DLA DESC-DWG-91019 REV J-2012 CAPACITORS FIXED CERAMIC CHIP 56 礔 THROUGH 1 礔.pdf
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1、 REVISIONS LTR DESCRIPTION DATE APPROVED A Added suggested source of supply. Added 1 F at 25 V dc, .065 T maximum. Editorial changes throughout. 16 May 94 D. Moore B Page 4 Revised inspection of product for delivery requirements. 23 May 96 Andrew R. Ernst C Page 2 - Added termination finish options.
2、 Page 3 - Added footnote for dimensional tolerance change for solder coated parts. Page 4 - Added Voltage Temperature Limit requirements. Changed insulation resistance requirements. Revised marking and workmanship paragraphs. Added environmental and mechanical requirements paragraph. Table I; Change
3、d -05 T max dimension. Page 5 - Incorporated inspection of product for delivery requirements into drawing from MIL-PRF-55681. Page 6 - Added note regarding tin plated finish. Page 7 - Revised sources of supply list. Editorial changes throughout. 2 June 99 Kenneth A. Bernier D Added suggested source
4、of supply that was added by letter dated January 15, 1999. 11 August 99 Kendall A. Cottongim E Added suggested source of supply. 16 November 00 Kendall A. Cottongim F Added suggested source of supply. 5 February 02 Kendall A. Cottongim G Page 7 - Corrected vendor E part numbers 7 August 02 Kendall A
5、. Cottongim H 5 year review. Editorial changes throughout. 22 January 08 Michael A. Radecki J Added eligibility requirement. Updated vendor C. Removed termination finish “Y”. 3 July 2012 Michael A. Radecki Prepared in accordance with ASME Y14.100 Source control drawing REV STATUS OF PAGES REV J J J
6、J J J J PAGES 1 2 3 4 5 6 7 PMIC N/A PREPARED BY ROBERT GRILLOT DEFENSE ELECTRONIC SUPPLY CENTER DAYTON, OH Original date of drawing 91-09-11 CHECKED BY EDWARD H. BACK TITLE CAPACITORS, FIXED, CERAMIC, CHIP, .56 F THROUGH 1 F APPROVED BY DAVID E. MOORE SIZE A CODE IDENT. NO. 14933 DWG NO. 91019 REV
7、J PAGE 1 OF 7 AMSC N/A 5910-2012-E09CURRENT DESIGN ACTIVITY CAGE CODE 037Z3 HAS CHANGED NAMES TO: DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO SIZE A CO
8、DE IDENT NO. 14933 DWG NO. 91019 REV J PAGE 2 1. SCOPE 1.1 Scope. This drawing and MIL-PRF-55681 describe the complete requirements for ceramic chip capacitors. 1.2 Part or Identifying Number (PIN). The complete PIN shall be as follows: 91019 -XX - Drawing Dash number Termination finish Number (see
9、table I) (if required (see 3.1.1) 2. APPLICABLE DOCUMENTS 2.1 General. The documents listed in this section are specified in sections 3 and 4 of this specification. This section does not include documents cited in other sections of this specification or recommended for additional information or as e
10、xamples. While every effort has been made to ensure the completeness of this list, document users are cautioned that they must meet all specified requirements of documents cited in sections 3 and 4 of this specification, whether or not they are listed. 2.2 Government documents. 2.2.1 Specifications,
11、 standards, and handbooks. The following specifications, standards, and handbooks form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATIONS MIL-PRF-123 -
12、 Capacitors, Fixed, Ceramic Dielectric, (Temperature Stable and General Purpose), High Reliability, General Specification for. MIL-PRF-55681 - Capacitor, Chip, Multiple Layer, Fixed, Ceramic Dielectric, Established Reliability and Non-Established Reliability, General Specification for. DEPARTMENT OF
13、 DEFENSE STANDARDS MIL-STD-202 - Test Methods Standard Electronics and Electrical Component Parts. MIL-STD-1285 - Marking of Electrical and Electronic Parts. (Copies of these documents are available online at https:/assist.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Rob
14、bins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.3 Order of precedence. Unless otherwise noted herein or in the contract, in the event of a conflict between the text of this document and the references cited herein, the text of this document takes precedence. Nothing in this document, howev
15、er, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Interface and physical dimensions. The interface and physical dimensions shall be as specified in MIL-PRF-55681 and herein (see figure 1). 3.1.1 Termination finish. The termination finis
16、h shall be solder coated over a base metallization and barrier metal (as specified in MIL-PRF-55681, “U” termination finish). When requested by the acquiring activity, an optional termination finish shall be identified by a single letter following the dash number as follows: Z: Base metallization -
17、barrier metal - tinned (tin/lead alloy, with a minimum of 4 percent lead): as specified in MIL-PRF-55681. Note: Termination finish Y (tin, 100 percent) has been removed from this specification (see 3.1.1.1). Termination finishes U and Z are substitutable for termination finish Y. Provided by IHSNot
18、for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 91019 REV J PAGE 3 Dimensions (See note 3) L +.025 -.010 W +.010 -.020 Y Min .225 .210 .010 Notes: 1. Dimensions are in inches. 2. Metric
19、equivalents are given for general information only. 3. For solder coated parts an additional +.025 to the length and width tolerance is allowed. An additional +.020 tolerance is allowed on the thickness (see table I). FIGURE 1. Case dimensions and configuration. Inches mm .010 0.25 .020 0.51 .025 0.
20、64 .210 5.33 .225 5.72 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 91019 REV J PAGE 4 3.1.1.1 Pure tin. The use of pure tin, as an underplate or final finish is pr
21、ohibited both internally and externally. Tin content of resistor components and solder shall not exceed 97 percent, by mass. Tin shall be alloyed with a minimum of 3 percent lead, by mass (see 6.2). 3.1.2 Operating temperature range. The operating temperature range shall be -55C to +125C. 3.2 Electr
22、ical characteristics. 3.2.1 Rated voltage. The rated voltage shall be in accordance with table I. 3.2.2 Dielectric type. The dielectric type shall be ceramic. 3.2.3 Temperature coefficient and voltage temperature limits (VTL). The temperature coefficient shall be 0 15 percent (-55C to +125C) and sha
23、ll meet the VTL requirements of characteristic BR of MIL-PRF-55681. 3.2.4 Operating frequency. Operating frequency shall be up to 50 GHz. 3.2.5 Capacitance. See table I. Measured in accordance with method 305 of MIL-STD-202, 1 kHz at 1.0 V rms 0.2 V rms at +25C. 3.2.6 Dissipation factor (+25C). 2.5
24、percent maximum (measured under the same conditions as capacitance). 3.2.7 Insulation resistance. Measured in accordance with method 302 of MIL-STD-202 at rated voltage. At +25C: 100,000 megohms or 1,000 megohm-microfarads, whichever is less. At +125C: 10,000 megohms or 100 megohm-microfarads, which
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