ASTM E1161-2009 Standard Practice for Radiologic Examination of Semiconductors and Electronic Components《半导体和电子元件的放射性的标准实施规程》.pdf

《ASTM E1161-2009 Standard Practice for Radiologic Examination of Semiconductors and Electronic Components《半导体和电子元件的放射性的标准实施规程》.pdf》由会员分享，可在线阅读，更多相关《ASTM E1161-2009 Standard Practice for Radiologic Examination of Semiconductors and Electronic Components《半导体和电子元件的放射性的标准实施规程》.pdf（10页珍藏版）》请在麦多课文档分享上搜索。

1、Designation: E 1161 09Standard Practice forRadiologic Examination of Semiconductors and ElectronicComponents1This standard is issued under the fixed designation E 1161; the number immediately following the designation indicates the year oforiginal adoption or, in the case of revision, the year of la

2、st revision. A number in parentheses indicates the year of last reapproval. Asuperscript epsilon () indicates an editorial change since the last revision or reapproval.1. Scope1.1 This practice provides the minimum requirements fornondestructive radiologic examination of semiconductor de-vices, micr

3、oelectronic devices, electromagnetic devices, elec-tronic and electrical devices, and the materials used forconstruction of these items.1.2 This practice covers the radiologic examination of theseitems to detect possible defective conditions within the sealedcase, especially those resulting from sea

4、ling the lid to the case,and internal defects such as extraneous material (foreignobjects), improper interconnecting wires, voids in the dieattach material or in the glass (when sealing glass is used) orphysical damage.1.3 The values stated in inch-pound units are to be regardedas standard. No other

5、 units of measurement are included in thispractice.1.4 This standard does not purport to address all of thesafety concerns, if any, associated with its use. It is theresponsibility of the user of this standard to establish appro-priate safety and health practices and determine the applica-bility of

6、regulatory limitations prior to use.2. Referenced Documents2.1 ASTM Standards:2E94 Guide for Radiographic ExaminationE 431 Guide to Interpretation of Radiographs of Semicon-ductors and Related DevicesE 543 Specification for Agencies Performing Nondestruc-tive TestingE 801 Practice for Controlling Qu

7、ality of Radiological Ex-amination of Electronic DevicesE 666 Practice for Calculating Absorbed Dose FromGamma or X RadiationE 999 Guide for Controlling the Quality of Industrial Ra-diographic Film ProcessingE 1000 Guide for RadioscopyE 1079 Practice for Calibration of Transmission Densitom-etersE 1

8、254 Guide for Storage of Radiographs and UnexposedIndustrial Radiographic FilmsE 1255 Practice for RadioscopyE 1316 Terminology for Nondestructive ExaminationsE 1390 Specification for Illuminators Used for ViewingIndustrial RadiographsE 1411 Practice for Qualification of Radioscopic SystemsE 1453 Gu

9、ide for Storage of Media that Contains Analog orDigital Radioscopic DataE 1475 Guide for Data Fields for Computerized Transfer ofDigital Radiological Examination DataE 1742 Practice for Radiographic ExaminationE 1815 Test Method for Classification of Film Systems forIndustrial RadiographyE 1817 Prac

10、tice for Controlling Quality of RadiologicalExamination by Using Representative Quality Indicators(RQIs)E 2339 Practice for Digital Imaging and Communication inNondestructive Evaluation (DICONDE)E 2597 Practice for Manufacturing Characterization ofDigital Detector Arrays2.2 ANSI Standards:3ANSI/ESD

11、S20.20 ESD Association Standard for the De-velopment of an Electrostatic Discharge Control Programfor Protection of Electrical and Electronic Parts, Assem-blies and Equipment (Excluding Electrically InitiatedExplosive Devices)2.3 ASNT Standard:4ANSI/ASNT CP-189 Standard for Qualification and Certi-f

12、ication of Nondestructive Testing PersonnelSNT-TC-1A Personnel Qualification and Certification1This practice is under the jurisdiction of ASTM Committee E07 on Nonde-structive Testing and is the direct responsibility of Subcommittee E07.01 onRadiology (X and Gamma) Method.Current edition approved Ju

13、ne 1, 2009. Published July 2009. Originally approvedin 1987. Last previous edition approved in 2003 as E 1161 03.2For referenced ASTM standards, visit the ASTM website, www.astm.org, orcontact ASTM Customer Service at serviceastm.org. For Annual Book of ASTMStandards volume information, refer to the

14、 standards Document Summary page onthe ASTM website.3Available from American National Standards Institute (ANSI), 25 W. 43rd St.,4th Floor, New York, NY 10036, http:/www.ansi.org.4Available fromAmerican Society for Nondestructive Testing (ASNT), P.O. Box28518, 1711 Arlingate Ln., Columbus, OH 43228-

15、0518, http:/www.asnt.org.1Copyright ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959, United States.2.4 AIA Documents:5NAS-410 Certification and Qualification of NondestructiveTest Personnel2.5 Department of Defense (DOD) Documents:6MIL-PRF-28861 Performance S

16、pecificationGeneralSpecification for Filters, Capacitors, Radio Frequency/Electromagnetic Interference SuppressionMIL-STD-202 Test Method Standard Electronic and Elec-trical Component PartsMIL-STD-202, Method 209 Radiographic InspectionMIL-STD-750 Test Method Standard Test Methods forSemiconductor D

17、evicesMIL-STD-750, Method 2076 RadiographyMIL-STD-883 Test Method Standard MicrocircuitsMIL-STD-883, Method 2012 RadiographyMIL-STD-981 Design, Manufacturing and Quality Stan-dards for Custom Electromagnetic Devices for SpaceApplications2.6 Federal Standard:6FED-STD-595 Color (Requirements for Indiv

18、idual ColorChits)2.7 NCRP Documents:NCRP 116 Limitation of Exposure to Ionizing RadiationNCRP 144 Radiation Protection for Particle AcceleratorFacilities3. Terminology3.1 DefinitionsDefinitions relating to radiological exami-nation, which appear in Terminology E 1316, shall apply to theterms used in

19、 this practice.3.2 Abbreviations:3.2.1 controlling documentation The document or stan-dard that is specified by contractual agreement and lists suchitems as the examination requirements, number of views, andacceptance criteria. Controlling documentation may be in theform of a purchase order, enginee

20、ring drawing, MilitaryStandard, etc. or a combination thereof.3.2.2 device(s)For the purpose of this practice, the term“device” and “devices” shall be used to describe microcircuits,semiconductors, electromagnetic devices, electronic and elec-trical component parts. Microcircuits include such items

21、as,monolithic, multichip and hybrid microcircuits, microcircuitarrays, and the elements from which these circuits are made.Semiconductors include such items as diodes, transistors,voltage regulators, rectifiers, tunnel diodes and other relatedparts. Electromagnetic devices include such items as tran

22、s-formers, inductors and coils. Electronic and electrical compo-nents include such items as capacitors, resistors, switches andrelays. This is not an all inclusive list, therefore, the term“device” or “devices” will be used throughout this practice torefer to the items which are the subject of the r

23、adiologicalexamination process.3.2.3 micro-bubblesA film defect where tiny bubbles inthe films emulsion create white dots on the processed radio-graph. Micro-bubbles are unacceptable when they show up inthe area of interest of a device because they can be interpretedas extraneous matter (foreign mat

24、erial).3.2.4 parallax error effectFor the purpose of this practice,the term “parallax error effect” will refer to a double image onthe radiograph of the devices internal features such as wires orball bonds. This is caused by the device being too far from thecentral X-ray beam where the angle of the

25、X-rays creates adouble image on double emulsion film.3.2.5 pick-offAn automatic film processing artifact wheretiny spots of emulsion are “picked off” of the radiograph as itis moving through the dryer. Pick-off artifacts are unacceptablewhen they show up in the area of interest of a device becauseth

26、ey can be interpreted as extraneous matter (foreign material).3.2.6 pre-capPrior to capping or encapsulation.3.3 Abbreviations:3.3.1 AWGAmerican Wire Gauge3.3.2 CEOCognizant Engineering Organization. Thecompany, government agency, or other authority responsiblefor the design, or end use, of the devi

27、ce(s) for which radio-logical examination is required. This, in addition to designpersonnel, may include personnel from electrical engineering,material and process engineering, nondestructive testing (usu-ally the certified Radiographic Level 3), or quality groups, asappropriate.3.3.3 DDADigital Det

28、ector Array. DDAs are described inPractice E 2597.3.3.4 DPADestructive Physical Analysis3.3.5 ESDElectrostatic Discharge3.3.6 ESDSElectrostatic Discharge Sensitive3.3.7 FDDFocal spot to Detector Distance3.3.8 FFDFocal spot to Film Distance3.3.9 FODFocal spot to Object Distance (always mea-sured to t

29、he “source side” of the object)3.3.10 PINDParticle Impact Noise Detection3.3.11 RADRadiation Absorbed Dose, the dose causing100 ergs of energy to be absorbed by one gram of matter3.3.12 TLDThermoluminescence Dosimetry4. Significance and Use4.1 This practice establishes the basic minimum parametersan

30、d controls for the application of radiological examination ofelectronic devices. Factors such as device handling, equipment,ESDS, materials, personnel qualification, procedure and qual-ity requirements, reporting, records and radiation sensitivityare addressed. This practice is written so it can be

31、specified onthe engineering drawing, specification or contract. It is not adetailed how-to procedure and must be supplemented by adetailed examination technique/procedure (see 9.1).4.2 This practice does not set limits on radiation dose, butdoes list requirements to limit and document radiation dose

32、 todevices. When radiation dose limits are an issue, the requestorof radiological examinations must be cognizant of this issueand state any maximum radiation dose limitations that arerequired in the contractual agreement between the usingparties.5Available from Aerospace Industries Association of Am

33、erica, Inc. (AIA), 1000Wilson Blvd., Suite 1700,Arlington, VA22209-3928, http:/www.aia-aerospace.org.6Available from Standardization Documents Order Desk, DODSSP, Bldg. 4,Section D, 700 Robbins Ave., Philadelphia, PA 19111-5098, http:/www.dodssp.daps.mil.E11610925. Qualification5.1 Personnel Qualifi

34、cationIf specified in the contractualagreement, personnel performing examinations to this practiceshall be qualified in accordance with a nationally or interna-tionally recognized NDT personnel qualification practice orstandard such asANSI/ANST CP-189, SNT-TC-1A, NAS-410,or similar document and cert

35、ified by the employer or certifyingagency, as applicable. The practice or standard used and itsapplicable revision shall be identified in the contractual agree-ment between the using parties. When examining devices toDOD requirements (see 2.5), NAS-410 shall be the requiredstandard.5.2 Qualification

36、 of Nondestructive Testing (NDT)AgenciesWhen specified in the contractual agreement, Non-destructive Testing agencies shall be qualified and evaluated asdescribed in Practice E 543.5.2.1 SafetyThe NDT facility shall present no hazards tothe safety of personnel and property. NCRP 144, NCRP 116may be

37、used as guides to ensure that radiological proceduresare performed so that personnel shall not receive a radiationdose exceeding the maximum safe limits as permitted by city,state, or national codes.6. Equipment6.1 Radiation SourceOnly X-ray generating equipmentshall be used. Such factors as focal s

38、pot size, inherent filtration,accelerating voltage and tube current shall be considered whenchoosing the proper X-ray source. The X-ray source andexposure parameters shall not cause damage to the device(s)under examination. The suitability of these exposure param-eters shall be demonstrated by attai

39、nment of the requiredradiological quality level and compliance with all other re-quirements stipulated in this practice.6.1.1 Focal SpotThe focal spot size shall be such that theradiological quality level specified in 10.3 can be achieved.6.2 Non-Film SystemsRadioscopy systems designed spe-cifically

40、 for the examination of electronic devices are generallythe alternative to film based radiography. However, DDAbasedsystems may also be used.6.2.1 The suitability of any non-film radiological systemshall be demonstrated by attainment of the required radiologi-cal quality level and compliance with al

41、l other applicablerequirements stipulated in this practice.6.2.2 When specified in the controlling documentation,non-film radioscopy systems shall be operated in accordancewith Practice E 1255 and qualified in accordance with PracticeE 1411. Other types of non-film systems operaating proceduresand q

42、ualification procedures shall be agreed upon between theusing parties.6.2.3 X-ray systems shall be characterized for their radiationdose rate using a calibrated dosimeter. The dose rate shall beidentified at distances to be used during examination so safelimits can be established to ensure devices u

43、nder examinationare not subject to excessive levels of radiation. Dose ratecharacterization shall be performed with and without filters(see 6.13) to establish best practices between radiologicalquality levels and total dose during examination. All exposureinformation shall be tracked and recorded in

44、 the examinationrecord (see 11.1).6.3 Film ViewersViewers used for film interpretationsshall meet the following minimum requirements:6.3.1 The light source shall have sufficient intensity toenable viewing of film densities in the area of interest.6.3.2 Film viewers procured to or meeting the require

45、mentsof Guide E 1390 are acceptable for use.6.3.3 Low intensity film viewers such as fluorescent 14 by17-in. illuminators, shall be equipped with daylight fluorescentbulbs.6.3.4 All film viewers shall be tested for and posted with themaximum readable density in accordance with PracticeE 1742, Figure

46、 2 and subsection 6.27.4.6.3.5 Film viewers shall be kept clean and viewing surfacesshall be free of scratches or other defects that will interferewith proper film interpretation.6.4 Holding FixturesHolding fixtures shall be capable ofholding specimens in the required positions without interferingwi

47、th the accuracy or ease of image interpretation. Holdingfixtures shall not be made of materials that will createundesirable secondary radiation that will reduce image clarity.Holding fixtures shall be clean of debris that can interfere withimage interpretation by appearing on the radiograph or radio

48、-logical image and be confused with that of any defect. Holdingfixtures shall not cause damage to the devices under examina-tion and shall be compliant with any special handling require-ments including ESD precautions.6.5 Lead-Topped TablesWhen performing film radiogra-phy, a lead-topped table with

49、at least 0.062 in. of lead shall beused. The lead shall be smooth, and with out any gouges orscratches that will cause undesirable image artifacts. Leadvinyl or lead rubber may be used in lieu of lead. Tape or otherlow density materials used to cover the lead topped table shallnot be allowed unless directly related to ESD protection.6.6 Film HoldersFilm holders and cassettes shall be lighttight. They may be flexible vinyl, plastic, or other durablematerial. Vacuum cassettes are preferred in order to keep thedevice(s) as close to the film as possibl