ANSI TIA EIA 455-71-A-1999 Procedure to Measure Temperature-Shock Effects on Fiber Optic Components《温度冲击对纤维光学元部件影响的测量方法》.pdf

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1、TIA/EIA STANDARD ANSI/TIA/EIA-455-71A-1999 Approved: October 1, 1999 FOTP-71 Procedure to Measure Temperature- Shock Effects on Fiber Optic Components (Revision of EIA/TIA-455-71) OCTOBER 1999 TELECOMMUNICATIONS INDUSTRY ASSOCIATION e=jj Representing the tdaommunirntioirc industry in wailtion with t

2、he Ekcrmnic Mustria Abam ,TE,a INDUSlRY ASSClATlON Electronic Industries Alliance / Copyright Electronic Industries Alliance Provided by IHS under license with EIANot for ResaleNo reproduction or networking permitted without license from IHS-,-,-NOTICE TIAEU Engineering Standards and Publications ar

3、e designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for his particular need. Exist

4、ence of such Standards and Publications shall not in any respect preclude any member or nonmember of TIA/EIA from manufacturing or selling products not conforming to such Standards and Publications, nor shall the existence of such Standards and Publications preclude their voluntary use by those othe

5、r than TIA/EIA members, whether the standard is to be used either domestically or internationally. Standards and Publications are adopted by TMIA in accordance with the American National Standards institute (ANSI) patent policy. By such action, TIA/EIA does not assume any liability to any patent own

6、er, nor does it assume any obligation whatever to parties adopting the Standard or Publication. This Standard does not purport to address all safety problems associated with its use or all applicable regulatory requirements. It is the responsibility of the user of this Standard to establish appropri

7、ate safety and health practices and to determine the applicability of regulatory limitations before its use. (From Standards Proposal No. 3375-A, formulated under the cognizance of the TIA FO-6.6 Subcommittee on Optical Fibers and Materials.) Published by TELECOMMUNICATIONS INDUSTRY ASSOCIATION 1999

8、 Standards and Technology Department 2500 Wilson Boulevard Arlington, VA 22201 PRICE: Please refer to current Catalog of PUBLICATIONS or call Global Engineering Documents, USA and Canada (1-800-854-7179) International (303-397-7956) EIA ELECTRONIC INDUSTRIES ALLIANCE STANDARDS and ENGINEERING All ri

9、ghts reserved Printed in U.S.A. Copyright Electronic Industries Alliance Provided by IHS under license with EIANot for ResaleNo reproduction or networking permitted without license from IHS-,-,-PLEASE! DONT VIOLATE THE LAW! This document is copyrighted by the TIA and muy not be reproduced without pe

10、rmission. Organizations may obtain permission to reproduce a limited number of copies through entering into a license agreement. For information, contact: Global Engineering Documents 15 Inverness Way East Englewd, CO 801 12-5704 or cai1 U.S.A. and Canada 1 -SOO-854-7 179, International (303) 397-79

11、56 Copyright Electronic Industries Alliance Provided by IHS under license with EIANot for ResaleNo reproduction or networking permitted without license from IHS-,-,-TINElA-455-71 A Procedure to measure temperature-shock effects on fiber optic components Con tents 1 Introduction I 2 Applicable docume

12、nts 2 3 Apparatus . 3 4 Sampling and specimens . 5 5 Procedure . 6 6 Calculations or interpretation of results 1 O 8 Specification information . 12 7 Documentation . 11 Annex A (informative) 13 . i Copyright Electronic Industries Alliance Provided by IHS under license with EIANot for ResaleNo reprod

13、uction or networking permitted without license from IHS-,-,-TINEIA-455-71 A rhis page left blank. Copyright Electronic Industries Alliance Provided by IHS under license with EIANot for ResaleNo reproduction or networking permitted without license from IHS-,-,-TINEIA-455-71 A FOTP-71 Procedure to mea

14、sure ternperature-shock effects on fiber optic components From TIA Standards Proposal Number 3375, formulated under the cognizance of TIA FO-6.6, Subcommittee on Optical Fibers and Materials. This FOTP is part of the series of test procedures included within Recommended Standard TINEIA-455. NOTE - T

15、his FOTP was originally published in TINEIA 455-71 as FOTP-71. I Introduction 1.1 intent This procedure is intended, to define the exposure conditions for testing the resistance of fiber optic components to temperature shock. It also outlines the general approach used for measuring and evaluating ab

16、ility of a fiber optic component to withstand sudden changes in ambient temperature that could arise during shipment, storage, or use. Measurements, inspections, and evaluations are made before and after subjecting the specimens to a specified number of temperature-shock cycles. 1 1.2 Scope This pro

17、cedure describes a method for conducting temperature-shock testing on fiber optic components such as connectors and branching devices. It may also be used for optical fiber cable or optical fiber when specified for U.S. military or similar applications. This procedure is specifically intended to mea

18、sure and evaluate changes that may occur after exposure to a specified number of temperature-shock cycles. It is not intended to monitor product performance on a continuous or semicontinuous basis during temperature soaking. The test for gradual temperature cycling, and monitoring during temperature

19、 excursions, is defined in FOTP-3. 1.3 Types of damage This method is similar to method 107 of MIL-STD-202. 1 Copyright Electronic Industries Alliance Provided by IHS under license with EIANot for ResaleNo reproduction or networking permitted without license from IHS-,-,-TINEIA-455-71 A Common types

20、 of damage or impairment of product function resulting from this test include, but are not limited to, the following: - Excessive temporary or permanent changes in optical transmittance that - Blisters, cracks in materials or accessories, or broken parts. exceed limits specified in the Detail Specif

21、ication. - Inability to mate or un-mate. - Degradation of seals or “O“ rings. 2 Applicable documents Tests or measurement requirements may include, but are not limited to, the following references: TIA /EIA -455 B transducers, sensors, connecting and terminating devices, and other fiber optic compon

22、ents FOTP-3 (TINEIA-455-3A) Procedure to measure temperature cycling effects on optical fibers, optical cable, and other passive fiber optic components Standard test procedure for fiber optic fibers, cables, FOTP-I 3 (TNEIA-455-13) Visual and mechanical Inspection of fibers, cables, connectors, and/

23、or other fiber optic devices FOTP-20 (TINEIA-455-20) Measurement of change in opfical transmittance FOTP-46 (TINEIA-455-46A) Spectral attenuation measurement for long-length, graded-index optical fibers FOTP-53 (EIMIA-455-53A) Attenuation by substitution measurement for multimode graded-index optica

24、l fibers or fiber assemblies used in long length communications systems FOTP-57 (EIMlA-455-57A) Optical fiber end preparation and examination FOTP-59 (EIAITIA-455-59) Measurement of fiber point defects using an OTDR FOTP-61 (EIMIA-455-61 ) Measurement of fiber or cable attenuation using an OTDR FOTP

25、-78 (EIMIA-455-78A) Spectral-attenuation cutback measurement for single- mode optical fibers 2 Copyright Electronic Industries Alliance Provided by IHS under license with EIANot for ResaleNo reproduction or networking permitted without license from IHS-,-,-TINEIA-455-71A FOTP-171 (EIA/TIA-455-171) A

26、ttenuation by substitution measuremenf for short length multimode graded-index and single-mode optical fiber cable assemblies 3 Apparatus The following test equipment is required for this procedure. 3.1 Environmental chambers Provide two environmental chambers, one for low-temperature conditions and

27、 the other for high-temperature conditions. Alternatively, a single chamber may be used if it has two separate compartments with a means of transferring from one compartment to the other. A single chamber without separate compartments may be used if the ramp time for its temperature change can meet

28、the 5-minute maximum for the time to transfer from the high temperature to the low one, and vice versa. NOTE - Access ports for monitoring purposes are not required. If monitoring is required during the test, use FOTP-3. Each chamber or compartment shall be of sufficient size that the presence of te

29、st specimens shall not interfere with maintaining throughout the test a selected ambient temperature inside the chamber within the tolerance indicated in Table 1. The chamber shall be able to reach and maintain the specified ambient temperature within tolerance after a time of not more than 10% of t

30、he exposure time. The exposure time will depend on the heat capacity of the specimen after the specimen has been introduced . The ambient temperature inside each chamber shall be maintained by air circulation. The chamber layout shall be such that, whenever test specimens are in place, air circulati

31、on around the specimens is not obstructed. 3.2 Tem perat u re-record i ng devices Use temperature-recording devices to provide a record of each chamber temperature during a test. It may be desirable to have a multi-channel recorder connected to thermocouples placed around each test specimen. The rec

32、order shall have an accuracy of ?I 2C across the temperature range of the test. Provide each .test specimen having a mass greater than 100 kg with a temperature- sensing device placed as close to the center of the specimen and as far from the specimens exterior as possible. See also 5.3.3 for the ca

33、se of cable on a reel. Table 1 - Schedules for temperature shock for one complete cycle 3 Copyright Electronic Industries Alliance Provided by IHS under license with EIANot for ResaleNo reproduction or networking permitted without license from IHS-,-,-TINEIA-455-71 A 3 4 1 See Table 2 Low temperatur

34、e: See Table 2 23 +2 15 Low temperature: See Table 2 per Detail Specification C per Detail Specification 2 23 I2 15 I I 3 I High temperature: I See Table 2 4 per Detail Specification 23 +2 55 The ambient temperature is as stated in Section 6 Standard Atmospheric Conditions TINEIA -455B ambient condi

35、tion. 3.3 Transmittance/attenuation equipment Provide equipment for measuring the change in optical transmittance or attenuation of the specimens. Unless otherwise specified in the Detail Specification, equipment for measuring optical transmittance or attenuation shall meet requirements of the follo

36、wing FOTP?s based on the type of fiber used with the component. - Multimode fiber: FOTP-20 for transmittance; FOTP-46, FOTP-53, FOTP-59, FOTP-61, or FOTP-171 for attenuation. - Single-mode fiber: FOTP-20 for transmittance; FOTP-53, FOTP-59, FOTP- 61, FOTP-78, or FOTP-171 for attenuation. Equipment u

37、sed for measuring optical transmittance or attenuation shall be stable over the length of time required to perform the test. 4 Copyright Electronic Industries Alliance Provided by IHS under license with EIANot for ResaleNo reproduction or networking permitted without license from IHS-,-,-TINElA-455-

38、71A 0.3 M 10.7 0.7 M 11.5 Table 2 - Mass of test specimen vs. minimum soak time at temperature 2.0 1 .o 4.0 2.0 I I Minimum no. hours at temDerature 1.5 c M I 15 15 MI 100 100 IM l re- and post- I Soaking time, steps I Test sample 1 !onditiming and 31) 8.0 4.0 16 8.0 16 I mass. ka l I I M c 0.3 I I

39、.o I 0.5 3.4 Fixtures As appropriate, provide fixtures for proper, stress-free support of the test specimen(s). See 4. In order to minimize any “heat-sink“ effects that could reduce the severity of the thermal shock, all fixtures shall be as lightweight as possible. Low-conductivity construction mat

40、erials are preferable. If a high-conductivity material is used, cover all points that the test specimens are likely to contact with low-conductivity material. 3.5 Humidity-recording device The room or chamber in which the test specimens will be placed for preconditioning and post-conditioning shall

41、be equipped with a humidity-recording device. 4 Sampling and specimens The test specimen shall be a representative sample of the component(s) to be tested. 4.1 Optical device specimens 5 Copyright Electronic Industries Alliance Provided by IHS under license with EIANot for ResaleNo reproduction or n

42、etworking permitted without license from IHS-,-,-TINEIA-455-71 A Prepare the connector or device for testing by installing it on an optical fiber or cable. Installation shall be in accordance with the manufacturers standard procedures with sealing plugs, etc. Connectors or devices not normally equip

43、ped with an integral coupling device shall be maintained in the simulated mated condition by means of a suitable fixture. Keep the length of the support fiber or cable to a minimum. Specify connectors or devices that are part of the test specimen within the chamber. 4.2 Optical cable fiber specimens

44、 Unless otherwise specified in the Detail Specification, the cable or cable-assembly specimen shall be of sufficient length to allow a minimum of 500 m of it to be placed inside the chamber. Cable and cable-assembly specimens shall be loosely wound (i.e., at minimum tension) on a reel (spool) so as

45、to eliminate any possible effects of the differences in thermal expansionkontraction between the specimen and the reel. Whenever cable is to be tested, an additional sample shall be taken for the purpose of undergoing a thorough physical examination before and after temperature shocking, as required

46、 by 5.14.1; it shall be at least 1 m in length. For multi-fiber cables, the Detail Specification may require that only a sample of the fibers within the cable be measured. 4.3 Optical fiber specimens Unless otherwise specified in the Detail Specification, the fiber specimen shall be of sufficient le

47、ngth to allow a minimum of 500 m of it to be placed inside the chamber. The specimen shall be in the form of a loose coil, or it may be wound at minimum tension on a reel (spool) so as to eliminate any possible effects of the differences in thermal expansioncontraction between the specimen and the r

48、eel. The minimum diameter of the coils and reels shall be 200 mm. if a talced loose coil is to be used as a test specimen, a Im length of untalced fiber, taken from the same reel, shall also be provided for exposure to the test environment along with the loose coil. This short length will serve as t

49、he sample for visual examination as required by 5.14.1. 5 Procedure 6 Copyright Electronic Industries Alliance Provided by IHS under license with EIANot for ResaleNo reproduction or networking permitted without license from IHS-,-,-TINEIA-455-71 A 5.1 Preparation of test specimen Prepare the specimen in accordance with 4 (sampling and specimens) and the relevant transmittance or attenua