ARMY MIL-HDBK-1857-1998 HANDBOOK FOR GROUNDING BONDING AND SHIELDING DESIGN PRACTICES《成键和屏蔽设计接地手册》.pdf
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1、NOTE: MIL-STD-1857 has been redesignated as a handbook, and is to be used for guidance purposes only. This document is no longer to be cited as a requirement. For administrative expediency, the only physical change from MIL-STD-1857 is this cover page. However, this document is no longer to be cited
2、 as a requirement. If cited as a requirement, contractors may disregard the requirements of this document and interpret its contents only as guidance. 1 MCH- POUND I MIL-HDBK-1857 27 MARCH 1998 DEPARTMENT OF DEFENSE HANDBOOK FOR GROUNDING, BONDING AND SHIELDING DESIGN PRACTICES I AMSC NIA AREA EMCS
3、Copyright Communications - Electronics Command Provided by IHS under license with CRAINot for ResaleNo reproduction or networking permitted without license from IHS-,-,- JL MIL-HDBK-1857 m 9999970 0262895 421 m MIL-STD-1857( EL) , 30 June 1976 ! HEADQUARTERS DEPARTMENT OF.THE ARMY WASHINGTON, D .C.
4、2031 O Grounding, Bonding and Shielding Design Practices MIL-STD-1857( EL) 1. This Military Standard is approved for use by Electronics Command, Department of the Army, and is available for use by all Departments and Agencies of the Department of Defense. 2. Recommended corrections, additions or del
5、etions should be addressed to Commander, US Army Electronics Command, ATTN: DRSEL-RD-TS-S, Fort Monmouth, N. J. 07703. ii Copyright Communications - Electronics Command Provided by IHS under license with CRAINot for ResaleNo reproduction or networking permitted without license from IHS-,-,-“ . MIL-H
6、DBK-L857 m 9997970 0262696 368 m MIL-STD-I857(EL3 30 June 1976 FOREWORD In the past the Department of the Army has required contractors to use a number of bonding and grounding specifications which were primarily intended for use in the development and construction of airborne and shipboard electron
7、ic equipment. In general these specifications were considered adequate but because many of the requirements included therein were unique to airborne and ship- board equipments they could not be effectively applied to ground Army equipments. In light of these shortcomings this standard was developed
8、to provide to the design engineer bonding, grounding and shielding design requirements which can be more effectively applied and are unique to electronic equipments, subsystems and systems deployed by the Department of The Army. iii Copyright Communications - Electronics Command Provided by IHS unde
9、r license with CRAINot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-STD-l857(EL) 30 June 1976 CONTENTS Paragraph 1 2. 3. 3.1 3.1 -1 3.1.2 3.1.2.1 3.1.2.2 3.1.2.3 3.1.3 3.1.4 3.1.5 3.1.5.1 3.1.5.2 3.1.5.3 3.1.6 3.1.7 3.2 3.2.1 3.2.1 .1 3.2.1.2 3.2.1.3 3.2.2 3.2.2
10、.1 3.2.2.2 3.2.2.3 3.2.3 3.2.4 3.2.4.1 3.2.4.2 3.2.4.3 3.2.4.4 3.2.4.5 3.2 -5 3.2.6 3.2.7 3.2.7.1 3.2.7.2 REFERENCED DOCUMENIS - - - - - - - 1 REQUIREMENTS - - - - - - - - - - - 2 Grounding - - - - - - - - - - - 2 Grounding plane requirements - - - - 2 Grounding techniques - - - - - - - - 3 Floating
11、 ground system - - - - - - - 3 Single-point grounding system - - - 3 Multipoint grounding system - - - - 3 Ground connections - - - - - - - - - 3 Distribution of chassis potential - 5 Grounding of shields - - - - - - - - 9 Cable grounding - - - - - - - - - - 9 Printed circuit boards - - - - - - - 11
12、 Circuit grounding - - - - - - - - - 11 Power supplies - - - - - - - - - - 16 Equipment - - - - - - - - - - - 9 Bonding - - - - - - - - - - - 16 Genera1 - 16 Bond effectiveness - - - - - - - - - 16 Design requirements - - - - - - - - 18 Bonding jumpers (straps) - - - - - - 18 Types of bonds - - - -
13、- - - - - - - 18 Indirect bonds - - - - - - - - - - - 19 Bonding metal selection and bond- strap finishes - - - - - - - - - - 22 Bonding applications - - - - - - - - 24 Shock mounts - - - - - - - - - - - - 24 Rotating joints - - - - - - - - - - 29 Tubing conduit - - - - - - - - - - - 29 Cable trays
14、- - - - - - - - - - - - 29 Bonding practices summarized - - - - 29 Grounding requirements - - - - - - - 33 Earth ground - - - - - - - - - - - - 33 Ground resistance - - - - - - - - - 33 Grounding in sub zero zones - - - - 37 Direct bonds - - - - - L - - - - 19 Bond-straps - - - - - - - - - 19 Hinges
15、 - - - - - - - - - - - - - 29 iv Copyright Communications - Electronics Command Provided by IHS under license with CRAINot for ResaleNo reproduction or networking permitted without license from IHS-,-,- MIL-HDBK-LB57 H 9999970 0262698 L30 W MIL-STD-1857 (EL) 30 June 1976 CONTENTS - Continued Paragra
16、ph 3.2.8 3.2.9 3.3 3.3.1 3.3.2 3.3.3 3.3.4 3.3.5 3.3.6 3.3.6.1 3.3.6.2 3.3.7 3.3.8 3.3.9 3.3.9.1 3.3.9.2 3.3.10 3.3.11 3.3.11.1 3.3.11.2 3.3.11.3 3.3.11.4 3.3.11.5 3.3.11.6 3.3.11 -7 3.3.11.8 3.3.11.9 3.3.11 -10 3.3.12 3.3.13 3.3.13.? 3.3.13.2 3.3.14 3.3.14.1 3.3.14.2 3.3.14.3 3.3.14.4 3.3.14.5 Sepa
17、ration of ac neutral from frame Marine craft bonding and grounding ground“- methods - Shielding - - - - - - - - - - - - - General- Shielding effectiveness - - - - - - Cable shielding - - - - - - - - - - Case and front panel shielding - - Shielding design fundamentals - - - Multiple shielding- - - -
18、- - - -. - Multiple shielding applications - - Enclosure seam design - - - - - - - Shielding of apertures - - - - - - Waveguide attenuation characteristics Conductive, gaskets - - - - - - - - General -c- Screening - - - - - - - - - - - General- Fasteners - - - - - - - - - - - - - General - - - - - -
19、 - - - - Application - - - - - - - - - - - - Fastening material - - - - - - - - Equipment panels - - - - - - - - - Conductive Elastomer Materials - - Pressure and rain seals - - - - - - Connector seals - - - - - - - - - - Characteristics of conductive gasket Shielding enhancement by conductive Quali
20、fication of gasket material - Insertion loss - - - - - - - - - - Classification of joints - - - - - Conductive gasket selection - - - - Special shielding techniques - - - Gas discharge lamps - - - - - - - - Magnetic shielding techniques - - - Data output openings - - - - - - - Direct view storage tu
21、bes - - - - - Cathode-ray tubes - - - - - - - - - material - - - - - - - - - - gaskets - - - - - - - - - - - - General- Page 37 39 39 39 39 42 45 45 52 52 53 53 57 57 57 60 64 69 69 72 1 72 72 77 77 77 79 81 82 83 83 83 88 88 88 90 93 93 96 V Copyright Communications - Electronics Command Provided b
22、y IHS under license with CRAINot for ResaleNo reproduction or networking permitted without license from IHS-,-,-Paragraph 3.3.14.6 3.3.14.7 3.3.14.8 3.3.14.9 3.3.15 3.3.15.1 3.3.15.2 3.3.15.3 3.3.15.4 3.3.16 3.3.17 3.3.17.1 3.3.17.2 3.3.17.3 3.3.17.4 3.3.18 3.3.18.1 3.3.18.2 3.3.18.3 3.3.18.4 3.3.19
23、 3.3.20 3.3.20.1 3.3.20.2 3.3.20.3 3.3.20.4 3.3.20.5 3.3.20.6 3.3.21 3.3.21.1 3.3.21.2 3.3.21.3 Figure 1 2 3 4 5 P.-ll MIL-HDBK-L857 m 9999970 0262899 077 m MIL-STO-I857(EL) 30 June 1976 CONTENTS - Continued Page Indicating and elapsed time meters 96 Fuse holder and indicator lamp Switching devices
24、- - - - - - - - - 98 Conductive surface coatings - - - - 1 O0 openings - - - - - - - - - 96 Cabling - - - - - - - - - - - - 103 General- 103 Cable types - - - - - - - - - - - 1 04 Cable shielding - - - - - - - - - - 103 Required cable characteristics - - 105 Cable connectors - - - - - - - - - 1 o9 C
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