ARMY MIL-C-48480 C-1995 CIRCUIT CARD ASSEMBLY - LOGIC AND REFERENCE《电路板组装-逻辑与参考》.pdf

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1、MIL-C-48480C H 9999906 2004833 824 = JINCH-POUND MIL-C-4848OC(AR) 30 (see May 6.4) 1995 MILITARY SPECIFICATION CIRCUIT CARD ASSEMBLY - LOGIC AND REFERENCE This specification is approved for use by the U.S. Army Armament, Research, Development and Engineering Center (ARDEC) and is available for use b

2、y all Departments and Agencies of the Department of Defense. 1. SCOPE 1.1 Scope. This specification establishes the requirements and quality assurance provisions for the Circuit Card Assembly Logic and Reference, 11732517 (see 6.1). 2. APPLICABLE DOCUMENTS 2.1 Government documents. 2.1.1 Specificati

3、ons, standards and handbooks. The follow- ing specifications, standards and handbooks form a part of this document to the extent specified herein. specified, the issues of these documents shall be those listed in the issue of the Department of Defense Index of Specifications and Standards (DODISS) a

4、nd supplement thereto, cited in the solicitation (see 6.2). Unless otherwise SPECIFICATIONS MILITARY MIL-F-13926 - Fire Control Materiel, General Specification Governing the Manufacture and Inspection of MIL-1-45607 - Inspection Equipment; Acquisition, Maintenance, and Disposition of Beneficial comm

5、ents (recommendations, additions, deletions) and any pertinent data which may be of use to improving this document should be addressed to: Commander, U.S. Army ARDEC, ATTN: AMSTA-AR-EDE-S, Picatinny Arsenal, New Jersey 07806-5000 by using the Standardization Document Improvement Proposal (DD Form 14

6、26) appearing at the end of this document or by letter. AMSC N/A FSC 1240 X)ISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,- MIL-C-LI848OC 9999906 2004832 7b0 m STANDARD

7、S MILITARY MIL-STD-190 - Engineering Drawing Practices MIL-STD-454 - Standard General Requirements for MIL-STD-810 - Environmental Test Methods MIL-STD-2000 - Standard Requirements for Soldered MIL-STD-2073-1 - Procedures for Development and Electronic Equipment Electrical and Electronic Assemblies

8、Application of Packaging Requirements (IJnless otherwise indicated, copies of federal and military specifications, standards and handbooks are available from: DODSSP - Customer Service, Standardization Documents Order Desk, 700 Robbins Avenue, Bldg 4D, Philadelphia, PA 19111-5094.) 2.1.2 Other Gover

9、nment documents, drawings and publications. The following other Government documents, drawings and publications form a part of this document to the extent specified herein. Unless otherwise specified, the issue shall be those in effect on date of the solicitation. U.S. Army Armament Research Develop

10、ment and Engineering Center (ARDEC) DRAWINGS 11732517 - Circuit Card Assembly - Logic and Reference (Copies of Government drawings and packaging data sheets required by contractors in connection with specific acquisition functions should be obtained from the contracting activity or as directed by th

11、e contracting activity.) 2.2 Order of precedence. In the event of a conflict between the text of this document and the references cited herein (except for related associated detail specifications, specification sheets or MS standards), the text of this document shall take precedence. Nothing in this

12、 document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained control provisions for additional precedence criteria). (See 3. REQUIREMENTS 3.1 Fabrication. The logic and reference circuit card assembly, herein referred to as the assembly, shall be manuf

13、actured in accordance with Drawing 11732517 and drawings pertaining thereto and, when assembled, shall meet the requirements of this specification (see 4.5.1). 2 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,- MIL-C-4848OC 999990b 2004833 bT 3.1.1 F

14、unction. The assembly shall provide the following functions: a. Logic, control and timing signals b. Plus and minus 10 volt dc reference voltages c. Modular reference signals (MR1, MR2) d. AC reference signals (AC Ref. 1, AC Ref. 2) 3.1.2 General specifications. (see 4.6.3) 3.1.2.1 Manufacture and i

15、nspection. The following provisions of MIL-F-13926 apply: a. Dimensions and tolerances b. Effect of protective coating on dimensions (Inorganic c. Part identification and marking d. Workmanship (Including applicable portions of type coating) MIL-STD-2000 and MIL-STD-454, Requirement 9) 3.1.2.2 Stand

16、ards of manufacture. 3.1.2.2.1 Assembly and solderinq. The requirements of MIL-STD-2000 shall apply, as a minimum. 3.1.2.2.2 Interchangeability. The assembly shall be manufactured in accordance with interchangeability requirements as specified in MIL-STD-100. 3.1.3 Ambient conditions. Standard ambie

17、nt conditions shall be as follows: a. Temperature 730 + 18OF 50 percent + 30 percent c. Atmospheric pressure 28.5 + 2.0 -3.0 in. Hg. b. Relative humidity - 3.2 First article. When specified in the contract or purchase order (see 6.2), the contractor shall furnish sample units for first article inspe

18、ction and approval (see 4.4). 3.3 Performance. Unless otherwise specified, the assembly shall meet the performance requirements specified herein under standard ambient conditions of 3.1.3. 3.3.1 AC reference output. With the power sources (items 2.1 and 2.2 of Table I), the loads (items 1.1 and 1.2

19、of Table I), and the signal sources (item 3.1 of Table I) applied to the assembly; then AC REFERENCE 2 shall be a 400 + 1 hertz sine wave 3 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,- - MIL-C-48480C W 9999906 2004834 533 . and shall be + 0.003V

20、rms from the signal source (item 3-11 voltage applied to the assembly. AC reference 1 shall be a 400 + 1 hertz sine wave and shall be +O.O03V rms from the AC REFERENCE-2 and shall be 180 degrees out of phase with AC REFERENCE 2 (see 4.6*1.1). 3-3.2 Modular reference output. With the power sources (i

21、tems 2.1 and 2.2 of Table I), the loads (items 1.3 and 1.4 of Table I), and the signal sources (item 3.1 of Table I) applied to the assembly, the modular REFERENCE 1 signal (MR1) and the modular REFERENCE 2 signal (MR2) shall be each a 400 + 1 hertz square wave as shown in Figure 1. MR1 shall be in

22、pEase with the voltage at pins A26, A27, B27 (ACREF i) and MR2 shall be 180 degrees out of phase with the voltage at pins A26, A27, B27 (see 4.6.1.2). 3.3.3 Plus and minus 1OV dc reference voltage outputs. With the power sources (items 2.1 and 2.2 of Table I), the loads (items 1.5 and 1.6 of Table I

23、), and the signal sources (item 3.1 of Table I) applied to the assembly: the 1OV dc reference voltage shall be 10.000 + 0.01OV dc with respect to ground pins A3 and B3. The -lOV dc-reference voltage shall be -10.000 + 0.01OV dc with respect to ground pins A3 and B3 (see 4.6.1.3). TABLE I. Loads, pow

24、er and signal sources. Item Conditions Characteristics Connections l/ 1.0 1.1 1.2 1.3 1.4 1.5 1,6 1.7 1.8 1.9 1.10 1.11 1.12 1.13 1.14 1.15 Loads Resist ors Resistors Resistors Resistors Res is tors Res is tors Resistors Resistors Res is tors Resistors Re sis tors Res is tors Res is tors Res is tors

25、 Res is tors 1.0 Kilohm - 5% lw 1-0 Kilohm + 5% lw 100 Kilohm + 5% lw 100 Kilohm + 5% lw 1.0 Kilohm + 5% lw 1.0 Kilohm 5% lw 5.1 Kilohm + 5% 1/4w 5.1 Kilohm + 5% 1/4w 5.1 Kilohm + 5% 1/4w 5.1 Kilohm + 5% 1/4w 5.1 Kilohm 5% 1/4w 5.1 Kilohm 5% 1/4w 5.1 Kilohm 5% 1/4w 5.1 Kilohm + 5% 1/4w 5.1 Kilohm -

26、+ 5% 1/4w A26, A27, B27-A3 A28, B28, A29-A3 B9-A3 B25, B26-A3 A7, B7-A3 A24, B24-A3 A4-Al4 A4-Al9 A4-A25 A4-A23 A4-B23 A4-Bl7 A4-Bl8 A4-Bl7 A4-Bll Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-48480 W 9999906 2004835 LiT W MIL-C-4848OC(AR) TABL

27、E I. Loads, power and siqnai sources. (continued) Item Conditions Characteristics Connections - i/ 2.0 Power sources 2.1 15V dc 2.2 -15V dc 2.3 5.25V dc Tolerance: + 0.03OV dc Al, B1 Return A3 Current: 500 ma min Tolerance: + 0.03OV dc A30, B30 Return A3 Ripple: 20mV p-p max Current: 500 ma min Tole

28、rance: + 0.15OV dc A4 Return A13, B13 Ripple: 20mV p-p max Current: 500ma min Ripple: 20mV p-p max I 3.0 Signal sources 3.1 5V rms, Tolerances: + .OO5V rms; B29 Return A3 + 1 Hz - 400 Hz - l/ A3 is A3, B3. A4 is A4, B4. For test purposes, pins A3, B3, A13, B13 may be connected together. c- 1.250 2 0

29、.100 millisecond -I 1 - 7 15.00 2 0.50 vdc + t - 15.00 20.50 udc II FIGURE 1. Modular reference 1 and 2 siqnal waveform. 5 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,- nIL-C-48480C W 9999906 2004836 306 3.3.4 Loqic timinq signals and clock output

30、s. With the power sources (item 2 of Table I) and the signal source (item 3.1 of Table I) applied to the assembly pins A9 and B19 grounded to pins A3, B3, and with pins A2 and 32 switched simultaneously as specified in Table II, the clock output timing signals shall be as shown in Figure 2. TABLE II

31、. Loqic timinq signai. Condition Pin A2 Test Initiate (Pin 82) 1 2 Open Ground Ground Open 3.3.5 Reset siqnal, With the power sources (item 2 of Table I) applied to the assembly and with pin A9 grounded to pins A3, B3 the following requirements shall apply (see 4.6.1.5): a. With pin A2 grounded to p

32、ins A3, B3, the output at pin A8 shall be 5.00 +0.50/-2.60V dc for 25 + 3 seconds. b. With the connection from pin A9 to pins A3, B3, the output at pin A8 shall immediately change to 0.00 to +0.50V dc. 3.3.6 Logic control siqnals, With the power source (item 2.3 of Table I) applied to the assembly a

33、nd with the input conditions of Table III established in any item number order, the corresponding phase logic signals shall be as specified in Table III (see 4.6.1.6). 3.3.7 Fail loqic outputs. With the power source (item 2.3 of Table I), and the loads (items 1.7 throuqh 1.15 of Table I) applied to

34、the assembly, and with the input-logic conditions of Table IV established in any item number order, the Fail Logic outputs ABCV and not K at pins A10 and B14 respectively shall be as specified in Table IV (see 4.6.1.7). 6 Provided by IHSNot for ResaleNo reproduction or networking permitted without l

35、icense from IHS-,-,-SV TE O I 5V TO o- 5v O - TE + 7P sv O TD +15v LL - 15V sv o TECLDCK 5V o TPCLOCK MIL-C-48480C 9999706 2004837 242 = TI 460 HZ I SEC 25 3 SEC 400 HZ nnnnsui PIN A6 A8 B10 88 BU 400 HZ 89 66 85 FIGURE 2. FTS timing diagram. 7 Provided by IHSNot for ResaleNo reproduction or network

36、ing permitted without license from IHS-,-,-H H H w GI 4 w a MIL-C-4848OC 0b 2004636 189 Ln AX nipi o .FI T 4 k Me o o o4 %cl + ao ul .d N Ldm b3.r nid s om ao m .d c Ldm WIN nil4 A om E a 4 H x-TTOO oooor oooro TF-coe 0000 0-000 70000 o a ?I a cu I O Ln O + O O Ln + II T .-I 8 U 2( z O + O O II O Pr

37、ovided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-C-48480C = 999990b 2004839 015 M Y000000000000000000 o .rl 4 .FI a V al ri P d V .ri ri pi pi d -Q ovo aa E: WH in0 II 4 -02 II II v02 o a c *InH o+ II II II 4 orz 9 Provided by IHSNot for ResaleNo re

38、production or networking permitted without license from IHS-,-,-3.4 Environmental. 3.4.1 Tenperature. The assembly shall be capable of oserating as specified herein over the operating temperature range of +40F-to 10F and shall not be damaged when subjected to the storage conditions ranging from -650

39、F to 1600F (see 4.6.2.1 and 4.6.2.2). 3.4.2 Vibration. The assennbly shall be capable of operating as specified herein ater withstanding exposure under the conditions of 3.1.3 to a sinasoidal vibration displacement of .O3 inch double amplitude, 10 - 55 Hz in accordance with Figure 3. Duration of exp

40、osure shall be riat less t5an 80 minutes in each of three mutually perpendicslar axes (see 4.6.2.3). 10 Frequency (Hz) 55 FIGURE 3. Vibration Curve. 10 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-3.4.3 Shock. The assembly shall be capable of oper

41、ating as specified herein after withstanding exposure under the conditions of 3.1.3 to half sine wave shock pulses of 40 + 4 gravity unit (gs) for a duration of 18 + 3 milliseconds (msec) in accordance with Figure 4. applied in both directions along three mutually perpendicular axes (18 shocks). In

42、addition, the assembly shall be capable of withstanding three half sine wave shock pulses of 100.0 + 10.0 gs for a duration of 1.5 + 0.2 msec applied in each direction along three mutually perpendxcular axes (see 4.6.2.4). The assembly shall withstand three shock pulses 40 gs 18 msec 100 gs 1.5 msec

43、 FIGURE 4. Shock Pulse. 3.4.4 Temperature cycling. The assembly shall be capable of operating as specified herein after withstanding exposure to temperature cycling and soaking between the temperatures of -25OF and 1400F in accordance with Figure 5 (see 4.6.2.5). 4. QUALITY ASSURANCE PROVISIONS 4.1

44、Responsibility for inspection. Unless otherwise specified in the contract or purchase order, the contractor is responsible for the performance of all inspection requirements (examinations and tests) as specified herein. Except as otherwise specified in the contract or purchase order, the contractor

45、may use his own or any other facilities suitable for the performance of the inspection requirements specified herein, unless disapproved by the Government. The Government reserves the right to perform any of the inspections set forth in this specification where such inspections are deemed necessary

46、to ensure supplies and services conform to prescribed requirements. 4.1.1 Responsibility for compliance. All items shall meet all requirements of sections 3 and 5. The inspection set forth in this specification shall become a part of the contractors overall inspection system or quality program. The

47、absence of any inspection requirements in the specification shall not relieve the contractor of the responsibility of ensuring that all products or supplies submitted to the Government for acceptance comply with 11 Provided by IHSNot for ResaleNo reproduction or networking permitted without license

48、from IHS-,-,-MIL-C-YB4BOC = 9999906 2004842 bOT f f t J t FIGURE 5. Temperature Cycling. 12 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-all requirements of the contract. Sampling inspection, as part of manufacturing operations, is an acceptable p

49、ractice to ascertain conformance to requirements, however, this does not authorize submission of known defective material, either indicated or actual, nor does it commit the Government to accept defective material. 4.1.2 Inspection equipment. Unless otherwise specified in the contract, the contractor sh