ARMY A-A-59202-1998 CHIPBOARD WAD MATERIAL《锰土材料刨花板》.pdf
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1、- A-A-59202 9?L, 0377222 O38 W A-A- 59202 31 March 1998 SUPERSEDING MIL-C-60607 (AR) 30 September 1966 COMMERCIAL ITEM DESCRIPTION CHIPBOARD, WAD MATERIAL The General Services Administration has authorized the use of this commercial item description as a replacement of MLL-C-60607 for all federal ag
2、encies. 1. SCOPE. used as wad material in blank rifle grenades and small arms cartridges. This CID covers the general requirements for one type of chipboard 2. SALIENT CHARACTERISTICS. 2.1 Materials. Chipboard shall be made of uncoated and unlined paper. 2.2 Color. The chipboard shall contain no col
3、oring additives. 2.3 Dimensions. chipboard shall be 0.030 to 0.033 inch thick and 7/16 k 1/64 inch wide. The length of the chipboard shall be as specified in the contact or order (see 6.2). Unless otherwise specified in the contract or order, the 2.4 Weisht. mil thickness. The weight in pounds per 1
4、000 ft2 shall be 3.24 k 0.32 pounds per 2.5 pH value. the chipboard shall be 6.5 I 1.5 when tested in accordance with industry standards. When using distilled water, the pH of the hot water extract of Beneficial comments (recommendations, additions, deletions) and any pertinent data which may be of
5、use in improving this document should be addressed to: Commander, US Army TACOM-ARDEC, Attn.: AMSTA-AR-EDE-S, Bldg 12, Picatinny Arsenal, NJ 07806-5000 by using the Standardization Document Improvement IProposal (DD Form 1426) appearing at the end of this document or by letter. I AMSC N/A FSC 8140 D
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