ASTM C961-2006 Standard Test Method for Lap Shear Strength of Sealants《密封材料的搭接剪切强度的标准试验方法》.pdf
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1、Designation: C 961 06Standard Test Method forLap Shear Strength of Sealants1This standard is issued under the fixed designation C 961; the number immediately following the designation indicates the year oforiginal adoption or, in the case of revision, the year of last revision. A number in parenthes
2、es indicates the year of last reapproval. Asuperscript epsilon (e) indicates an editorial change since the last revision or reapproval.1. Scope1.1 This test method covers a laboratory procedure fordetermining the lap shear strength of sealants. It also providesinformation on the adhesive bond of the
3、 sealants to the testedsubstrates.1.2 The values stated in SI units are to be regarded as thestandard. The values given in parentheses are for informationonly.1.3 This standard does not purport to address all of thesafety concerns, if any, associated with its use. It is theresponsibility of the user
4、 of this standard to establish appro-priate safety and health practices and determine the applica-bility of regulatory limitations prior to use.1.4 The subcommittee with jurisdiction of this standard isnot aware of any similar or equivalent ISO standard.2. Referenced Documents2.1 ASTM Standards:C 71
5、7 Terminology of Building Seals and Sealants3. Terminology3.1 Definitions:3.1.1 The definitions of the following terms used in this testmethod are found in Terminology C 717, 4.1: adhesive failure,cohesive failure, sealant, and substrate.4. Summary of Test Method4.1 The sealant is placed between two
6、 glass substrates. Thesample is placed in a tensile tester and pulled at a constant rateto failure. The maximum shear force and mode of failure isnoted. Maximum shear stress is calculated and reported.5. Significance and Use5.1 Sealants are generally subjected to longitudinal andlateral shear stress
7、es in end use applications. This test methodmeasures the cohesive strength of sealants when subjected toshear stresses, and also provides information regarding theadhesive bond to the substrates being tested.6. Apparatus6.1 Sealant Applicator or Oven, capable of maintaining thesealant within 62.8C (
8、65F) of the specified temperature.6.2 Substrates, of annealed glass that are 25.4 mm wide by76.2 mm long and 6.35 mm thick (1 by 3 by 0.25 in.). Othersubstrates may be used when specified (Fig. 1).6.3 Template, to provide 3.18-mm (18-in.) sealant thickness(Fig. 2).6.4 Hot Knife or Spatula.6.5 Tensio
9、n Testing Machine, capable of pulling a specimenat a rate of 12.7 mm (0.5 in.)/min.7. Sampling7.1 Sealant shall be free of external surface contaminantssuch as talc, oil, dust, and moisture. Handling of the sealantsurfaces in contact with the substrate shall be minimized.7.2 A 1.0-kg (2.2-lb) repres
10、entative sample shall be takenfrom bulk stock for testing.8. Test Specimens8.1 Prepare six test specimens from the bulk sample byusing the applicator or the oven method.8.1.1 Applicator Method:8.1.1.1 Clean the substrate surface with soap and waterfollowed by a water rinse and solvent wipe with meth
11、yl ethylketone (MEK).NOTE 1At the request of the sealant manufacturer, an alternativecleaning procedure may be used.8.1.1.2 Using an appropriate die or nozzle, apply a 25.4 by25.4-mm (1 by 1-in.) layer of sealant onto one end of thesubstrate surface at a thickness that when compressed willcomply wit
12、h 8.1.1.4. Substrates shall be at a temperature of 236 2C, 50 6 10 % relative humidity (73.4 6 3.6F). Apply thesealant at the specified temperature 62.8C (65F) (Fig. 1).8.1.1.3 Immediately after sealant application place a secondsubstrate onto the sealant to form an overlap of 6.45 cm2(1 in.2)(Fig.
13、1).8.1.1.4 Using a template (Fig. 2), compress the overlayedsealant to form the 3.18-mm (18-in.) thick overlap (Fig. 3).1This test method is under the jurisdiction ofASTM Committee C24 on BuildingSeals and Sealants and is the direct responsibility of Subcommittee C24.30 onAdhesion.Current edition ap
14、proved Sept. 1, 2006. Published September 2006 Originallyapproved in 1981. Last previous edition approved in 2001 as C 961 01.1Copyright ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959, United States.8.1.1.5 Remove excess sealant from the specimen with a hotk
15、nife or spatula.8.1.2 Oven Method:8.1.2.1 Clean the substrate surface with soap and waterfollowed by a water rinse and solvent wipe with MEK (Note1).8.1.2.2 Place sufficient sealant onto the substrate so thatwhen compressed, a 6.45-cm2(1-in.2) overlap that will complywith 8.1.2.4 is obtained.8.1.2.3
16、 Separately place both the substrate with sealant andthe overlapping substrate into an oven and condition for 30 minat the specified temperature.8.1.2.4 Immediately upon removing the substrates from theoven, place the second substrate onto the sealant on the firstsubstrate (Fig. 1). Using the templa
17、te (Fig. 2), compress theoverlayed sealant to form a 3.18-mm (18-in.) thick overlap(Fig. 3).8.1.2.5 Remove excess sealant from the specimen with a hotknife or spatula.9. Conditioning9.1 Condition all test specimens at 23 6 2C (73.4 6 3.6F)for at least 24 h prior to testing.9.2 Additional conditionin
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