ARMY MIL-P-70661-1987 POTTED CIRCUIT CARD ASSEMBLY FOR TOW-2 E6 PROBE AND S&A ASSEMBLY《TOW-2 E6探针和S&A组件用密封电路卡组件》.pdf

《ARMY MIL-P-70661-1987 POTTED CIRCUIT CARD ASSEMBLY FOR TOW-2 E6 PROBE AND S&A ASSEMBLY《TOW-2 E6探针和S&A组件用密封电路卡组件》.pdf》由会员分享，可在线阅读，更多相关《ARMY MIL-P-70661-1987 POTTED CIRCUIT CARD ASSEMBLY FOR TOW-2 E6 PROBE AND S&A ASSEMBLY《TOW-2 E6探针和S&A组件用密封电路卡组件》.pdf（27页珍藏版）》请在麦多课文档分享上搜索。

1、J MIL-P-70661 13 7777706 0356558 5 M $e 32m7 MIL-P-70661 (AR) April 27, 1987 MILITARY SPECIFICATION POTTED CIRCUIT CARD ASSEMBLY FOR TOW-2/E6 PROBE AND S dlstrlbutlon Is unllmited. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-. MIL-P-70661 13 = 77

2、79706 0356557 7 c MIL-P-70661 (AR) STANDARDS MIL I TARY MIL-STD-105 - Sampling Procedure and Tables for Inspection by Attributes MIL-STD-275 - Printed Wiring for Electronic Equipment MIL-STD-750 - Test Methods of Semiconductor Devices DOD-STD-2000 - Soldering Technology, High Quality/ High Reliabili

3、ty 2.1.2 Other Government documents, drawings, and publications. The following other Government documents, drawings, and publications form a part of this specification to the extent specified herein. Unless otherwise specified, the issues shall be those in effect on the date of the solicitation. DRA

4、W1 NGS U.S. ARMY ARMAMENT, RESEARCH, DEVELOPMENT AND ENGINEERING CENTER (ARDEC) 9399722 - Circuit Card Assembly Potting 9387141 - TOW 2/E6 Probe and S 4 4 ai rl 9 Id u w CJ * * . . - rl Nrl mm dPdPdPlA0 O000 w we* O000 .e dPdP mm WW O0 . h O rl O 03 Co m tn * E 5 W O m di ai ai III ai c) C Id .FI rl

5、 a u u4 O a, 4J m u -rl W .rl 4J u ai u U ai 4J zo p 3 C v) - ,u e- n QI lx - n O h LI c E O LI 12 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-8 L I- U U C d MIL-P-70661 13 m 7777906 0356570 h m a. e. MMMM MM a. O000 O0 13 Provided by IHSNot for

6、ResaleNo reproduction or networking permitted without license from IHS-,-,-2 B u w pi v1 E H w u O i 2 E O u H 3 a MIL-P-70bb1 13 773370b 0356571 W d 8 rl P u O c, u 1 a d O c) -P b a, rl LI Ia ;u , a, ci a u n ro u O rl O u O E 5! D a 2 Ei u w pi Co 2 H E n 4 v k? IL Y n t5 E 8 rl cvrl . b . . 0000

7、0 O0 a, rl O 0 c rl 21 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-I. Li al N (u 5 O 8 b 1.“ !cr di ,rl -Y i? P O O al O Al cv id dPdP O0 didi O0 O rl w On ci O rl d O -rl ci c) al a (o d *rl bo d *rl 2 c) d Ti and a 0.56 microfarad 10% capacitor

8、 charged to the power supply voltage, shall be connected to the (+) black cable (El) and the (-) red cable (E2) for 400 milliseconds minimum, to allow circuit capacitors to charge. The measurement shall be made after simulating the closure of the tip switch by shorting the black cable (E8) to the br

9、own cable (E12). This test shall be repeated utilizing the power supply not previously used (42 5 1 volt or 67 - + 1 volt). 4.5.3 Base firing energy. Connect a 1.0 K ohm 1% load resistor, simulating the base S and a 0.56 microfarad TO% capacitor charged to the power supply voltage, shall be connecte

10、d to the (+) black cable (El) and the (-) red cable (E2) for 400 milliseconds minimum, to allow circuit capacitors to charge. The measurement shall be made after simulating the closure of a switch (either the tip switch by shorting the black cable (E8) and the brown cable (E12) or the ogive switch b

11、y shorting the black cable (E8) to Elo). The measurement shall then be made once again by simulating closure of the other switch. This entire procedure shall then be repeated utilizing the power supply not previously used (42 f. 1 volt or 67 - 4- 1 volt). 4.5.4 Potted electronic assembly. The potted

12、 electronic assembly shall not show evidence of voids, bubbles and delaminations exceeding the following criteria: a. Bubbles within the sprue vent area are acceptable provided they do not contact the top or bottom surface of the printed wiring board. junction are not acceptable. board are not accep

13、table. b. Bubbles exposing any portion of a lead termination or c. Delaminations of the potting and the printed wiring d. Sprue cutoff shall be flush to 0.04 inches below the surface. 4.5.5 Soldering procedures. All soldering procedures with respect to pre and post cleaning, touchup or rework, and w

14、orkmanship (as applicable to the requirements in 3.7) shall be submitted to the Government for approval. 25 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-_- - _ _-_I MIL-P-70hbL 13 M 7799706 0356583 4 a MIL-P-70661 (AR) 4.5.5.1 Printed wiring board

15、 cleaning procedures. Printed wiring board assembly cleaning procedures shall be documented supplied to the Government in accordance with Data Item DI-T-5372 (see 6.4). 4.5.6 Material control. The contractor shall submit to the technical agency listed in 6.4, a material control document. This docume

16、nt shall detail the procedures that will be used to assure that only qualified components, material, and subassemblies from qualified suppliers are used to manufacture the Potted Circuit Card Assembly. 5. PACKAGING - Not applicable; refer to MIL-P-48698. 6. NOTES 6.1 Intended use. The Potted Circuit

17、 Card Assemblies covered by this specification are intended for use in TOW-2/E6 Probe and S&A Assembly. 6.2 Ordering data. See MIL-A-48078, paragraph 6.1. 6.3 Submission of desiqns for approval. (See MIL-A-48078). Submit equipment designs as required to: Commander, ARDEC, ATTN: AMSMC-QAT-I(D), Picat

18、inny Arsenal, New Jersey 07806-5000. 6.4 Submission of process control documents. Process control documents as specified in 3.8 shall be submitted in accordance with DI-P-1604- (Mod) with Attachment 1, to: Commander, ARDEC, ATTN: AMSMC-QAT-B(D), Picatinny Arsenal, New Jersey 07806-5000. 6.5 Data req

19、uirements. Deliverable data required by the specification is cited in the following paragraphs. Par ag r aph 3.5 4.5.5.1 6.4 Data Requirement Applicable DID Quality Inspection DI- R- 17 2 4 Te s t , Demonstra t ion and Evaluation Report Report Processing Procedure DI-T- 53 7 2 Manufacturing Methods

20、DI-P-1604 Report The above data items shall be delivered to: Commander, ARDEC, ATTN: AMSMC-QAT-B(D), Picatinny Arsenal, New Jersey 07806-5000. 26 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-P-70661 (AR) 6.6 Subject term (key word) listing. TO

21、W-2/E6 Probe and S&A Assembly Circuit card assembly potting Control drawing Soldering Process control Qualified suppliers Certificate of Conformance Printed wiring board Data item description (DID) Quality conformance Lot quality confirmation testing 6.8 Contractor. Unless otherwise specified, the w

22、ord “Contractor“, as used throughout this specification, shall mean any supplier or producer of items or material to the Government. This shall include commercial contractors, sub-contractors, .- Government-Owned, Contractor-Operaterated (GOCO) and Government-Owned, Government-Operated (GOGO) plants. Custodian: Army-AR * U.S. GOVERNMENT PRINTING OFFICE: 1987-704-036/73515 27 Preparing activity: Army-AR . Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-