BS EN 60097-1993 Specification for grid systems for printed circuits《印制电路用网格系统规范》.pdf

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1、BRITISH STANDARD BS EN 60097:1993 IEC97:1991 (Incorporates corrigendum January1993) Specification for Grid systems for printed circuits The European Standard EN60097:1993 has the status of a British Standard UDC 621.3.049.75BSEN60097:1993 This British Standard, having been prepared under the directi

2、onof the Electronic Components Standards Policy Committee, was published underthe authority of the Standards Board and comesintoeffect on 15 April1993 BSI11-1999 The following BSI references relate to the work on this standard: Committee reference ECL/19 Special announcement in BSI News March1993 IS

3、BN 0 580 22100 8 Cooperating organizations The European Committee for Electrotechnical Standardization (CENELEC), under whose supervision this European Standard was prepared, comprises the national committees of the following countries: Austria Italy Belgium Luxembourg Denmark Netherlands Finland No

4、rway France Portugal Germany Spain Greece Sweden Iceland Switzerland Ireland United Kingdom Amendments issued since publication Amd. No. Date CommentsBSEN60097:1993 BSI 11-1999 i Contents Page Cooperating organizations Inside front cover National foreword ii Foreword 2 Text of EN 60097 3 National an

5、nex NA (informative) Committees responsible Inside back cover National annex NB (informative) Cross-references Inside back coverBSEN60097:1993 ii BSI 11-1999 National foreword This British Standard has been prepared under the direction of the Electronic Components Standards Policy Committee and is t

6、he English language version of EN60097:1993 Grid systems for printed circuits, published by the European Committee for Electrotechnical Standardization (CENELEC), incorporating its corrigendum, January1993. It is identical with IEC97:1991, published by the International Electrotechnical Commission (

7、IEC). This British Standard supersedes BS5830:1979, which is identical to IEC97:1970, and which is withdrawn. A British Standard does not purport to include all the necessary provisions of a contract. Users of British Standards are responsible for their correct application. Compliance with a British

8、 Standard does not of itself confer immunity from legal obligations. Summary of pages This document comprises a front cover, an inside front cover, pagesi andii, theEN title page, pages2 to6, an inside back cover and a back cover. This standard has been updated (see copyright date) and may have had

9、amendments incorporated. This will be indicated in the amendment table on the inside front cover.EUROPEAN STANDARD NORME EUROPENNE EUROPISCHE NORM EN60097 January1993 UDC 621.3.049.75 Supersedes HD203S1:1977 IncorporatescorrigendumJanuary1993 Descriptors: Printed circuits, grid systems, compatibilit

10、y, positioning connections English version Grid systems for printed circuits (IEC97:1991) Systmes de grille pour circuits imprims (CEI97:1991) Rastersysteme fr gedruckte Schaltungen (IEC97:1991) This European Standard was approved by CENELEC on1992-12-09. CENELEC members are bound to comply with the

11、 CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or

12、 to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the offici

13、al versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Denmark, Finland, France, Germany, Greece, Iceland, Ireland, Italy, Luxembourg, Netherlands, Norway, Portugal, Spain, Sweden, Switzerland and United Kingdom. CENELEC European Committee for Electrotechnical

14、 Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stassart 35, B-1050 Brussels 1993 Copyright reserved to CENELEC members Ref. No. EN60097:1993EEN60097:1993 BSI 11-1999 2 Foreword The CENELEC questionnaire pr

15、ocedure, performed for finding out whether or not the International Standard IEC97:1991 could be accepted without textual changes, has shown that no common modifications were necessary for the acceptance as European Standard. The reference document was submitted to the CENELEC members for formal vot

16、e and was approved by CENELEC as EN60097 on9December1992. This European Standard replaces HD203 S1:1977. The following dates were fixed: Annexes designated “normative” are part of the body of the standard. In this standard, Annex ZA is normative. Contents Page Foreword 2 1 Scope 3 2 Normative refere

17、nces 3 3 Terminology 3 4 Use of grid systems for printed boards 3 5 Preferred grid system 3 6 Alternative grid system 3 Annex A (informative) Recommended practicesfor grid application 4 Annex ZA (normative) Other internationalpublications quoted in this standardwith the references of the relevantEur

18、opean publications 5 Table A.1 4 Table A.2 4 latest date of publication of an identical national standard (dop) 1993-12-01 latest date of withdrawal of conflicting national standards (dow) 1993-12-01EN60097:1993 BSI 11-1999 3 1 Scope This International Standard relates to grid systems for printed ci

19、rcuits to ensure compatibility between the printed circuits and parts to be mounted on them at the intersections of the grid. 2 Normative references The following standards contain provisions which, through reference in this text, constitute provisions of this International Standard. At the time of

20、publication, the editions indicated were valid. All standards are subject to revision, and parties to agreements based on this International Standard are encouraged to investigate the possibility of applying the most recent editions of the standards indicated below. Members of IEC and ISO maintain r

21、egisters of currently valid International Standards. IEC194:1988, Terms and definitions for printed circuits. IEC321:1970, Guidance for the design and use of components intended for mounting on boards with printed wiring and printed circuits. 3 Terminology 3.1 grid an orthogonal network of two sets

22、of parallel equidistant lines for positioning connections on a printed board (seeIEC194) 3.2 For definitions of other terms, seeIEC194. 4 Use of grid systems for printed boards By definition, the connections of the components to be mounted on a printed board are positioned at the intersections of th

23、e grid lines. The centre distances of these connections will be integer multiples of the grid spacings, for example: n 0,05mm, n 0,5mm (millimetre-based grid), or n 0,635mm, n 2,54mm (inch-based grid) where n is an integral number1,2,3,. For other features of printed boards, for example land pattern

24、s for test purposes or surface mounted devices, the same principle shall be used. For information regarding component terminations, seeIEC321. NOTEIt is recommended that persons who are responsible for the dimensional standardization of components should, whenever possible, avoid using metric dimens

25、ions close to dimensions based on inch measurements. When this is impossible, the metric component should be marked with the letter M for identification. SeeAnnex A. 5 Preferred grid system 5.1 For positioning connections on a printed board, a grid with a nominal spacing in the two directions of0,5m

26、m shall be used. 5.2 Where a grid with a nominal spacing of0,5mm is not adequate, a grid with a nominal spacing in the two directions of0,05mm shall be used. This grid shall not be further subdivided. 6 Alternative grid system It is recognized that the previous editions of this standard contained (b

27、ut were not limited to) an inch-based grid. Where it is necessary to continue to use this grid (for example, to maintain compatibility with existing printed boards and components), the following shall apply (3.1.1 and3.1.2 of IEC97, third edition,1970). 6.1 For positioning connections on a printed b

28、oard, a grid with nominal spacings in the two directions of2,54mm shall be used. 6.2 Where a grid with smaller spacings is necessary,0,635mm shall be used. This secondary grid shall not be further subdivided. NOTEThe following millimetre-inch equivalents apply: 2,54mm=0,1inch; 0,635mm=0,025inch.EN60

29、097:1993 4 BSI 11-1999 Annex A (informative) Recommended practices for grid application The following information is provided to assist component manufacturers and printed board designers in determining the use of the preferred grid system concepts. A.1 Component design As indicated in the note to c

30、lause4, a possibility exists of a close overlap between the metric-based grid and the inch-based grid. As an example, for many years, components have been designed with terminations on2,54mm spacings in accordance with the inch-based grid. It is possible for a component manufacturer to design a comp

31、onent whose terminations are spaced on2,50mm under the preferred grid system. Although the initial reaction of a component manufacturer might be to attempt to make a new part to fit closely to the old inch-based grid system, component manufacturers are encouraged to avoid this practice. Tolerances o

32、n components and printed boards would soon have non-matching terminations and holes or land patterns due to tolerance run-out. A preferred method of component replacement would be to significantly modify the termination spacing. Thus, a component originally having terminations on2,54mm centres would

33、 find that its future replacement would be a component with terminations on2,00mm centres, thus avoiding visual confusion between the inch-based and metric components. As stated in the note to clause4, if this is not possible, appropriate markings should be placed on the components to identify them

34、as being designed for the metric preferred grid system. A.2 Modular equivalence of the grid Many users may find that they need to develop a special modular grid that is an equivalent of the preferred grid. This is an acceptable practice, provided that the special modular grid is consistently equival

35、ent to the preferred grid system. Shown hereinafter are two examples of how a users modular grid would be implemented for each of the two preferred grid spacings of0,5mm and0,05mm. Example1: A user wishes to use the standard grid of0,5mm; however, he has a test instrument that is made up of modular

36、grid intervals of1,00mm. Table A.1 shows the equivalencies. Table A.1 Example2: A user wishes to use the preferred metric grid of0,05mm. Table A.2 shows how the users modular grid of0,25mm may be converted to the preferred grid equivalents. Table A.2 These examples permit flexibility in future desig

37、ns for both component and printed board manufacturers and also allow the use of existing equipment that has grid lock-in capability consistent with the new grid standard. User grid units Numerical value mm Standardized grid units according to this standard 1 2 3 4 5, etc. 1,00 2,00 3,00 4,00 5,00, e

38、tc. 2 4 6 8 10, etc. User grid units Numerical value mm Standardized grid units according to this standard 1 2 3 4 5, etc. 0,25 0,50 0,75 1,00 1,25, etc. 5 10 15 20 25, etc.EN60097:1993 BSI 11-1999 5 Annex ZA (normative) Other international publications quoted in this standard with the references of

39、 the relevant European publications When the international publication has been modified by CENELEC common modifications, indicated by (mod), the relevant EN/HD applies. IEC Publication Date Title EN/HD Date 194 1988 Terms and definitions for printed circuits HD142S3 1991 321 1970 Guidance for the d

40、esign and use of components intended for mounting on boards with printed wiring and printed circuits 6 blankBSEN60097:1993 BSI 11-1999 National annex NA (informative) Committees responsible The United Kingdom participation in the preparation of this European Standard was entrusted by the Electronic

41、Components Standards Policy Committee (ECL/-) to Technical Committee ECL/19, upon which the following bodies were represented: British Telecommunications plc EEA (the Association of Electronics, Telecommunications and Business Equipment Industries) Electrical and Electronic Insulation Association (B

42、EAMA Ltd.) Electronic Components Industry Federation GAMBICA (BEAMA Ltd.) Institute of Metal Finishing Ministry of Defence National Supervising Inspectorate Printed Circuit Interconnection Federation Surface Mount and Related Technologies (Smart Group) Ltd. National annex NB (informative) Cross-refe

43、rences Publication referred to Corresponding British Standard IEC194:1988 BS4727 Glossary of electrotechnical, power, telecommunication, electronics, lighting and colour terms Part1 Terms common to power, telecommunications and electronics Group11:1991 Printed circuitsBS EN 60097:1993 IEC97:1991 BSI

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