ARMY MIL-C-70490-1985 CIRCUIT CARD ASSEMBLY MEMORY《电路板组装记忆》.pdf

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1、MIL-C-70470 32 = 7777706 0355367 O Beneficial commenta (recommendations, additions, deletions) and my pertinent data which may be of use in improving thla document should be addressed to: Commander, US Army Armament Research and Development Center, Ath; AMSMC-ClA, Dorer, New Jeraeg 07801-6001 by usi

2、ng the i General MIL- 1-4 5 6 O 7 - Inspection Equipment, Acquisition, Specification Governing the Manufacture and Inspection Maintenance and Disposition of STANDARDS MILITARY MIL-STD-105 u Sampling Procedures and Tables for nspection by Attributes FCC 1220 P I THIS DOCUMGNT CONTAINS L PAGES _ 1 Pro

3、vided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-C-70490 (AR) I MIL-STD-1 O 9 - Quality Assurance Terms and M IL-STD- 4 5 4 - Electronic Equipment, General MIL-STD-1521 - Technical Reviews and Audits for MIL-STD-45662 - Calibration System Requirement

4、s Definitions Requirements for Systems, Equipments, and Computer Programs (Copies of specifications and standards required by suppliers in connection with specific procurement functions should be obtained from the procuring activity or as directed by the contracting officer .) 2.1.2 Other Goverment

5、documents, drawinqs, and publications. The following other Government documents, drawings, and publications-form a part of this specification t the extent specified herein. Unless otherwise indicated, the issue in effect on date of invitation for bids or request for proposal. DRAWINGS 9379230-1 - Ci

6、rcuit Card Assembly, Memory 11785850 - Computer Set, Ballistics, Mortar: M23 PACKAGING DATA SHEETS 9379230-1 - Packaging of Circuit Card Assembly, Memory: 9379230-1 (Copies of drawings and packaging data sheets required by manufacturers in connection with specific acquisition functions should be obt

7、ained from the contracting activity or as directed by the contracting officer .) 2.2 Order of precedence. In the event of a conflict between the text of this specification and the references cited herein, the text of this specification shall take precedence. 3. REQUIREMENTS 3.1 Item definition. The

8、memory circuit card assembly provides the Mortar Ballistic Computer (MBC) with 14 336 8-bit words of random access memory (RAM), 131 072 8-bit words of erasable programmable read only memory (EPROM), and the RAM standby control circuitry. The EPROM is organized into 4 lower banks of 16 384 8-bit wor

9、ds each located functionally between hexidecimal addressees 4000 and 7FFF, and 4 upper banks located functionally between hexidecimal addressees 8000 and BFFF. Before programming or reading from EPROM, 1 upper bank and 1 lower bank must be enabled. The memory organization and major hardware function

10、s are shown in Figure 1 and Figure 2. The connector contacts are listed in Table 1. 2 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-F7FF coo0 BFFF 8000 7FFF 4000 MIL-C-70LI70 12 W 7797706 0355171 7 14K RAM Upper bank O 16K EPROM Lower bank O 16K EP

11、ROM MIL-C- 7 O 4 9 O (AR) TOTAL MEMORY 142K WORDS EPROM 128K WORDS RAM 14K WORDS Upper bank 1 16K EPROM Lower bank 1 16K EPROM Upper bank 2 16K EPROM Lower bank 2 16K EPROM FIGURE 1. Memory orqanization. NOTE: 1K is equal to 1024. Upper bank 3 16K EPROM Lower bank 3 16K EPROM 3 Provided by IHSNot fo

12、r ResaleNo reproduction or networking permitted without license from IHS-,-,-_ -I_ MIL-C-70LI70 32 H 7797706 0355372 O H MIL-C-70490 (AR) ADDR CONTROL STATUS DATA CONTROL READ BUS LINES 4 4) DECODER v v, 8-BIT ADDR STATUS BITS REGISTERS 18 i i* 1 17 RAM KEEP ALIVE FROM POWER SUPPLY v- iI . 1 ?CHIP B

13、ANK SELECT SELECT each 100 produced which ever occurs first. The sample shall meet: the requirements and tests in Table III, 12 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-C-70470 I2 7777706 0355II I = - MIL-(2-70490 (AR) TABLE III. Classific

14、ation of defects. - No. Characteristics 201. Fabrication 202. Materials Requirement Test Procedure 3.4 3.7 Applicable Drawing/ Visual Applicable Drawing/ Visual NOTE: The tests in Table III shall be conducted at room ambient temperature (as specified in 3.3.1). 4.4.3 Failure of sample. Should any on

15、e item of a special sampling fail to meet the specified test requirements, acceptance of the represented inspection lot will be suspended by the Government until necessary corrections have been made by the contractor and resubmitted items have been approved in accordance with “Acceptance and Rejecti

16、on“ as specified in MIL-STD-105. 4.5 Inspection equipment. Except as otherwise provided for by the contract, the contractor shall supply and maintain inspection equipment in accordance with the applicable requirements of MIL-1-45607. 4.5.1 Government furnished inspection equipment. Where the contrac

17、t provides for Government furnished test equipment, supply and maintenance of test equipment shall be in accordance with the applicable requirements specified in MIL-1-45607. 0 4.5.2 Contractor furnished inspection equipment. 4.5.2.1 Government design. All inspection equipment specified by drawing n

18、umber in specification or QAP forming a part of the contract shall be supplied by the contractor in accordance with technical data included in the Technical Data Package List (TDPL) . 4.5.2.2 Contractor design. In the absence of Government inspection equipment design, the contractor shall design and

19、 supply inspection equipment compatible with the “Test Methods and Procedures1 specified in 4.6 of this specification and with the component inspection procedures specified in “Examination“ and “Test Facilities“ requirements of MIL-F-13926. Since tolerance of test equipment is normally considered to

20、 be within 10% of the product tolerance for which it is intended, this inherent error in the test equipment design must be considered as part of the prescribed product tolerance limit. Thus, concept, construction, materials, dimensions, and tolerance used in the design of test equipment shall be so

21、selected and controlled as to insure that 13 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-C-90490 (AR) the tes% equipment will reliably indicate acceptability of a product which does not exceed 90% of the prescribed tolerance limit, and .permi

22、t positive rejection when non-conforming. Construction shall be such as to facilitate routine calibration of test equipment . 4.5,2.3 Inspection equipment desiqn requirements. 4.5,2.3.1 Temperature testing, The volume of the test chamber shall conform to the test facilities requirements of MIL-F-139

23、26. The air temperakure at the control sensor shall be in accordance with the specified requirements within plus or minus 2.5OF (1.4OC) . The temperature gradient across the cross-sectional area occupied by the test item shall not exceed 0.5F per foot in any direction. The heat source of the test ch

24、amber shall be so located that radient heat, if used, will not fall -directly on the test item. Thermocouples or equivalent temperature sensors utilized to determine or control the specified chamber temperature shall be centrally located within the test chamber within the supply airstream, or in the

25、 return airstream, whichever provides the specified test condition at the item under test and shall be baffled or otherwise protected against radiation effects. 4.5.2.3.2 Fabrication, setup and calibration, Design and fabrication of test equipment shall be such that it incorporates the features of r

26、igidity, stability, and ease of maintenance. Setup and calibration equipment necessary for certification of the testing equipment accuracy shall be furnished and will become a part of the testing equipment. instruction shall be prepared and submitted to the procuring ac tvity. in the contract, the f

27、ollowing procedures shall be utilized to conduct specified tests. If the contractor chooses to use alternate test procedures, a detailed description of the Set-up and procedure shall be submitted to the government procuring agency for approval prior to use. test shall conform to the requirements of

28、4.5.2.3.1. The memory shall be placed in the test chamber and the temperature of the chamber reduced, 10C (18OF) per minute plus or minus 1C (1.8OF) from room ambient temperature (as specified in 3.3.1) to -57OC (-71F). The memory shall be maintained at this temperature for a minimum of 20 minutes.

29、Upon completion of the 20 minute exposure, the temperature of the chamber shall be raised 10C (18OF) per minute plus or minus l0C (1.8OF) to +7loF (+16OoC). The memory shall remain at this temperature for a minimum of 20 minutes. Upon completion of the 20 minute Operating and calibration 4.6 Test me

30、thods arid procedures. Unless otherwise specified 4.6.1 ESC temperature. Testing equipment utilized in this 14 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-C-70Ll70 12 m 7777706 0355183 5 m MIL-C-70490 (AR) 0 exposure the temperature of the ch

31、amber shall be reduced 1OOC (180F) per minute plus or minus l0C (1.8OF) to room ambient temperature (as specified in 3.3.1). The above procedure shall be conducted a minimum of ten times. Upon completion of the cycles the memory shall then be removed from the chamber and subjected to the tests in 4.

32、6.3 and 4.6.9 inclusive. It shall meet the requirements of 3.2.1.1 and 3.2.1.7 inclusive. i 4.6.2 ESC vibration. Conduct the vibration test with the memory positioned on an appropriate adapter affixed to a vibrating machine that is capable of providing the amplitudes and frequencies specified in 3.3

33、.3. Unless otherwise specified, the test equipment shall be in accordance with the “Test Facilities“ requirements of MIL-F-13926. The applied motion shall be in two separate planes for the time period specified. Upon completion of the vibration sweep the memory shall be removed from the vibration ad

34、apter and shall be subjected to the tests in 4.6.3 and 4.6.9 inclusive. It shall meet the requirements of 3.2.1.1 and 3.2.1.7 inclusive. 4.6.3 Memory read cycle. Tests 4.6.3 and 4.6.4 shall be performed by first connecting the following connector contacts together and then applying a 5.3 plus or min

35、us .1 volt DC power supply to Pl-Al (+5V) , Pl-Al8 (+5V), and Pl-A33 (EPROM +5V), all with respect to P1-B1 (GND). Before reading from EPROM, 1 upper bank and 1 lower bank shall be enabled by loading registers U36 and U37 with the following data. Verify the data in EPROM by using the memory read cyc

36、le described in 3.2.1.1. The data shall be verified from hexidecimal address (4000) to address (BFFF) for each of the 4 banks. Upper Bank O 1 2 3 Lower Bank Register U37 Data O000 0001 O010 O011 Register U36 Data O000 O001 O010 O011 4.6.4 RAM write cycle. a. Write to RAM with hexidecimal data (al) u

37、sing the RAM write cycle specified in 3.2.1.2, 15 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-C-70LI70 12 M 7777906 03551LI 7 M MIL-C-70490 (AR) b. Verify the data written to RAM is correct by reading data from RAM using the memory read cycle

38、 described in 3.2.1.1. c. Rotate to the right by 1 bit the data in the memory location being tested and reverify the data for each rotation. d. Data shall be written as in a. thru c. to the full range of RAM from hexideciml address (2000) to address (F7FF). e. Write to the fll range of RAM from hexi

39、decimal address (COOO) to address (F7FF) with hexidecimal data (00) using the RAM write cycle specified in 3.2.1.2. f, Write to the RAM location being tested with hexidecimal data (FF) using the RAM write cycle specified in 3.2,1.2. g. Verify that all RAM addresses that differ from the test address-

40、by 1 bit contain hexidecimal data (00) by using the memory read cycle described in 3.2.1.1. h. Data shall be written as in e. thru g, to the full range of RAM from hexidecimal address (2000) to address (F7FF). 4.6.5 EPROM proqram cycle. Before programming EPROM, 1 upper bank and 1 lower bank shll be

41、 enabled by loading registers U36 and U37 with the data specified in 4.6.3. An EPROM program cycle shall be accomplished by applying the signals specified in 3.2.1.3. The -VPP connector contact for each bank is listed below and shall have the following input specifications: Parame ter Cond it ions M

42、inimum Maximum Units High voltage 1 in=30mA max 20.5 21.5 .Volts Dc Low voltage Open circuit Upper Bank VPP Connector Contact O 1 2 3 Lower Bank VPP Connector Contact O 1 2 3 16 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-C-70470 12 m 7797706

43、 0355385 7 m MIL-C-70490 (AR) 4.6,6 EPROM erasure. The EPROM shall be erased by exposing the transparent window to high intensity ultraviolet light. A light source with a wavelength of 2537 Angstroms yielding a minimum integrated dosage of 15 w-see/cm(2) is required. An ultraviletlight source with a

44、 power of 12,000 microwatts/cm(2) placed within 1 inch of the window wTI1 erase the EPROM in 20 minutes. The EPROM shall be erased when requirement 3.2.1.4 is met . 4.6.7 RAM standby circuitry. Connect a 5 volt variable DC power supply to Pl-B22 (BAT+5V) with respect to GND. Then disconnect Pl-Al (t

45、5V) from the 5 volt power supply. Slowly decrease the voltage of the variable power supply while at the same time monitoring with a DC voltmeter the voltage at Pl-B23 (RAMt5-V). The output response shall be as specified in 3.2.1.5. 4.6.8 Common connector contact continuity. With no external power co

46、nnected to the memory circuit card assembly, measure with an ohm meter the resistance between the following connector contacts. All measured resistances shall be as specified in 3,2.1.6. Pl-Al8 tQ Pl-Al Pl-Bl8 to P1-B1 Pl-B33 to Pl-B1 Pl-B50 to P1-B1 4.6.9 Pullup resistor. With no external power con

47、nected to the memory circuit card assembly, measure with an ohm meter the resistance between Pl-A38 and P1-Al. The resistance shall be as specified in 3.2.1.7. 4.6.10 Workmanship. The memory shall be subjected to a visual and tactile examination for evidence of faulty workmanship. The assembly shall

48、 conform to the requirements of 3.6. 4.7 Reliability testing. The requirement for re.liabflity test approval and the responsibility (Government or contractor) for reliability testing shl be as specified in the contract. The sample for reliability test shall consist of 3 memorys. The samples shall be

49、 manufactured in the same manner, using the same materials, equipment, processes, and procedures as wlll be used in the production of the balance of the contract quantity. All parts and materials, -including packaging and packing, shall be obtained from the same source of supply as wer1 be used in the production of the balance of the contract quantity. 17 Provided by IHSNot for ResaleNo re