BS EN 60749-3-2002 Semiconductor devices - Mechanical and climatic test methods - External visual examination《半导体器件 机械和气候试验方法 目视检验》.pdf

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1、BRITISH STANDARD BS EN 60749-3:2002 Incorporating Corrigendum No. 1 Semiconductor devices Mechanical and climatic test methods Part 3: External visual examination The European Standard EN 60749-3:2002 has the status of a British Standard ICS 31.080.01 BS EN 60749-3:2002 This British Standard, having

2、 been prepared under the direction of the Electrotechnical Sector Policy and Strategy Committee, was published under the authority of the Standards Policy and Strategy Committee on 27 August 2002 BSI 17 September 2002 ISBN 0 580 40295 9 National foreword This British Standard is the official English

3、 language version of EN 60749-3:2002. It is identical with IEC 60749-3:2002. It partially supersedes BS EN 60749:1999 The UK participation in its preparation was entrusted to Technical Committee EPL/47, Semiconductors, which has the responsibility to: A list of organizations represented on this comm

4、ittee can be obtained on request to its secretary. Cross-references The British Standards which implement international or European publications referred to in this document may be found in the BSI Catalogue under the section entitled “International Standards Correspondence Index”, or by using the “

5、Search” facility of the BSI Electronic Catalogue or of British Standards Online. This publication does not purport to include all the necessary provisions of a contract. Users of British Standards are responsible for their correct application. Compliance with a British Standard does not of itself co

6、nfer immunity from legal obligations. aid enquirers to understand the text; present to the responsible international/European committee any enquiries on the interpretation, or proposals for change, and keep the UK interests informed; monitor related international and European developments and promul

7、gate them in the UK. Summary of pages This document comprises a front cover, an inside front cover, the EN title page, pages 2 to 4, an inside back cover and a back cover. The BSI copyright date displayed in this document indicates when the document was last issued. Amendments issued since publicati

8、on Amd. No. Date Comments 14110 Corrigendum No. 1 17 September 2002 Addition of supersession details to national forewordEUROPEAN STANDARD EN 60749-3 NORME EUROPENNE EUROPISCHE NORM August 2002 CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotech

9、nique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stassart 35, B - 1050 Brussels 2002 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 60749-3:2002 E ICS 31.080.01 Partly supersedes EN 60749:1999 +

10、A1:2000 + A2:2001 English version Semiconductor devices - Mechanical and climatic test methods Part 3: External visual examination (IEC 60749-3:2002) Dispositifs semiconducteurs - Mthodes dessais mcaniques et climatiques Partie 3: Examen visuel externe (CEI 60749-3:2002) Halbleiterbauelemente - Mech

11、anische und klimatische Prfverfahren Teil 3: uere Sichtprfung (IEC 60749-3:2002) This European Standard was approved by CENELEC on 2002-07-02. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of

12、a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A ver

13、sion in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic, De

14、nmark, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Luxembourg, Malta, Netherlands, Norway, Portugal, Slovakia, Spain, Sweden, Switzerland and United Kingdom.Foreword The text of document 47/1596/FDIS, future edition 1 of IEC 60749-3, prepared by IEC TC 47, Semiconductor devic

15、es, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 60749-3 on 2002-07-02. This mechanical and climatic test method, as it relates to external visual examination, is a complete rewrite of the test contained in clause 5, chapter 1 of EN 60749:1999. The following dates

16、 were fixed: latest date by which the EN has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2003-04-01 latest date by which the national standards conflicting with the EN have to be withdrawn (dow) 2005-07-01 _ Endorsement notice The text

17、 of the International Standard IEC 60749-3:2002 was approved by CENELEC as a European Standard without any modification. _ Page2 EN607493:2002SEMICONDUCTOR DEVICES MECHANICAL AND CLIMATIC TEST METHODS Part 3: External visual examination 1 Scope The purpose of this part of IEC 60749 is to verify that

18、 the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document. External visual inspection is a non-destructive test and applicable for all package types. The test is useful for qualification, process monitor, or l

19、ot acceptance, or both. 2 Test apparatus Apparatus used in this test shall be capable of demonstrating device conformance to the applicable requirements, which may include optical equipment capable of magnification between 3 and 10 and a relatively large and accessible field of view such as an illum

20、inated ring magnifier. 3 Procedure The device shall be examined in accordance with the requirements of the relevant specification and the criteria listed in clause 4. Where adherence of foreign material is in question, devices may be subjected to a clean filtered air stream (suction or expulsion) of

21、 27 ms 1maximum, and reinspected. 4 Failure criteria Devices shall be considered a failure if they exhibit any of the following: 4.1 Device design, terminal identification, markings (content, placement, and legibility), materials, construction, and workmanship, are not in accordance with the applica

22、ble procurement document. 4.2 Visible evidence of corrosion, contamination or breakage (grossly bent or broken terminals, cracked seals except for glass meniscus), defective (peeling, flaking, or blistering) or damaged plating or exposed base metal. (Discoloration of the finish shall not be cause fo

23、r failure unless there is evidence of flaking, pitting or corrosion.) 4.3 Terminals that are not intact and aligned in their normal location, free of sharp or unspecified terminal bends, and (for ribbon terminals) free of twist outside the normal terminal plane. 4.4 Terminals that are not free of fo

24、reign material such as paint or other adherent deposits. 4.5 Evidence of any non-conformance with the detail drawing or applicable procurement document, absence of any required feature, or evidence of damage, corrosion or contamination that will interfere with the normal application of the device. P

25、age3 EN607493:20024.6 Defects or damage resulting from manufacturing, handling, testing, or the following: a) Cracked or broken packages. Surface scratches shall not be cause for failure, except where they violate other criteria stated herein for marking, finish, etc. b) Any chip-out dimension that

26、exceeds 1,5 mm in any direction on the surface and has a depth that exceeds 25 % of the thickness of the affected package element (i.e. cover, base or wall). c) Any chip-out that exposes either sealing glass (not previously exposed prior to the chip- out) or any terminal frame material that is not i

27、ntended to be exposed by design. 5 Summary The following details shall be specified in the relevant specification: a) Requirements for markings and the terminal identification (see 4.1). b) Detailed requirements for materials, design, construction, and workmanship (see 4.1). c) Sample size. _ Page4

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