DLA DESC-DWG-93030 REV E-2013 RESISTORS CHIP FIXED BULK METAL FOIL ULTRA PRECISION STYLE 2018.pdf

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1、 REVISIONS LTR DESCRIPTION DATE APPROVED A Changes in accordance with NOR 5905-R003-94 26 Apr 94 David E. Moore B Add new source of supply. Update to present DoD policy requirements. Extensive editorial changes throughout. 14 Jul 98 M. Radecki C Add Group B certification. Editorial changes throughou

2、t. 9 May 01 K. Cottongim D Update vendor. Update to present DoD policy requirements. Extensive editorial changes throughout. 25 Jan 06 M. Radecki E Update vendor data. Editorial changes throughout. 17 May 13 M. Radecki Prepared in accordance with ASME Y14.100 REV STATUS OF PAGES REV E E E E E E E E

3、PAGES 1 2 3 4 5 6 7 8 PMIC N/A PREPARED BY Andrew R. Ernst DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OH Original date of drawing 24 February 1993 CHECKED BY Andrew R. Ernst TITLE RESISTORS, CHIP, FIXED, BULK METAL FOIL, ULTRA PRECISION, STYLE 2018 APPROVED BY David E. Moore SIZE A CODE IDENT. NO. 14

4、933 DWG NO. 93030 REV E PAGE 1 OF 8 AMSC N/A 5905-2012-E13 CURRENT DESIGN ACTIVITY CAGE CODE 037Z3 DEFENSE LOGISTICS AGENCY DLA LAND AND MARITIME COLUMBUS, OHIO 43216-5000 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE ELECTRONICS SUPPLY CEN

5、TER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 93030 REV E PAGE 2 1. SCOPE 1.1 Scope. This drawing describes the requirements for a bulk metal foil, ultra precision, chip resistor, style 2018. 1.2 Part or Identifying Number (PIN). The complete PIN is as follows: 93030 - * * Drawing number Resi

6、stance value (see 3.3.1) Tolerance (see 3.3.3) 2. APPLICABLE DOCUMENTS 2.1 Government documents. 2.1.1 Specifications and standards. The following specifications, standards and handbooks form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these docu

7、ments are those listed in the cited in the solicitation or contract (see 6.2). DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-55342 - Resistors, Chip, Fixed, Film, Nonestablished Reliability, Established Reliability, Space Level, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-690 -

8、Failure Rate Sampling Plans and Procedures. MIL-STD-790 - Standard Practice for Established Reliability and High Reliability Qualified Products List (QPL) Systems for Electrical, Electronic, and Fiber Optic Parts Specifications. (Copies of these documents are available online at http:/quicksearch.dl

9、a.mil or from the DLA Document Services, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094). 2.2 Order of precedence. Unless otherwise noted herein or in the contract, in the event of a conflict between the text of this document and the references cited herein (except for related specific

10、ation sheets), the text of this document takes precedence unless otherwise noted. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be as specified

11、 herein. 3.2 Interface and physical dimensions. The interface and physical dimensions shall be as specified in MIL-PRF-55342 and herein (see figure 1). Passivation is not applicable, however, a protective coating over the element shall be provided. Provided by IHSNot for ResaleNo reproduction or net

12、working permitted without license from IHS-,-,-DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 93030 REV E PAGE 3 L W T D 5.18 0.13 4.67 0.13 0.64 Max 0.46 0.13 NOTES: 1. Dimensions are in millimeters. Inch equivalents are given for general information only. 2. The

13、 pictorial view of the styles above is given as representative of the envelope of the item. Slight deviations from the outline shown, which are contained within the envelope and do not alter the functional aspects of the device, are acceptable. FIGURE 1. Chip resistor. 3.3 Electrical characteristics

14、. 3.3.1 Resistance. The nominal resistance expressed in ohms is identified by six characters, consisting of five digits and a letter. The letter is used simultaneously as a decimal point and as a multiplier. For resistance values: a. Greater than or equal to 1 ohm but less than 1,000 ohms, the lette

15、r “R“ is used to represent a decimal point. b. Greater than or equal to 1,000 ohms but less than 1 megohm, the letter “K“ is used to denote that a decimal point is located three places to the right. All digits preceding and following the letters (R or K) of the group represent significant figures. T

16、he resistance value designations are shown in table I. Minimum and maximum resistance values shall be as specified herein. The standard values for every decade shall follow the sequence specified in the 10 to 100 decade table of MIL-PRF-55342 for resistance tolerances D and F. The resistance values

17、for tolerances Q, T, A, B, and C may be any value within the limits specified herein, but it is preferred that values be chosen from the “B“ column of the 10 to 100 decade table of MIL-PRF-55342. The resistance values for tolerance D shall follow the standard values listed under tolerance B of MIL-P

18、RF-55342. mm Inches 0.13 .005 0.46 .018 0.64 .025 4.67 .184 5.18 .204 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 93030 REV E PAGE 4 TABLE I. Designation of resist

19、ance values. Designation Resistance ohms 10R000 to 99R900 inclusive 10.0 to 99.9 inclusive 100R00 to 999R00 inclusive 100 to 999 inclusive 1K0000 to 9K9900 inclusive 1,000 to 9,990 inclusive 10K000 to 99K900 inclusive 10,000 to 99,900 inclusive 100K00 to 150K00 inclusive 100,000 to 150,000 inclusive

20、 3.3.2 Resistance range. The resistance range shall be from 5 ohms to 150 kilohms (see 3.3.6). 3.3.3 Resistance tolerance. Resistors are available in resistance tolerances as specified in table II and paragraph 3.3.3.1. TABLE II. Resistance tolerance. Symbol Resistance tolerance percent Symbol Resis

21、tance tolerance percent T 0.01 C 0.25 Q 0.02 D 0.5 A 0.05 F 1.0 B 0.1 3.3.3.1 Resistance tolerance versus resistance value. The tightest resistance tolerance available is value specific as indicated by the following. Resistance (ohms) Tolerance (percent) Resistance (ohms) Tolerance (percent) 5 to 10

22、 0.5 50 to 100 0.05 10 to 25 0.25 100 to 250 0.02 25 to 50 0.1 250 to 150,000 0.01 3.3.4 Power rating. The power rating for chip resistors shall be .300 watt at +70OC derated to +125OC at zero power (see figure 2). FIGURE 2. Derating curve. Percentofrated power125 100 75 50 25 0 -65 -50 -25 0 25 50

23、75 100 125 150 175 Ambient Temperature (OC) -55OC 70OC Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 93030 REV E PAGE 5 3.3.5 Voltage rating. The maximum continuous

24、working voltage shall not exceed 200 volts. 3.3.6 Resistance temperature coefficient. When resistors are tested as specified in MIL-PRF-55342 the resistance temperature coefficient shall not exceed the values specified below: Resistance Temperature Coefficient (RTC) (ppm/OC) Resistance range 20 5 oh

25、ms to 50 ohms 10 50 ohms to 100 ohms 5 100 ohms to 150 kohms 3.3.7 Termination. The termination material shall be in accordance with MIL-PRF-55342, code letter B. 3.3.7.1 Pure tin. The use of pure tin, as an underplate or final finish, is prohibited both internally and externally. Tin content of res

26、istor components and solder shall not exceed 97 percent, by mass. Tin shall be alloyed with a minimum of 3 percent lead, by mass (see 6.3). 3.4 Thermal shock. When resistors are tested as specified in MIL-PRF-55342 for thermal shock the change in resistance shall not exceed 0.05 percent +0.01 ohm. 3

27、.5 Low temperature operation. When resistors are tested as specified in MIL-PRF-55342 for low temperature operation the change in resistance shall not exceed 0.05 percent +0.01 ohm. 3.6 Short time overload. When resistors are tested as specified in MIL-PRF-55342 for short time overload the change in

28、 resistance shall not exceed 0.05 percent +0.01 ohm. 3.7 High temperature exposure. When resistors are tested as specified in MIL-PRF-55342 for high temperature exposure the change in resistance shall not exceed 0.05 percent +0.01 ohm. 3.8 Resistance to bonding exposure. When resistors are tested as

29、 specified in MIL-PRF-55342 for resistance to bonding exposure the change in resistance shall not exceed 0.05 percent +0.01 ohm. 3.9 Moisture resistance. When resistors are tested as specified in MIL-PRF-55342 for moisture resistance the change in resistance shall not exceed 0.1 percent +0.01 ohm. 3

30、.10 Power conditioning. When resistors are tested as specified in MIL-PRF-55342 for life the change in resistance shall not exceed 0.2 percent +0.01 ohm. 3.11 Resistance temperature characteristic. When resistors are tested as specified in MIL-PRF-55342 the RTC shall not exceed the values specified

31、(see 3.3.6). 3.12 Marking. Marking is not required on this resistor; however, each waffle pack and each unit package shall be marked with the PIN assigned herein (see 1.2), the manufacturers identification code, the date code, and the lot code. At the option of the manufacturer, the resistor may be

32、marked (i.e., laser, color dot, etc.). The marking shall remain legible after all tests. 3.13 Manufacturer eligibility. To be eligible for listing as a approved source of supply, a manufacturer shall be listed on the MIL-PRF-55342 Qualified Products List for at least one part, or perform the group A

33、 and group B inspections specified herein on a sample agreed upon by the manufacturer and DLA Land and Maritime-VAT. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 93

34、030 REV E PAGE 6 3.13.1 Certificate of compliance. A certificate of compliance shall be required from manufacturers requesting to be listed as approved sources of supply. 3.14 Recycled, recovered, or environmentally preferable materials. Recycled, recovered, or environmentally preferable materials s

35、hould be used to the maximum extent possible provided that the material meets or exceeds the operational and maintenance requirements and promotes economically advantageous life cycle costs. 3.15 Workmanship. Resistors shall be processed in such a manner as to be uniform in quality and be free from

36、defects that will affect life, serviceability, or appearance. 4. VERIFICATION 4.1 Qualification inspection. Qualification inspection is not applicable to this document. 4.2 Reliability assurance program. The product assurance program specified in MIL-PRF-55342 and maintained in accordance with MIL-S

37、TD-790 is not applicable to this document. 4.3 Product level qualification. The product level qualification specified in MIL-PRF-55342 and MIL-STD-690 is not applicable to this document. 4.4 Conformance inspection. 4.4.1 Inspection of product for delivery. Inspection of product for delivery shall co

38、nsist of group A inspection (ER level only) and group B inspection of MIL-PRF-55342. 4.4.1.1 Group A inspection. Group A inspection (ER level) shall be in accordance with MIL-PRF-55342. PPM testing, subgroup 1, subgroup 3 and verification as specified in MIL-PRF-55342 are not applicable to this docu

39、ment. 4.4.1.2 Group B inspection. Group B inspection shall be in accordance with MIL-PRF-55342. 4.4.1.2.1 Certification. The acquiring activity, at its discretion, may accept a certificate of compliance with group B requirements in lieu of performing group B tests (see 6.2d). 5. PACKAGING 5.1 Packag

40、ing. For acquisition purposes, the packaging requirements shall be as specified in the contract or order (see 6.2). When packaging of materiel is to be performed by DoD or in-house contractor personnel, these personnel need to contact the responsible packaging activity to ascertain requisite packagi

41、ng requirements. Packaging requirements are maintained by the Inventory Control Points packaging activity within the Military Department or Defense Agency, or within the Military Departments Services System Command. Packaging data retrieval is available from the managing Military Departments or Defe

42、nse Agencys automated packaging files, CD-ROM products, or by contacting the responsible packaging activity. 6. NOTES (This section contains information of a general or explanatory nature that may be helpful, but is not mandatory.) 6.1 Intended use. Chip resistors are intended to be used in thick or

43、 thin film circuits where microcircuity is intended, also, for use in surface mounting application. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 93030 REV E PAGE 7

44、6.2 Ordering data. The contract or purchase order should specify the following: a. Complete PIN (see 1.2). b. Requirements for delivery: One copy of the conformance inspection data or a certificate of compliance that parts have passed conformance inspection with each shipment of parts by the manufac

45、turer. c. Packaging requirements. d. Whether the manufacturer performs the group B tests or provides certification of compliance with group B requirements. (see 4.4.1.2.1) 6.3 Tin whisker growth. The use of alloys with tin content greater than 97 percent, by mass, may exhibit tin whisker growth prob

46、lems after manufacture. Tin whiskers may occur anytime from a day to years after manufacture and can develop under typical operating conditions, on products that use such materials. Conformal coatings applied over top of a whisker-prone surface will not prevent the formation of tin whiskers. Alloys

47、of 3 percent lead, by mass, have shown to inhibit the growth of tin whiskers. For additional information on this matter, refer to ASTM-B545 (Standard Specification for Electrodeposited Coatings of Tin). 6.4 Tolerance caution. Soldering temperature used during installation may cause resistance to shi

48、ft up to 0.05 percent. 6.5 Pulse applications. Designers are CAUTIONED on using the above resistors in high power pulse applications. Since they have not been qualified nor tested for such applications, damage and premature failure are possible. These resistors only see a one-time pulse (Short-time

49、overload) as part of the group B inspection of MIL-PRF-55342. 6.6 Electrostatic charge. Under several combinations of conditions, these resistors can be electrically damaged, by electrostatic charges, and drift from specified value. Users should consider this phenomena when ordering or shipping resistors. Direct sh