ARMY MIL-C-48483 C-1995 CIRCUIT CARD ASSEMBLY - COMPARATOR TYPE 1《电路板组装-1型比较器》.pdf
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1、a MIL-C-48483C 9 0b 2003039 082 LINCH-POUND I MIL-C-48483C(AR) O9 Mav 1995 (see 6.4) MILITARY SPECIFICATION CIRCUIT CARD ASSEMBLY - COMPARATOR, TYPE I This specification is approved for use by the U.S. Army Armament, Research, Development and Engineering Center (ARDEC) and is available for use by al
2、l Departments and Agencies of the Department of Defense. 1. SCOPE 1.1 Scope. This specification establishes the requirements and quality assurance provisions for the Circuit Card Assembly Comparator Type I, 11732530 (see 6.1). 2. APPLICABLE DOCUMENTS 2.1 Government documents. 2.1.1 Specifications, s
3、tandards and handbooks. The follow- ing specifications, standards and handbooks form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents shall be those listed in the issue of the Department of Defense Index of Specifications and Standards
4、 (DODISS) and supplement thereto, cited in the solicitation (see 6.2). SPECIFICATIONS MILITARY MIL-F-13926 - Fire Control Materiel, General Specification Governing the Manufacture and Inspection of Beneficial comments (recommendations, additions, deletions) and any pertinent data which may be of use
5、 to improving this document should be addressed to: Commander, U.S. Army ARDEC, ATTN: AMSTA-AR-EDE-S, Picatinny Arsenal, New Jersey 07806-5000 by using the Standardization Document Improvement Proposal (DD Form 1426) appearing at the end of this document or by letter. AMSC N/A PISTRIBUTI ON STATEMEN
6、T A . unlimited. Approved for public release; distribution is Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-C-48483C W 999990b 2003020 8T4 = . MIL-1-45607 - Inspection Equipment; Acquisition, Maintenance, and Disposition of STANDARDS MILITARY M
7、IL-STD-100 - Engineering Drawing Practices MIL-STD-454 - Standard General Requirements for MIL-STD-810 - Environmental Test Methods MIL-STD-2000 - Standard Requirements for Soldered MIL-STD-2073-1 - Procedures for Development and Electronic Equipment Electrical and Electronic Assemblies Application
8、of Packaging Requirements (Unless otherwise indicated, copies of federal and military specifications, standards and handbooks are available from: DODSSP - Customer Service, Standardization Documents Order Desk, 700 Robbins Avenue, Bldg 4D, Philadelphia, PA 19111-5094.) 2.1.2 Other Government documen
9、ts, drawings and publications. The following other Government documents, drawings and publications form a part of this document to the extent specified herein. Unless otherwise specified, the issue shall be those in effect on date of the solicitation. U.S. Army Armament Research Development and Engi
10、neering Center (ARDEC) DRAWINGS 11732530 - Circuit Card Assembly - Comparator, Type 1 (Copies of Government drawings required by contractors in connection with specific acquisition functions should be obtained from the contracting activity or as directed by the contracting activity.) 2.2 Order of pr
11、ecedence. In the event of a conflict between the text of this document and the references cited herein (except for related associated detail specifications, specification sheets or MS standards), the text of this document shall take precedence. Nothing in this document, however, supersedes applicabl
12、e laws and regulations unless a specific exemption has been obtained (See control provisions for additional precedence criteria). 2 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-3. REQUIREMENTS 3.1 Fabrication. The Comparator, Type I circuit card a
13、ssembly, herein referred to as the assembly, shall be manufactured in accordance with Drawing 11732530 and drawings pertaining thereto and, when assembled, shall meet the requirements of this specification (see 4.5.1). 3.1.1 Function. The assembly shall provide the following: a. Compare the computer
14、 power, ammo select, - epsilon and eta signals for correct, predetermined values and provide logic for decoding results of the comparisons. b. General logic signals necessary for illuminating either a card malfunction lamp or a computer OK lamp. 3.1.2 General specifications. (see 4.6.3) 3.1.2.1 Manu
15、facture and inspection. The following provisions of MIL-F-13926 apply: a. Dimensions and tolerances b, Effect of protective coating on dimension (Inorganic c. Part identification and marking d. Workmanship (including applicable portions of type coatings) MIL-STD-2000 and MIL-STD-454, Requirement 9)
16、3.1.2-2 Standards of manufacture. 3.1.2.2.1 Assembly and soldering. The requirements of MIL-STD-2000 shall apply, as a minimum. 3.1.2.2.2 Interchangeability. The assembly shall be manufactured in accordance with the interchangeability requirements as specified in MIL-STD-100. 3.1.3 Ambient condition
17、s. Standard ambient conditions shall be as follows: a. Temperature 730 + 180F b. Relative humidity 50 percent + 30 percent c. Atmospheric pressure 28.5 + 2.0 -3.0 in. Hg. 3.2 First article. When specified in the contract or purchase order (see 6.21, the contractor shall furnish sample units for firs
18、t article inspection and approval (see 4.4). 3.3 Performance. Unless otherwise specified, the assembly shall meet the performance requirements specified herein under standard ambient conditions of 3.1.3. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-
19、,-MIL-C-48483C W 9999906 2003022 677 3.3.1 Computer Al and A2 cards fail comparator logic. (see 4.6.1) 3.3.1.1 Phase 1. With the power sources (items 2.1, 2.2, 2.4 and 2.6 of Table I), lamp loads (items 1.1 and 1.2 of Table I), and interconnections (item 4 of Table I) applied to the assembly; and wi
20、th the items input conditions of Table II established in any item number order, the corresponding lamp illumination conditions shall be specified in Table II. 3.3.1.2 Phase 2. With the power sources (items 2.1, 2.2, 2.4 and 2.6 of Table I), lamp loads (item 1.1 of Table I), and interconnections (ite
21、m 4 of Table I) applied to the assembly and with pins B7 and A23 connected to ground pins A3, B3, the signal source (item 3.2 of Table I) applied and adjusted to +12.469 + 0.005V rms phase 2, and with the signal source (item 3.1 of Table I) applied and: a. With item 3.1 of Table I voltage adjusted t
22、o the nominal center point +2.023 - + 0.005V dc, lamp 1.1 shall extinguish. b. With item 3.1 of Table I voltage increased from the nominal voltage, lamp 1.1 shall illuminate. This change shall occur with item 3.1 voltage adjusted within the outward bound upper limit +2.243 to +2-354V dc. c. With ite
23、m 3.1 of Table I voltage decreased from the outward bound upper limit, lamp 1.1 shall extinguish. This change shall occur with item 3.1 voltage adjusted within the inward bound upper limit range +2.221 to 2.325V dc. d. With item 3.1 of Table I voltage decreased from the inward bound upper limit, lam
24、p 1.1 shall illuminate. This change shall occur with item 3.1 voltage adjusted within the outward bound lower limit range +1.698 to +1.805V dc. J e. With item 3.1 of Table I voltage increased, lamp 1.1 shall extinguish. This change shall occur with item 3.1 voltage adjusted within the inward bound l
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