ARMY MIL-C-70497-1985 CIRCUIT CARD ASSEMBLY CASE INTERCONNECT《电路板组装药筒互连》.pdf
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1、i fi-o8 - 13 MIL-C-70477 12 7777706 0355277 3 MIL-C-70497 (AR) 04 APRIL 85 MILITARY SPECIFICATION CIRCUIT CARD ASSEMBLY, CASE INTERCONNECT This specification is approved for use by the US Army Armament, Munitioni; and Chemical Command and is available for use by all Departments and Agencies of the D
2、epartmentiof Defense. 1. SCOPE 1.1 Scope. This specification establishes the requirements for manufacture and acceptance of the Case Interconnect Circuit Card Assembly: 9355699, used in the Mortar Ballistics Computer (MBC): M23. Throughout this specification this assembly is referenced as “Interconn
3、ect“. 2. APPLICABLE DOCUMENTS. 2 o 1 Government documents. 2.1.1 Specification and standards. Unless otherwise cpeclfied, the following specifications and-standards of the issue listed in that issue df the Department of Defense index of Specifications and Standards (DoDISS) specrfied in the solicita
4、tion form a part f this specification to the extent specffied herein. SPEC1 FI CATIONS MILITARY MIL-F-13926 - Fire Control Materiel; General Specification Governing the Manufacture and Inspection Maintenance and Disposition of MIL- 1-45 6 07 - Inspection Equipment, Acquis; tion, STANDARDS MILITARY M
5、IL -STD- 105 - Sampling Procedures and Tables for Inspection by Attributes FSC 1220 Beneficial comments (recommendations, additions. deletions) and any pertinent data which may be of uae in improving this document ahodd beaddressed to: Commander, US Army Armament Research and Development Center, Ath
6、: AMSYC-QA, Dover. New Jersey Q7801-5001 by using the self-addreised Standardization Document Improvement Proposal (DD Form 1428) appearing at the end of this document or by letter. I THIS DOCUMENT CONTAINS - i/ - PAGES - Provided by IHSNot for ResaleNo reproduction or networking permitted without l
7、icense from IHS-,-,-MIL-C-70497 12 m 9999906 0355278 5 W MIL-(2-70497 (AR) MIL-STD-109 - Quality Assurance Terms and MIL-STD-454 - Electronic Equipment, General MIL-STD-1521 - Technical Reviews and Audits for De f i nit i ons Requirements for Systems, Equipments, and Computer Programs MIL-STD-45662
8、- Calibration System Requirements (Copies of specifications and standards required by suppliers in connection with specific procurement functions should be obtained f.Kom the procuring activity or as directed by the contracting officer . ) 2.1.2 Other Goverment documents, drawings, and publications.
9、 The following other Government documents, drawings, and - publications form a part of this specification to the extent specified herein. Unless otherwise indicated, the issue in effect on date of invitation for bids or request for proposal. DRAWINGS 9355699 - Circuit Card Assembly, Case 11785850 -
10、Computer Set, Ballistics, Mortar: M23 Interconnect PACKAGING DATA SHEETS 9355699 - Packaging of Circuit Card Assembly, Case Interconnect: 9355699 (Copies of drawings and packaging data sheets required by manufacturers in connection with specific acquisition functions should be obtained from the cont
11、racting activity or as directed by the contracting officer.) 2.2 Order of precedence. In the event of a conflict between the text of this specification and the references cited herein, the text of this specification shall take precedence. 3. REQUIREMENTS 3.1 Item definition. The interconnect provide
12、s the Mortar Ballistic Computer (MBC) with electrical interconnection between the following: a . Keyboard Assembly. b. Interconnect Circuit Ca.rd Assembly. c. Battery: BB-588/U, BA-5588/U, or BA1588/U. 2 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-
13、,-MIL-C-70477 12 W 999990b 0355279 7 MIL-C-70497(AR) - I The connector contacts are listed in Table I. I Connect or TABLE I. Case interconnect circuit card assembly connector contacts. XA5 xA5 xA5 xA5 XA5 xA5 XA5 xA5 XA5 xA5 XA5 xA5 xA5 xA5 XA5 xA5 XA5 xA5 XA5 xA5 XA5 xA5 xA6A2 XA6A2 xA6A2 XA6A2 xA6
14、A2 XA6A2 XA6A2 XA6A2 xA6A2 XA6A2 xA6A2 xA6A2 xA6A2 xA6A2 XA6A2 XA6A2 xA6A2 xA6A2 xA6A2 xA6A2 XA6A2 xA6A2 Pin - Al A2 A3 A4 A5 A6 A7 A8 A9 A10 All B1 B2 B3 B4 B5 B6 B7 B8 B9 B10 B11 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 Signal Name HBO* m1* HB2 * m3* HB4 * m5* HB6 * GND MS GLE D ON
15、LED ELLO LBO * LB1 * LB2* LB3 * LB4* LB5 * LB6* ON* SEQLED BATLED ELHI GND GND GND LBO * LB1 * LB2“ LB3 * LB4* HB5 * HBl* HB4 * m3* HBO * HB2* MS GLE D ELLO HB6 * ELH I ONLED LB5* LB6 * BATP OS 3 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-C-
16、70Ll77 12 W 777770b 03552AO 3 XA6A2 XA6A2 XA6A2 XA6A2 MIL-C- 7 O 4 9 7 (AR) TABLE I. Case interconnect circuit card assembly connector contacts.-Continued 23 24 25 26 El E2 BATPOS ON* SEQLED BATLED BAT BATRTN 3.2 Performance. The interconnect shall meet the requirements specified herein unless other
17、wise specified. 3.2.1 Functional. The resistance between the connector contacts listing in Table II shall be less than 7.5 Ohms. TABLE II. Connector contacts; -resistance. XA5-A1 to XA5-A2 to XA5-A3 to XA5-A4 to XA5-A5 . to XA5-A6 to XA5-A7 to XA5-Aa to XA5-A9 to XA5-Al0 to XA5-Al1 to XA5-Bl to XA5-
18、B2 to XA5-B3 to XA5-B4 to XA5-B5 to XA5-B6. to XA5-B7 to XA5-B6 to XA5-B9 to XA5-BlO to XA5-Bl1 . to XA6A2-22 to XA6A2-13 XA6A2-10 XA6A2-14 XA6A2-12 XA6A2-11 XA6A2-9 XA6A2-17 XA6A2-1 to XA6A2 to XA6A2-3 to E2 XA 6A2 - 15 XA6A2-19 XA6A2-16 XA6A2-4 XA6A2-5 XA6A2-6 XA6A2-7 XA6A2-8 XA6A2-20 XA6A2-21 XA6
19、A2-24 XA6A2-25 XA6A2-26 XA6A2 - 18 XA6A2-23 to El 3.2.2 Physical characteristics. The physical characteristics shall be as prescribed by the drawings, specifications, and QAPs. 3.2.3 Reliability. When specified in the contract, a special sample shall be subjected to reliability testing. manufacturin
20、g and production techniques emloyed in the fabrication of the interconnet shall not degrade the inherent .reliability. (See 4 and 6) The 4 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-C-70477 12 W 777770b 0355281 5 W MIL-C-70 4 97 (AR) 3.3 Env
21、ironmental, The interconnect shall meet the requirements specified herein unless otherwise specified. 3.3.1 Room ambient temperature. The requirements of this specification shall be met with the interconnect thermally stabilized at room ambient temperature of +16OC to +32OC (+600F to +9OOF), unless
22、otherwise specified in the requirements paragraph. 3.3.2 Environmental stress screen (ESS) temperature, The interconnect shall meet the requirements of 3.2.1 after having been exposed to a minimum of ten temperature cycles at temperatures of -57OC and +710C (-71OF and +160OF). 3.3.3 Environmental st
23、ress screen (ESC) vibration. The interconnect shall meet the requirements of 3.2.1 after having been subjected to a random or pseudorandom vibration which includes frequency content from 100 Hz to 1000 Hz and up to a 3g RMS in two axis for a period of 10 minutes plus or minus 15 seconds. 3.4 Fabrica
24、tion, The interconnect shall be manufactured in accordance with drawing 9355699. 3.5 First article. When specified in the contract, a sample shall be subjected to first article inspection (See 4 and 6). 3.6 Workmanship. The workmanship requirements of MIL-F-13926 and MIL-STD-454 shall be met. All co
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