable materials. Recycled, recovered, or environmentally preferable materials should be used to the maximum extent possible provided that the material meets or exceeds the operational and maintenance requirements, and promotes economically advantageous life cycle costs. Percent of rated pow
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