ASHRAE FUNDAMENTALS SI CH 25-2013 Heat Air and Moisture Control In Building Assemblies-Fundamentals.pdf
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1、25.1CHAPTER 25 HEAT, AIR, AND MOISTURE CONTROL IN BUILDING ASSEMBLIESFUNDAMENTALSTerminology and Symbols . 25.1Environmental Hygrothermal Loads and Driving Forces . 25.2HEAT TRANSFER . 25.5Steady-State Thermal Response 25.5Transient Thermal Response . 25.8AIRFLOW . 25.9MOISTURE TRANSFER . 25.10Moist
2、ure Storage in Building Materials . 25.10Moisture Flow Mechanisms 25.12COMBINED HEAT, AIR, AND MOISTURE TRANSFER 25.14SIMPLIFIED HYGROTHERMAL DESIGN CALCULATIONS AND ANALYSES 25.15Surface Humidity and Condensation 25.15Interstitial Condensation and Drying . 25.15TRANSIENT COMPUTATIONAL ANALYSIS 25.1
3、6Criteria to Evaluate Hygrothermal Simulation Results 25.16ROPER design of space heating, cooling, and air-conditioningPsystems requires detailed knowledge of the building envelopesoverall heat, air, and moisture performance. This chapter discussesthe fundamentals of combined heat, air, and moisture
4、 movement asit relates to the analysis and design of envelope assemblies. Guid-ance for designing mechanical systems is found in other chapters ofthe ASHRAE Handbook.Because heat, air, and moisture transfer are coupled and closelyinteract with each other, they should not be treated separately. Infac
5、t, improving a building envelopes energy performance maycause moisture-related problems. Evaporation of water and removalof moisture by other means are processes that may require energy.Only a sophisticated moisture control strategy can ensure hygienicconditions and adequate durability for modern, e
6、nergy-efficientbuilding assemblies. Effective moisture control design must dealwith all hygrothermal loads (heat and humidity) acting on thebuilding envelope.TERMINOLOGY AND SYMBOLSThe following heat, air, and moisture definitions and symbols arecommonly used.A building envelope or building enclosur
7、e provides physicalseparation between the indoor and outdoor environments. A build-ing assembly is any part of the building envelope, such as wallassembly, window assembly, or roof assembly, that has boundaryconditions at the interior and the exterior of the building. A buildingcomponent is any elem
8、ent or material within a building assembly.HeatSpecific heat capacity c is the change in heat (energy) of unitmass of material for unit change of temperature in J/(kgK).Volumetric heat capacity c is the change in heat stored in unitvolume of material for unit change of temperature, in J/(m3K).Heat f
9、lux q, a vector, is the time rate of heat transfer through a unitarea, in W/m2.Thermal conductivity k in Europe, the Greek letter (lambda)is used is a material property defined by Fouriers law of heat con-duction. Thermal conductivity is the parameter that describes heatflux through a unit thickness
10、 of a material in a direction perpen-dicular to the isothermal planes, induced by a unit temperature dif-ference. (ASTM Standard C168 defines homogeneity.) Units areW/(mK). Materials can be isotropic or anisotropic. For anisotro-pic materials, the direction of heat flow through the material mustbe n
11、oted. Thermal conductivity must be evaluated for a specificmean temperature, thickness, age, and moisture content. Thermalconductivity is normally considered an intrinsic property of ahomogenous material. In porous materials, heat flow occurs by acombination of conduction, convection, radiation, and
12、 latent heatexchange processes and may depend on orientation, direction, orboth. When nonconductive modes of heat transfer occur within thespecimen or the test specimen is nonhomogeneous, the measuredproperty of such materials is called apparent thermal conductiv-ity. The specific test conditions (i
13、.e., sample thickness, orientation,environment, environmental pressure, surface temperature, meantemperature, temperature difference, moisture distribution) shouldbe reported with the values of apparent thermal conductivity. Thesymbol kapp(or app) is used to denote the lack of pure conductionor to i
14、ndicate that all values reported are apparent. Materials with alow apparent thermal conductivity are called insulation materials(see Chapter 26 for more detail).Thermal resistivity ruis the reciprocal of thermal conductivity.Units are (mK)/W.Thermal resistance R is an extrinsic property of a materia
15、l orbuilding component determined by the steady-state or time-averagedtemperature difference between two defined surfaces of the materialor component that induces a unit heat flux, in (m2K)/W. When thetwo defined surfaces have unequal areas, as with heat flux throughmaterials of nonuniform thickness
16、, an appropriate mean area andmean thickness must be given. Thermal resistance formulas involv-ing materials that are not uniform slabs must contain shape factors toaccount for the area variation involved. When heat flux occurs byconduction alone, the thermal resistance of a layer of constant thick-
17、ness may be obtained by dividing the materials thickness by its ther-mal conductivity. When several modes of heat transfer are involved,the apparent thermal resistance may be obtained by dividing thematerials thickness by its apparent thermal conductivity. When aircirculates within or passes through
18、 insulation, as may happen in low-density fibrous materials, the apparent thermal resistance is affected.Thermal resistances of common building and insulation materialsare listed in Chapter 26.Thermal conductance C is the reciprocal of thermal resistance.Units are W/(m2K).Heat transfer or surface fi
19、lm coefficient h is the proportionalityfactor that describes the total heat flux by both convection and radi-ation between a surface and the surrounding environment. It is theheat transfer per unit time and unit area induced by a unit tempera-ture difference between the surface and reference tempera
20、ture in thesurrounding environment. Units are W/(m2K). For convection tooccur, the surrounding space must be filled with air or another fluid.If the space is evacuated, heat flow occurs by radiation only. In thecontext of this discussion, indoor or outdoor heat transfer or sur-face film coefficient
21、hior hodenotes an interior or exterior surfaceThe preparation of this chapter is assigned to TC 4.4, Building Materialsand Building Envelope Performance.25.2 2013 ASHRAE HandbookFundamentals (SI)of a building envelope assembly. The heat transfer film coefficientis also commonly known as the surface
22、film conductance.Thermal transmittance U is the quantity equal to the steady-state or time-averaged heat flux from the environment on the oneside of a body to the environment on the other side, per unit temper-ature difference between the two environments, in W/(m2K). Ther-mal transmittance is somet
23、imes called the overall coefficient ofheat transfer or U-factor. Thermal transmittance includes thermalbridge effects and the surface heat transfer at both sides of theassembly.Thermal emissivity is the ratio of radiant flux emitted by a sur-face to that emitted by a black surface at the same temper
24、ature.Emissivity refers to intrinsic properties of a material. Emissivity isdefined only for a specimen of the material that is thick enough to becompletely opaque and has an optically smooth surface.Effective emittance E refers to the properties of a particular ob-ject. It depends on surface layer
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